US4871619A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Electronic components comprising polymide dielectric layers
Assignee: International Business Machines Corp
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Filing: 1986-11-20
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Granted: 1989-10-03
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Expires: 2006-11-20
Abstract
Abstract An electronic component is formed by in situ curing a polymerizable oligomer which is end capped with vinyl and/or acetylenic end groups. The polymerizable oligomer is selected from the group consisting of polyamic acids, polyamic esters, polyisoimides, and mixtures thereof.
Inventors
- 👤 Constance J. Araps
- 👤 Steven M. Kandetzke
- 👤 Mark A. Takacs
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 14:26
CPC Classifications
H; H10; H10P; H10P14/00; H10P14/60; H10P14/68; H10P14/683; H10P14/63; H10P14/6326; H10P14/6342; H10P14/65; H10P14/6516; H10P14/6536; Y; Y10; Y10S; Y10S428/00; Y10S428/913; Y10T; Y10T428/00; Y10T428/31504; Y10T428/31721
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
86 words
An electronic component comprising of a film of dielectric material formed on a substrate by in situ curing and imidizing a layer of a polymerizable oligomer selected from the group consisting of polyamic acids, the corresponding polyamic esters, the corresponding polyisoimides, and mixtures thereof, wherein the end groups of the polymerizable oligomer are end-capped with a vinyl or acetylenic end group and wherein said curing is carried out a temperatures up to about 300° C. to form a polyimide which exhibits low extrinsic and intrinsic stress.
Claim 2
Dependent Claim
86 words
An electronic component comprising of a film of dielectric material formed on a substrate by in situ curing and imidizing a layer of a polymerizable oligomer selected from the group consisting of polyamic acids, the corresponding polyamic esters, the corresponding polyisoimides, and mixtures thereof, wherein the end groups of the polymerizable oligomer are end-capped with a vinyl or acetylenic end group and wherein said curing is carried out a temperatures up to about 300° C. to form a polyimide which exhibits low extrinsic and intrinsic stress.
Claim 3
Dependent Claim
18 words
The electronic component of claim 1 wherein said substrate contains at least one layer of cured polyimide film.
Claim 4
Dependent Claim
18 words
The electronic component of claim 1 wherein said curing and imidization are carried out using a catalytic technique.
Claim 5
Dependent Claim
13 words
The electronic component of claim 3 wherein the catalyst utilized is a peroxide.
Claim 6
Dependent Claim
15 words
The electronic component of claim 1 wherein said curing and imidization is accomplished using radiation.
Claim 7
Dependent Claim
59 words
An electronic component comprising a film of dielectric material formed on the surface thereof by the in situ cure and imidization of a layer of a polymerizable oligomer selected from the group consisting of polyamic acids, polyamic esters, polyisoimides, and mixtures thereof, wherein the end groups of the polymerizable oligomer are end-capped with a vinyl or acetylenic end group.
Claim 8
Dependent Claim
59 words
An electronic component comprising a film of dielectric material formed on the surface thereof by the in situ cure and imidization of a layer of a polymerizable oligomer selected from the group consisting of polyamic acids, polyamic esters, polyisoimides, and mixtures thereof, wherein the end groups of the polymerizable oligomer are end-capped with a vinyl or acetylenic end group.
Claim 9
Dependent Claim
16 words
The electronic component of claim 6 wherein said insitu cure and imidization is accomplished using radiation.
Claim 10
Dependent Claim
22 words
The electronic component of claim 6 wherein said insitu cure and imidization is carried out at temperatures up to about 400? C.
Claim 11
Dependent Claim
19 words
The electronic component of claim 6 wherein said electronic component contains more than one layer of cured polyimide film.
Claim 12
Dependent Claim
18 words
The electronic component of claim 6 wherein said insitu cure and imidization is accomplished using a catalytic technique.
Claim 13
Dependent Claim
13 words
The electronic component of claim 10 wherein the catalyst utilized is a peroxide.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1992-10-02 | 1993-04-03 | 1993-10-03 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1996-10-02 | 1997-04-03 | 1997-10-03 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2000-10-02 | 2001-04-03 | 2001-10-03 | $7700.00 | Window Closed / Lapsed |