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US4877481A Expired / Lapsed US ⏱️ 0.0 years remaining

Patterning method by laser scribing

Assignee: Semiconductor Energy Laboratory Co Ltd
•
Filing: 1988-05-27
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Granted: 1989-10-31
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Expires: 2008-05-27
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Abstract

Abstract A laser scribing method is described. A laser beam is deprived of its tail which appears along a groove which is engraved by scribing. The scribing can be performed without forming protrusion along the edge of grooves engraved by the scribing. The depriving of the tail is accomplished by coating the film with a buffer film which is removed after the scribing.

Inventors

  • 👤 Takeshi Fukuda
  • 👤 Shunpei Yamazaki
  • 👤 Akira Sugawara

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-28 18:27
CPC Classifications
B; B23; B23K; B23K26/00; B23K26/18; B23K26/009; B41; B41M; B41M5/00; B41M5/24; G; G02; G02F; G02F1/00; G02F1/01; G02F1/13; G02F1/133; G02F1/1333; G02F1/1343; G02F1/13439; G03; G03F; G03F7/00; G03F7/20; G03F7/2051; G03F7/2053; H; H10; H10F; H10F19/00; H10F19/30; H10F19/31; H10F19/33; H10P; H10P34/00; H10P34/40; H10P34/42; H05; H05K; H05K3/00; H05K3/02; H05K3/027; Y; Y02; Y02E; Y02E10/00; Y02E10/50

Claims Analysis

Total Claims: 14
Claim 1
Independent Claim 89 words
A method of producing patterns on a first film formed on a substrate, the method comprising the steps of: coating said first film with an organic buffer film; irradiating said film with a laser beam through said organic buffer film; removing the irradiated portions of said first film together with the overlying portions of said organic buffer film while leaving said substrate substantially intact to produce said patterns on said first film; removing said organic buffer film with a solvent; and forming a second film on said first film.
Claim 2
Independent Claim 89 words
A method of producing patterns on a first film formed on a substrate, the method comprising the steps of: coating said first film with an organic buffer film; irradiating said film with a laser beam through said organic buffer film; removing the irradiated portions of said first film together with the overlying portions of said organic buffer film while leaving said substrate substantially intact to produce said patterns on said first film; removing said organic buffer film with a solvent; and forming a second film on said first film.
Claim 3
Dependent Claim 13 words
The method of claim 1 wherein said first film is a semiconductor film.
Claim 4
Dependent Claim 15 words
The method of claim 1 wherein said first film is made from a conductive material.
Claim 5
Dependent Claim 16 words
The method of claim 1 wherein said organic buffer film is made from an organic resin.
Claim 6
Dependent Claim 14 words
The method of claim 1 wherein said buffer film is made from a photoresist.
Claim 7
Dependent Claim 13 words
The method of claim 1 wherein said laser beam is a pulsed beam.
Claim 8
Dependent Claim 16 words
The method of claim 6 wherein the wavelength of said laser beam is 400nm or less.
Claim 9
Dependent Claim 15 words
The method of claim 7 wherein said laser beam is emitted from an eximer laser.
Claim 10
Dependent Claim 51 words
In a method of patterning a film, the steps of coating said film with a buffer film made of an organic resin; irradiating said film and said buffer film with a laser beam; and removing the irradiated portions of said film and said buffer film by virtue of the laser energy.
Claim 11
Dependent Claim 51 words
In a method of patterning a film, the steps of coating said film with a buffer film made of an organic resin; irradiating said film and said buffer film with a laser beam; and removing the irradiated portions of said film and said buffer film by virtue of the laser energy.
Claim 12
Dependent Claim 17 words
The method of claim 9 wherein said film underlying said buffer film is made of indium-tin oxide.
Claim 13
Dependent Claim 12 words
The method of claim 10 adapted for manufacture of liquid crystal device.
Claim 14
Dependent Claim 21 words
The method of claim 1 wherein the formation of protrusions on said first film is prevented by said organic buffer film.

References Cited (Backward Citations)

US3665483A Cited
US3787873A Cited
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USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1992-10-30 1993-05-01 1993-10-31 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1996-10-30 1997-05-01 1997-10-31 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2000-10-30 2001-05-01 2001-10-31 $7700.00 Window Closed / Lapsed

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