Process for forming wiring on substrate

Claim 2

A process for forming a wiring on a substrate which comprises a step of forming a lower lift-off film composed of polyimide-based resin having the unit structural formula X on a wiring substrate and then forming an upper lift-off film composed of polyimide-based resin having the following unit structural formula Y, a step of forming a mask for etching a desired pattern on the upper lift-off film, a step of patterning the upper lift-off film and the lower lift-off film along the pattern of the mask for etching, thereby exposing the surface of the substrate, a step of forming a wiring conductor material on the exposed surface of the substrate and the upper lift-off film by sputtering or vapor deposition and a step of lifting off the upper lift-off film from the lower lift-off film with an etching solution of a mixture of hydrazine and ethylene diamine: ##STR20## wherein R 1 : ##STR21## R 2 : ##STR22##

Claim 3

n is an integer of 15,000 to 30,000, and ##STR23## wherein R 1 : ##STR24## R 2 : ##STR25## n is an integer of 15,000 to 30,000.

Claim 4

n is an integer of 15,000 to 30,000, and ##STR23## wherein R 1 : ##STR24## R 2 : ##STR25## n is an integer of 15,000 to 30,000.

Claim 5

A process according to claim 1, wherein a mask for dry etching is formed on the upper lift-off film, and the upper lift-off film and the lower lift-off film are patterned by dry etching.

Claim 6

A process according to claim 2, wherein a SiO 2 sputtered mask is formed as the mask for dry etching.

Claim 7

A process according to claim 1, wherein the wiring conductor is formed to a thickness equal or substantially equal to the thickness of the lower lift-off film by sputtering or vapor deposition.

Claim 8

A process according to claim 1, wherein the etching solution for the upper lift-off film is a mixture of hydrazine and ethylenediamine having a hydrazine content of 30 to 70% by mole.

Claim 9

A process for forming a multiple layer wiring on a substrate, which comprises forming a first wiring layer according to a step of forming a first lower lift-off film composed of polyimide-based resin having the following unit structural formula X on a wiring substrate, a step of forming a first upper lift-off film composed of polyamide-based resin having the following unit structural formula Y on the first lower lift-off film, a step of forming a first mask for etching in a desired pattern on the first upper lift-off film, a step of patterning the first upper lift-off film and the first lower lift-off film along the pattern of the first mask for etching, thereby exposing the surface of the substrate, a step of forming a wiring conductor material for a first wiring layer to a thickness equal or substantially equal to that of the first lower lift-off film on the exposed surface of the substrate and the first upper lift-off film by sputtering or vapor deposition, and a step of lifting off the first upper lift-off film from the first lower lift-off film with an etching solution of a mixture of hydrazine and ethylene diamine; forming a pedestal for connecting the first wiring layer to a second wiring layer according to a step of forming a second lower lift-off film having the unit structural formula X on the first wiring layer and the first lower lift-off film, a step of forming a second upper lift-off film having the unit structural formula Y on the second lower lift-off film, a step of forming a second mask for etching in a desired pattern on the second upper lift-off film, a step of patterning the second upper lift-off film and the second lower lift-off film along the pattern of the second mask for etching, thereby forming a throughole for connecting the first wiring layer to second wiring layer to be successively formed, a step of vapor deposition or sputtering a wiring conductor material on the throughole and the second upper lift-off film, and a step of lifting off the second upper lift-off film with an etching solution of a mixture of hydraxine and ethylene diamine; and forming a second wiring layer according to a step of forming a third lower lift-off film composed of polyamide-based resin having the unit structural formula X on the pedestal and the second lower lift-off film, a step of forming a third upper lift-off film composed of polyimide-based resin having the unit structural formula Y on the third lower lift-off film, a step of forming a third mask for etching in a desired pattern on the third upper lift-off film, a step of patterning the third upper lift-off film and the third lower lift-off film along the pattern of the third mask for etching, thereby exposing the pedestal for connection, a step of forming a wiring conductor material for a second wiring layer on the pedestal and the third upper lift-off film by sputtering or vapor deposition, and a step of lifting off the third upper lift-off film from the third lower lift-off film with an etching solution of a mixture of hydrazine and ethylene diamine: ##STR26## wherein R 1 : ##STR27## R 2 : ##STR28## n is an integer of 15,000 to 30,000, and ##STR29## wherein R 1 : ##STR30## R 2 : ##STR31## n is an integer of 15,000 to 30,000.

Claim 10

A process for forming a multiple layer wiring on a substrate, which comprises forming a first wiring layer according to a step of forming a first lower lift-off film composed of polyimide-based resin having the following unit structural formula X on a wiring substrate, a step of forming a first upper lift-off film composed of polyamide-based resin having the following unit structural formula Y on the first lower lift-off film, a step of forming a first mask for etching in a desired pattern on the first upper lift-off film, a step of patterning the first upper lift-off film and the first lower lift-off film along the pattern of the first mask for etching, thereby exposing the surface of the substrate, a step of forming a wiring conductor material for a first wiring layer to a thickness equal or substantially equal to that of the first lower lift-off film on the exposed surface of the substrate and the first upper lift-off film by sputtering or vapor deposition, and a step of lifting off the first upper lift-off film from the first lower lift-off film with an etching solution of a mixture of hydrazine and ethylene diamine; forming a pedestal for connecting the first wiring layer to a second wiring layer according to a step of forming a second lower lift-off film having the unit structural formula X on the first wiring layer and the first lower lift-off film, a step of forming a second upper lift-off film having the unit structural formula Y on the second lower lift-off film, a step of forming a second mask for etching in a desired pattern on the second upper lift-off film, a step of patterning the second upper lift-off film and the second lower lift-off film along the pattern of the second mask for etching, thereby forming a throughole for connecting the first wiring layer to second wiring layer to be successively formed, a step of vapor deposition or sputtering a wiring conductor material on the throughole and the second upper lift-off film, and a step of lifting off the second upper lift-off film with an etching solution of a mixture of hydraxine and ethylene diamine; and forming a second wiring layer according to a step of forming a third lower lift-off film composed of polyamide-based resin having the unit structural formula X on the pedestal and the second lower lift-off film, a step of forming a third upper lift-off film composed of polyimide-based resin having the unit structural formula Y on the third lower lift-off film, a step of forming a third mask for etching in a desired pattern on the third upper lift-off film, a step of patterning the third upper lift-off film and the third lower lift-off film along the pattern of the third mask for etching, thereby exposing the pedestal for connection, a step of forming a wiring conductor material for a second wiring layer on the pedestal and the third upper lift-off film by sputtering or vapor deposition, and a step of lifting off the third upper lift-off film from the third lower lift-off film with an etching solution of a mixture of hydrazine and ethylene diamine: ##STR26## wherein R 1 : ##STR27## R 2 : ##STR28## n is an integer of 15,000 to 30,000, and ##STR29## wherein R 1 : ##STR30## R 2 : ##STR31## n is an integer of 15,000 to 30,000.

Claim 11

A process according to claim 6, wherein the etching solution is a mixture of hydrazine and ethyline-diamine having a hydrazine content of 30 to 70% by mole.

Claim 12

A process according to claim 6, wherein all of the masks for etching are masks for dry etching, and after formation of the masks, the upper lift-off films and the lower lift-films are patterned by dry etching.

Claim 13

A process according to claim 8, wherein SiO 2 sputtered films are used as the masks for dry etching.

Claim 14

A process according to claim 8, wherein the dry etching O 2 plasma etching.

Claim 15

A process for forming a wiring on a substrate, which comprises: a step of applying polyimide-based resin having the following unit structural formula X to a thickness of 10 to 20 μm to a wiring substrate, then hardening the resin by heating, thereby forming a lower lift-off film, further applying polyamide-based resin having the following unit structural formula Y thereto, and hardening the resin by heating, thereby forming an upper lift-off film, and step of forming a mast for etching in a desired pattern on the upper lift-off film, a step of patterning the upper lift-off film and the lower lift-off film along the pattern of the mask for etching, thereby exposing the surface of the substrate, a step of forming a wiring conductor material to a thickness of 10 to 20 μm on the exposed surface of the substrate and the upper lift-off film by sputtering or vapor deposition, and a step of lifting off the upper lift-off film from the lower lift-off film with an etching solution of a mixture of hydrazine and ethylene diamine: ##STR32## wherein R 1 : ##STR33## R 2 : ##STR34## n is an integer of 15,000 to 30,000, and ##STR35## wherein R 1 : ##STR36## R 2 ##STR37## n is an integer of 15,000 to 30,000.

Claim 16

A process for forming a wiring on a substrate, which comprises: a step of applying polyimide-based resin having the following unit structural formula X to a thickness of 10 to 20 μm to a wiring substrate, then hardening the resin by heating, thereby forming a lower lift-off film, further applying polyamide-based resin having the following unit structural formula Y thereto, and hardening the resin by heating, thereby forming an upper lift-off film, and step of forming a mast for etching in a desired pattern on the upper lift-off film, a step of patterning the upper lift-off film and the lower lift-off film along the pattern of the mask for etching, thereby exposing the surface of the substrate, a step of forming a wiring conductor material to a thickness of 10 to 20 μm on the exposed surface of the substrate and the upper lift-off film by sputtering or vapor deposition, and a step of lifting off the upper lift-off film from the lower lift-off film with an etching solution of a mixture of hydrazine and ethylene diamine: ##STR32## wherein R 1 : ##STR33## R 2 : ##STR34## n is an integer of 15,000 to 30,000, and ##STR35## wherein R 1 : ##STR36## R 2 ##STR37## n is an integer of 15,000 to 30,000.