Substrate holder for wafers during MBE growth

Claim 2

Apparatus for holding a semi-conductor wafer during heating by radiation comprising: (a) an apertured support means defining spaced-apart faces for receiving a generally-planar backplate and a wafer in spaced-apart substantially parallel relationship to define an enclosed volume through which radiation can pass; (b) said backplate being fabricated of material selected from the group consisting of gallium phosphide, pyrolytic boron nitride and sapphire; and (c) means for retaining said backplate and said wafer in said support means.

Claim 3

The apparatus of claim 1 wherein said enclosed volume is sealed sufficiently to be capable of creating an overpressure of vapor emitted by said wafer during said heating.

Claim 4

The apparatus of claim 1 wherein said support means having a structure for holding said wafer around the periphery of said wafer.

Claim 5

Semi-conductor fabrication apparatus for use in a molecular beam epitaxy (MBE) growth process comprising in combination: (a) an apertured support means defining spaced-apart faces for receiving a generally-planar backplate and a semi-conductor wafer in a spaced-apart, substantially parallel relationship, said means, said backplate and said semi-conductor wafer defining an enclosed volume; (b) said backplate being fabricated of sapphire; and (c) means for retaining said backplate and said wafer in said support means.

Claim 6

Semi-conductor fabrication apparatus for use in a molecular beam epitaxy (MBE) growth process comprising in combination: (a) an apertured support means defining spaced-apart faces for receiving a generally-planar backplate and a semi-conductor wafer in a spaced-apart, substantially parallel relationship, said means, said backplate and said semi-conductor wafer defining an enclosed volume; (b) said backplate being fabricated of sapphire; and (c) means for retaining said backplate and said wafer in said support means.

Claim 7

Apparatus as defined in claim 4 wherein said wafer is fabricated of GaAs.

Claim 8

Apparatus as defined claim 4 wherein said wafer is fabricated of InP.

Claim 9

Apparatus as defined in claim 4 wherein said wafer is fabricated of a compound semi-conductor.

Claim 10

Semi-conductor fabrication apparatus for use in a molecular beam epitaxy (MBE) growth process comprising in combination: (a) an apertured support means defining spaced-apart faces for receiving a generally-planar backplate and a semi-conductor wafer in a spaced-apart, substantially parallel relationship defining an enclosed volume; (b) said backplate being fabricated of gallium phosphide; and (c) means for retaining said backplate and said wafer in said support means.

Claim 11

Semi-conductor fabrication apparatus for use in a molecular beam epitaxy (MBE) growth process comprising in combination: (a) an apertured support means defining spaced-apart faces for receiving a generally-planar backplate and a semi-conductor wafer in a spaced-apart, substantially parallel relationship defining an enclosed volume; (b) said backplate being fabricated of gallium phosphide; and (c) means for retaining said backplate and said wafer in said support means.

Claim 12

Apparatus as defined in claim 8 wherein said wafer is fabricated of GaAs.

Claim 13

Apparatus as defined in claim 8 wherein said wafer is fabricated of InP.

Claim 14

Semi-conductor fabrication apparatus for use in a molecular beam epitaxy (MBE) growth process comprising in combination: (a) an apertured support means defining spaced-apart faces for receiving a generally-planar backplate and a semi-conductor wafer in a spaced-apart, substantially parallel relationship defining an enclosed volume; (b) said backplate being fabricated of pyrolytic boron nitride; and (c) means for retaining said backplate and said wafer in said support means.

Claim 15

Semi-conductor fabrication apparatus for use in a molecular beam epitaxy (MBE) growth process comprising in combination: (a) an apertured support means defining spaced-apart faces for receiving a generally-planar backplate and a semi-conductor wafer in a spaced-apart, substantially parallel relationship defining an enclosed volume; (b) said backplate being fabricated of pyrolytic boron nitride; and (c) means for retaining said backplate and said wafer in said support means.

Claim 16

Apparatus as defined in claim 11 wherein said wafer is fabricated of GaAs.

Claim 17

Apparatus as defined in claim 11 wherein said wafer is fabricated of InP.

Claim 18

In a method for molecular beam epitaxy (MBE) growth of a film on a wafer of a first semiconductor material where the improvement comprises the steps of: (a) forming an apertured support means defining two spaced-apart faces; and (b) forming a backplate of a second material that differs from said first material, said second material being sufficiently transparent to radiation in a wavelength region that is absorbed by said wafer to allow heating of said wafer to a higher temperature than said backplate; then (c) mounting said generally-planar semi-conductor wafer adjacent to one of said two opposed faces of said apertured support means: and (d) mounting said backplate adjacent to the other of said two opposed faces of said apertured support means so that said wafer and said backplate are in a spaced-apart, substantially parallel relationship defining an enclosed volume through which infrared radiation can pass; and then (e) heating said wafer by directing radiation of said predetermined wavelength at said backplate whereby a portion of said radiation passes through said enclosed volume to said wafer.

Claim 19

In a method for molecular beam epitaxy (MBE) growth of a film on a wafer of a first semiconductor material where the improvement comprises the steps of: (a) forming an apertured support means defining two spaced-apart faces; and (b) forming a backplate of a second material that differs from said first material, said second material being sufficiently transparent to radiation in a wavelength region that is absorbed by said wafer to allow heating of said wafer to a higher temperature than said backplate; then (c) mounting said generally-planar semi-conductor wafer adjacent to one of said two opposed faces of said apertured support means: and (d) mounting said backplate adjacent to the other of said two opposed faces of said apertured support means so that said wafer and said backplate are in a spaced-apart, substantially parallel relationship defining an enclosed volume through which infrared radiation can pass; and then (e) heating said wafer by directing radiation of said predetermined wavelength at said backplate whereby a portion of said radiation passes through said enclosed volume to said wafer.

Claim 20

A method as defined in claim 14 when said wafer is of GaAs.

Claim 21

A method as defined in claim 14 employing a backplate of sapphire.

Claim 22

A method as defined in claim 16 wherein said wafer is of GaAs.

Claim 23

A method as defined in claim 16 wherein said backplate is fabricated of material from the group consisting of boron nitride and gallium phosphide.

Claim 24

A method as defined in claim 16 wherein said wafer is fabricated of InP.

Claim 25

A method as defined in claim 16 wherein said wafer is formed of a compound semi-conductor.

Claim 26

In a method for growing a layer on a wafer of semiconductor material of the type wherein radiation is directed at a backplate positioned in an MBE system intermediate said wafer and said incoming radiation, the improvement comprising the steps of: (a) forming said backplate of material that differs from said wafer; and (b) selecting the material of said backplate to be of sufficient transparency to said radiation in a wavelength region that is absorbed by said wafer material so that said wafer is heated by said radiation to a higher temperature than said backplate.

Claim 27

In a method for growing a layer on a wafer of semiconductor material of the type wherein radiation is directed at a backplate positioned in an MBE system intermediate said wafer and said incoming radiation, the improvement comprising the steps of: (a) forming said backplate of material that differs from said wafer; and (b) selecting the material of said backplate to be of sufficient transparency to said radiation in a wavelength region that is absorbed by said wafer material so that said wafer is heated by said radiation to a higher temperature than said backplate.