Method for manufacturing an electrical connection between conductor levels

Abstract

Abstract Disclosed is a method for making connection between conductor layers through a contact via comprising the steps of (a) forming a first conductive pattern on a semiconductor substrate, (b) forming an insulation interlayer so that it covers the first conductive pattern, (c) forming, on the insulation interlayer, a conductive film of which a second conductive pattern is formed, (d) forming a contact hole, at a predetermined location, in both the conductive film and the insulation interlayer, so that the contact hole reaches the first conductive pattern, (e) forming the conductive layer at least in the contact hole, to make an electrical connection between the conductive film and the first conductive pattern, and (f) subsequent to the formation of the conductive film by step (e), selectively etching the conductive film and the conductive layer, to form said second conductive pattern. In an alternative embodiment, the second conductive pattern is obtained by selectively etching the conductive film prior to the formation of the contact hole, and the electrical connection is formed by selective CVD.

Inventors

• 👤 Kei Kurosawa

Bibliographic Details