US4544577A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Process for metallization of dielectric substrate through holes
Assignee: EF Johnson Co
•
Filing: 1984-04-26
•
Granted: 1985-10-01
•
Expires: 2004-04-26
Abstract
Abstract A method of metallizing through holes in dielectric substrates with a metallizing material comprising forming a hole in the substrate utilizing laser techniques, depositing a layer of a dielectric on the side wall of the hole and then depositing a layer of a metallizing material onto the dielectric layer.
Inventors
- 👤 Ruth A. May
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 21:46
CPC Classifications
C; C04; C04B; C04B41/00; C04B41/009; C04B41/45; C04B41/52; C04B41/80; C04B41/81; C04B41/89; C23; C23C; C23C24/00; H; H05; H05K; H05K3/00; H05K3/0011; H05K3/0017; H05K3/0026; H05K3/0029; H05K3/40; H05K3/4038; H05K3/4053; H05K3/4061; H05K1/00; H05K1/02; H05K1/03; H05K1/0306; H05K2201/00; H05K2201/09; H05K2201/09209; H05K2201/095; H05K2201/09581; H05K2201/09818; H05K2201/09981
Claims Analysis
Total Claims: 23
Claim 1
Independent Claim
106 words
A method of metallizing through holes in dielectric substrates with a metallizing material comprising: forming a through hole in said substrate utilizing laser techniques; depositing a first layer of material on the sidewall of said through hole to form an adhesive bridge between the sidewall of said through hole and the metallizing material; and depositing a second layer of an electrically conductive metallizing material onto said first layer, said first layer comprising a glass filled dielectric material having a thermal coefficient compatible with said substrate and having properties enabling it to bond to both the sidewall of said through holes and said electrically conductive second layer.
Claim 2
Independent Claim
106 words
A method of metallizing through holes in dielectric substrates with a metallizing material comprising: forming a through hole in said substrate utilizing laser techniques; depositing a first layer of material on the sidewall of said through hole to form an adhesive bridge between the sidewall of said through hole and the metallizing material; and depositing a second layer of an electrically conductive metallizing material onto said first layer, said first layer comprising a glass filled dielectric material having a thermal coefficient compatible with said substrate and having properties enabling it to bond to both the sidewall of said through holes and said electrically conductive second layer.
Claim 3
Dependent Claim
16 words
The method of claim 1 including a method of metallizing through holes in dielectric alumina substrates.
Claim 4
Dependent Claim
11 words
The method of claim 1 wherein said metallizing material is copper.
Claim 5
Dependent Claim
13 words
The method of claim 3 wherein said metallizing material is a copper paste.
Claim 6
Dependent Claim
23 words
The method of claim 1 wherein the formation of said through hole forms a glassy slag on the sidewall of said through holes.
Claim 7
Dependent Claim
21 words
The method of claim 5 wherein said first layer forms an adhesive bridge between said glassy slag and said second layer.
Claim 8
Independent Claim
103 words
A method of copper metallization of laser bored through holes in a dielectric substrate, said method comprising: depositing a first layer on the sidewall of said through hole, said first layer comprising a glass filled dielectric material having thermal expansion characteristics compatible with said substrate and being capable of bonding to the sidewall of said through hole and the metallizing copper to form an adhesive bridge between the sidewall of said through hole and the metallizing copper; and depositing a layer of the metallizing copper over said first layer so as to form a conductive path between opposing sides of said dielectric substrate.
Claim 9
Independent Claim
103 words
A method of copper metallization of laser bored through holes in a dielectric substrate, said method comprising: depositing a first layer on the sidewall of said through hole, said first layer comprising a glass filled dielectric material having thermal expansion characteristics compatible with said substrate and being capable of bonding to the sidewall of said through hole and the metallizing copper to form an adhesive bridge between the sidewall of said through hole and the metallizing copper; and depositing a layer of the metallizing copper over said first layer so as to form a conductive path between opposing sides of said dielectric substrate.
Claim 10
Dependent Claim
13 words
The method of claim 7 wherein said dielectric substrate is an alumina substrate.
Claim 11
Dependent Claim
18 words
The method of claim 7 wherein said metallizing copper is a copper paste having glass particles embedded therein.
Claim 12
Dependent Claim
24 words
The method of claim 7 wherein said first layer is a dielectric material used for multi-layer and cross over applications on printed circuit boards.
Claim 13
Independent Claim
54 words
A method of copper metallization of laser bored through holes in an alumina dielectric substrate for a printed circuit board comprising: depositing a glass filled alumina dielectric on the sidewall of said laser bored through hole so as to form an adhesive bridge between the sidewall of said through hole and said metallizing copper.
Claim 14
Independent Claim
54 words
A method of copper metallization of laser bored through holes in an alumina dielectric substrate for a printed circuit board comprising: depositing a glass filled alumina dielectric on the sidewall of said laser bored through hole so as to form an adhesive bridge between the sidewall of said through hole and said metallizing copper.
Claim 15
Independent Claim
98 words
A method of metallizing through holes in dielectric substrates with a metallizing material comprising: forming a through hole in said substrate utilizing laser techniques; depositing a first layer of material on the sidewall of said through hole to form an adhesive bridge between the sidewall of said through hole and the metallizing material; and depositing a second layer of an electrically conductive metallizing material onto said first layer, said first layer comprising a glass filled alumina dielectric material having properties enabling it to bond to both the sidewall of said through holes and said electrically conductive second layer.
Claim 16
Independent Claim
98 words
A method of metallizing through holes in dielectric substrates with a metallizing material comprising: forming a through hole in said substrate utilizing laser techniques; depositing a first layer of material on the sidewall of said through hole to form an adhesive bridge between the sidewall of said through hole and the metallizing material; and depositing a second layer of an electrically conductive metallizing material onto said first layer, said first layer comprising a glass filled alumina dielectric material having properties enabling it to bond to both the sidewall of said through holes and said electrically conductive second layer.
Claim 17
Independent Claim
107 words
A method of metallizing through holes in dielectric alumina substrates with a metallizing material comprising: forming a through hole in said substrate utilizing laser techniques; depositing a first layer of material on the sidewall of said through hole to form an adhesive bridge between the sidewall of said through hole and the metallizing material; and depositing a second layer of an electrically conductive metallizing material onto said first layer, said first layer comprising a glass filled dielectric compatible with said alumina substrate to form a bond therebetween having properties enabling it to bond to both the sidewall of said through holes and said electrically conductive second layer.
Claim 18
Independent Claim
107 words
A method of metallizing through holes in dielectric alumina substrates with a metallizing material comprising: forming a through hole in said substrate utilizing laser techniques; depositing a first layer of material on the sidewall of said through hole to form an adhesive bridge between the sidewall of said through hole and the metallizing material; and depositing a second layer of an electrically conductive metallizing material onto said first layer, said first layer comprising a glass filled dielectric compatible with said alumina substrate to form a bond therebetween having properties enabling it to bond to both the sidewall of said through holes and said electrically conductive second layer.
Claim 19
Independent Claim
104 words
A method of metallizing through holes in dielectric alumina substrates with a metallizing material comprising: forming a through hole in said substrate utilizing laser techniques; depositing a first layer of material on the sidewall of said through hole to form an adhesive bridge between the sidewall of said through hole and the metallizing material; and depositing a second layer of an electrically conductive metallizing material onto said first layer, said first layer comprising a glass filled alumina dielectric having properties enabling it to bond to both the sidewall of said through holes and said electrically conductive second layer and said metallizing material being copper.
Claim 20
Independent Claim
104 words
A method of metallizing through holes in dielectric alumina substrates with a metallizing material comprising: forming a through hole in said substrate utilizing laser techniques; depositing a first layer of material on the sidewall of said through hole to form an adhesive bridge between the sidewall of said through hole and the metallizing material; and depositing a second layer of an electrically conductive metallizing material onto said first layer, said first layer comprising a glass filled alumina dielectric having properties enabling it to bond to both the sidewall of said through holes and said electrically conductive second layer and said metallizing material being copper.
Claim 21
Independent Claim
95 words
A method of copper metallization of laser bored through holes in a dielectric substrate, said method comprising: depositing a first layer on the sidewall of said through hole, said first layer comprising a glass filled alumina dielectric and being capable of bonding to the sidewall of said through hole and the metallizing copper to form an adhesive bridge between the sidewall of said through hole and the metallizing copper; and depositing a layer of the metallizing copper over said first layer so as to form a conductive path between opposing sides of said dielectric substrate.
Claim 22
Independent Claim
95 words
A method of copper metallization of laser bored through holes in a dielectric substrate, said method comprising: depositing a first layer on the sidewall of said through hole, said first layer comprising a glass filled alumina dielectric and being capable of bonding to the sidewall of said through hole and the metallizing copper to form an adhesive bridge between the sidewall of said through hole and the metallizing copper; and depositing a layer of the metallizing copper over said first layer so as to form a conductive path between opposing sides of said dielectric substrate.
Claim 23
Dependent Claim
37 words
The method of claim 6 wherein the glass in said glass filled dielectric from which said first layer is formed is chemically reactive with the glass in said glassy slag on the sidewall of said through holes.
References Cited (Backward Citations)
US2798577A
Cited
US3357856A
Cited
US4020206A
Cited
US4047290A
Cited
US4024629A
Cited
US4131516A
Cited
US4170819A
Cited
US4301192A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1988-09-30 | 1989-04-01 | 1989-10-01 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1992-09-30 | 1993-04-01 | 1993-10-01 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1996-09-30 | 1997-04-01 | 1997-10-01 | $7700.00 | Window Closed / Lapsed |