Apparatus for applying solder to a printed-circuit board

Claim 2

Apparatus for the application of a solder layer to metalized top and bottom surfaces of essentially horizontally advanced circuit boards, comprising: a supply container for molten solder; said supply container having an inlet side and an outlet side for the respective entry and exit of through-passing circuit boards to which there is to be applied the solder; a solder applicator device having a discharge opening and arranged within said supply container and protruding therefrom in the direction of a predetermined feed plane through which travel the circuit boards; means for delivering the solder out of the supply container into the solder applicator device such that a liquid solder wave is formed at said discharge opening of said solder applicator device; said solder applicator device containing side walls having upper edges; said side walls being disposed transversely with respect to the direction of travel of the circuit boards; metallic guide elements arranged at the region of the upper edges of said side walls; said guide elements possessing an adjustable angle of inclination with respect to said feed plane which extends at a certain spacing above said discharge opening of said solder applicator device; the solder of the solder wave flowing over the guide elements back into the supply container; said solder wave possessing a height which exceeds the feed plane of the circuit board; both of said guide elements having ends and possessing guide element portions extending at a preselectable distance and at least approximately parallel to said feed plane and defining an intermediate space between said guide elements and said circuit board when passed through said apparatus; solder limiting elements arranged to extend transversely with respect to the direction of feed of the circuit boards; said solder limiting elements being arranged at the region of the inlet side and the outlet side at the region of the ends of the metallic guide elements and directly above the feed plane; said solder limiting elements, during passage of the circuit boards, bearing upon said circuit boards; and said solder limiting elements serving as limiting means for a solder blanket forming between the inlet side and at the outlet side upon the circuit boards and which solder blanket spreads out upon the upper surface of the circuit boards during through-passage thereof and at least one of which limiting elements also acts as stripper means for stripping solder from the upper surface of the circuit boards; and said solder wave, after entry of said circuit board, being deformed thereby to continuously flow around and wet all sides of the part of the circuit board which is located between said limiting elements by virtue of solder laterally passing to said top surface of said circuit board and laterally returning past said circuit board and with said solder simultaneously wetting said bottom surface of said circuit board by virtue of solder exiting from said discharge opening and filling said intermediate space defined by said circuit board and said guide elements.

Claim 3

The apparatus as defined in claim 1, further including: an additional solder limiting element arranged at the region of the outlet side at the region of an end of the related guide element and directly below the feed plane; and said additional solder limiting element bearing against the circuit boards upon through-passage thereof.

Claim 4

The apparatus as defined in claim 2, further including: means for adjusting at least one of the solder delimiting elements located at the region of the outlet side in a direction substantially perpendicular to the feed plane of the circuit boards.

Claim 5

The apparatus as defined in claim 1, wherein: the guide elements slightly ascend in a direction from the inlet side to the outlet side by being arranged at a spacing from the feed plane which reduces with respect to the feed plane between the inlet side and the outlet side.

Claim 6

The apparatus as defined in claim 4, wherein: the guide element neighboring the inlet side is shorter than the guide element neighboring the outlet side.

Claim 7

The apparatus as defined in claim 1, further including: means for displacing the supply container in conjunction with the solder applicator device in an essentially vertical direction relative to said feed plane.

Claim 8

The apparatus as defined in claim 1, wherein: said solder applicator device possesses a substantially chimney-like configuration.

Claim 9

The apparatus as defined in claim 1, wherein: said printed circuit board is provided with holes; and said solder wave, after entry of said circuit board, being deformed thereby to additionally continuously flow through said holes and to additionally return through said holes.

Claim 10

Apparatus for the application of a solder layer upon metalized surfaces of essentially horizontally advanced circuit boards, comprising: a supply container for molten solder; said supply container having an inlet side and an outlet side for the respective entry and exit of through-passing circuit boards to which there is to be applied the solder; a solder applicator device having a discharge opening and arranged within said supply container and protruding therefrom in the direction of a predetermined feed plane through which travel the circuit boards; means for delivering the solder out of the supply container into the solder applicator device such that a liquid solder wave is formed at said discharge opening of said solder applicator device; said solder applicator device containing side walls having upper edges; said side walls being disposed transversely with respect to the direction of travel of the circuit boards; metallic guide elements arranged at the region of the upper edges of said side walls; said guide elements possessing an adjustable angle of inclination with respect to said feed plane which extends at a certain spacing above said discharge opening of said solder applicator device; the solder of the solder wave flowing over the guide elements back into the supply container; said solder wave possessing a height which exceeds the feed plane of the circuit board; both of said guide elements possessing guide element portions extending at least approximately parallel to said feed plane; solder limiting elements arranged to extend transversely with respect to the direction of feed of the circuit boards; said solder limiting elements being arranged at the region of the inlet side and the outlet side at the region of the ends of the metallic guide elements and directly above the feed plane; said solder limiting elements, during passage of the circuit boards, bearing upon said circuit boards; said solder limiting elements serving as limiting means for a solder blanket forming between the inlet side and at the outlet side upon the circuit boards and which solder blanket spreads out upon the upper surface of the circuit boards during through-passage thereof and at least one of which limiting elements also acts as stripper means for stripping solder from the upper surface of the circuit boards; an additional solder limiting element arranged at the region of the outlet side at the region of an end of the related guide element and directly below the feed plane; said additional solder limiting element bearing against the circuit boards upon through-passage thereof; means for adjusting at least one of the solder delimiting elements located at the region of the outlet side in a direction substantially perpendicular to the feed plane of the circuit boards; each of said solder limiting elements comprising: a core member; a jacket surrounding said core member; said core member being stationary; said core member and said jacket cooperating with one another to form a hollow space therebetween which is effective as an air cushion; and said hollow space confronting the feed plane.

Claim 11

Apparatus for the application of a solder layer upon metalized surfaces of essentially horizontally advanced circuit boards, comprising: a supply container for molten solder; said supply container having an inlet side and an outlet side for the respective entry and exit of through-passing circuit boards to which there is to be applied the solder; a solder applicator device having a discharge opening and arranged within said supply container and protruding therefrom in the direction of a predetermined feed plane through which travel the circuit boards; means for delivering the solder out of the supply container into the solder applicator device such that a liquid solder wave is formed at said discharge opening of said solder applicator device; said solder applicator device containing side walls having upper edges; said side walls being disposed transversely with respect to the direction of travel of the circuit boards; metallic guide elements arranged at the region of the upper edges of said side walls; said guide elements possessing an adjustable angle of inclination with respect to said feed plane which extends at a certain spacing above said discharge opening of said solder applicator device; the solder of the solder wave flowing over the guide elements back into the supply container; said solder wave possessing a height which exceeds the feed plane of the circuit board; both of said guide elements possessing guide element portions extending at least approximately parallel to said feed plane; solder limiting elements arranged to extend transversely with respect to the direction of feed of the circuit boards; said solder limiting elements being arranged at the region of the inlet side and the outlet side at the region of the ends of the metallic guide elements and directly above the feed plane; said solder limiting elements, during passage of the circuit boards, bearing upon said circuit boards; said solder limiting elements serving as limiting means for a solder blanket forming between the inlet side and at the outlet side upon the circuit boards and which solder blanket spreads out upon the upper surface of the circuit boards during through-passage thereof and at least one of which limiting elements also acts as stripper means for stripping solder from the upper surface of the circuit boards; an additional solder limiting element arranged at the region of the outlet side at the region of an end of the related guide element and directly below the feed plane; said additional solder limiting element bearing against the circuit boards upon through-passage thereof; means for adjusting at least one of the solder delimiting elements located at the region of the outlet side in a direction substantially perpendicular to the feed plane of the circuit boards; each of said solder limiting elements comprising: a core member; a jacket surrounding said core member; said core member being stationary; said core member and said jacket cooperating with one another to form a hollow space therebetween which is effective as an air cushion; and said hollow space confronting the feed plane.

Claim 12

The apparatus as defined in claim 9, wherein: said jacket is fixedly arranged with respect to the stationary core member.

Claim 13

The apparatus as defined in claim 9, wherein: said jacket is rotatably arranged with respect to said core member.

Claim 14

The apparatus as defined in claim 9, wherein: said core member possesses a substantially circular segment-shaped configuration; said jacket possesses a substantially circular ring-shaped cross-sectional configuration; said core member being formed of metal and can expand axially at least in one direction; and said jacket being formed of a permanently elastic heat-resistant plastics material which can freely expand in all directions.