EP0133533A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Low thermal expansion resin material for a wiring insulating film.
Assignee: Hitachi Ltd
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Filing: 1984-07-31
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Granted: —
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Expires: 2004-07-31
Abstract
Abstract A resin material comprising a polyimide having as chemical structural unit at least one aromatic ring which can rotate around its molecular axis but has no flexibility at another direction, said polyimide being oriented at least at a uniaxial direction, has a low thermal expansion coefficient and can be shaped together with an inorganic material into one body to give a composite shaped article.
Inventors
- 👤 Shun-Ichi Numata
- 👤 Koji Fujisaki
- 👤 Noriyuki Kinjo
- 👤 Junichi Imaizumi
- 👤 Yoshikatsu Mikami
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-05 12:30
CPC Classifications
C; C08; C08G; C08G73/00; C08G73/06; C08G73/10; C08G73/1039; C08G73/1067; C08G73/1075; C08G73/1082; C08L; C08L79/00; C08L79/04; C08L79/08; H; H10; H10W; H10W20/00; H10W20/40; H10W20/45; H10W20/48; H10W74/00; H10W74/10; H10W74/131; H10W74/137; H10W74/40; H10W74/47; H05; H05K; H05K1/00; H05K1/02; H05K1/03; H05K1/0313; H05K1/032; H05K1/0346; H05K2201/00; H05K2201/01; H05K2201/0137; H05K2201/0154; H05K3/00; H05K3/46; H05K3/4644; H05K3/4673; H05K3/4676; H10P; H10P14/00; H10P14/60; H10P14/63; H10P14/6326; H10P14/6342; H10P14/68; H10P14/683; H10W70/00; H10W70/60; H10W70/67; H10W70/68; H10W70/682; H10W72/00; H10W72/50; H10W72/531; H10W72/536; H10W90/00; H10W90/701; H10W90/751; H10W90/754; Y; Y10; Y10S; Y10S428/00; Y10S428/901; Y10T; Y10T428/00; Y10T428/24; Y10T428/24802; Y10T428/24917; Y10T428/29; Y10T428/2913; Y10T428/31504; Y10T428/31551; Y10T428/31623; Y10T428/31678; Y10T428/31681; Y10T428/31721
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
43 words
A low thermal expansion resin material comprising a polyimide having as achemical structural unit at least one aromatic ring which can rotate around its molecular axis but has no flexibility at another direction, said polyimide being oriented at least at a uniaxial direction.
Claim 2
Dependent Claim
43 words
A low thermal expansion resin material comprising a polyimide having as achemical structural unit at least one aromatic ring which can rotate around its molecular axis but has no flexibility at another direction, said polyimide being oriented at least at a uniaxial direction.
Claim 3
Dependent Claim
76 words
A resin material according to Claim 1, wherein the polyimide has a main chain containing units of the formula : and/or wherein R is an alkyl group, a fluorinated alkyl group, an alkoxy group, a fluorinated alkoxy group, an acyl group, or a halogen atom; ℓ is zero or an integer of 1 to 4; m is zero or an integer of 1 to 2; and n is zero or an integer of 1 to 3.
Claim 4
Dependent Claim
89 words
A resin material according to Claim 1, wherein the polyimide has as repeating unit at least one member selected from the group consisting of: wherein R is an alkyl group, a fluorinated alkyl group, an alkoxy group, a fluorinated alkoxy group, an acyl group, or a halogen atom; i is zero or an integer of 1 to 4; m is zero or an integer of 1 to 2; n is zero or an integer of 1 to 3; and k is zero or an integer of 1 to 3.
Claim 5
Dependent Claim
21 words
A resin material according to any of the Claims 1 to 3,wherein the polyimide is copolymerized or blended with another polymer.
Claim 6
Dependent Claim
41 words
A resin material according to any of the Claims 1 to 4, wherein the polyimide is obtained by polymerization of an aromatic aminodicarboxylic acid derivative, or obtained by reacting an aromatic diamine or aromatic diisocyanate with an aromatic tetracarboxylic acid derivative.
Claim 7
Dependent Claim
34 words
A resin material according to any of the Claims 1 to 5,wherein the low thermal expansion resin material has orientation direction of uniaxial or biaxial when coated or formed into a film or fiber.
Claim 8
Dependent Claim
23 words
A resin material according to Claim 4, wherein the other polymer is a polyimide obtained from a diamine and a tetracarboxylic acid derivative.
Claim 9
Dependent Claim
36 words
A composite shaped article comprising an inorganic material and a low thermal expansion resin material shaped into one body, said low thermal expansion resin material being as defined in any of the Claims 1 to 7.
Claim 10
Dependent Claim
30 words
A composite shaped article according to Claim E, which is a flexible printed circuit obtained by forming metallic wiring on a substrate made from the low thermal expansion resin material.
Claim 11
Dependent Claim
39 words
A composite shaped article according to Claim 8, which is a large-scale integrated circuit (LSI) having a wiring insulating film made from the low thermal expansion resin material between a silicon wafer and wiring, or between wiring and wiring.
Claim 12
Dependent Claim
30 words
A composite shaped article according to Claim 8, which is a large-scale integrated circuit wherein a silicon wafer forming wiring thereon is covered with the low thermal expansion resin material.
References Cited (Backward Citations)
No citation records indexed.
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