Microwave monolithic integrated circuit device

Claim 2

A microwave monolithic integrated circuit device comprising: a semiconductor substrate having a through-hole formed therein; a transistor having at least one high resistivity semiconductor layer forming a heterojunction with said semiconductor substrate; a capacitor including said high resistivity semiconductor layer of said transistor; first and second electrodes formed on opposite sides of said capacitor, said first electrode formed on a lower surface of said semiconductor substrate and within said through-hole; a plurality of semiconductor layers formed on said semiconductor substrate and including said high resistivity semiconductor layer; and an insulating separation region surrounding said capacitor, said insulating separation region having a high resistivity and being in contact with said first and second electrodes.

Claim 3

A microwave monolithic integrated circuit device as claimed in claim 1, wherein said second electrode is an electrode of said transistor.

Claim 4

A microwave monolithic integrated circuit device as claimed in claim 1, wherein said second electrode is electrically coupled to said high resistivity semiconductor layer via at least one of said plurality of semiconductor layers.

Claim 5

A microwave monolithic integrated circuit device as claimed in claim 1, wherein said semiconductor substrate comprises GaAs, and wherein said high resistivity semiconductor layer comprises intrinsic AlGaAs.

Claim 6

A microwave substrate having a lower surface and an upper surface, and having a through-hole formed in said lower surface; a plurality of semiconductor layers formed on said semiconductor substrate and including an active layer; a transistor having at least one high resistivity semiconductor layer, formed on said semiconductor substrate, for forming a heterojunction with said active layer; a capacitor, including a high resistivity semiconductor layer of said transistor; first and second electrodes formed on said lower and upper surfaces, respectively, of said semiconductor substrate and having a predetermined capacitance between said first and second electrodes, said first electrode formed within said through-hole; an insulating separation region surrounding said capacitor and having a high resistivity, said insulating separation region contacting said first and second electrodes.

Claim 7

A microwave substrate having a lower surface and an upper surface, and having a through-hole formed in said lower surface; a plurality of semiconductor layers formed on said semiconductor substrate and including an active layer; a transistor having at least one high resistivity semiconductor layer, formed on said semiconductor substrate, for forming a heterojunction with said active layer; a capacitor, including a high resistivity semiconductor layer of said transistor; first and second electrodes formed on said lower and upper surfaces, respectively, of said semiconductor substrate and having a predetermined capacitance between said first and second electrodes, said first electrode formed within said through-hole; an insulating separation region surrounding said capacitor and having a high resistivity, said insulating separation region contacting said first and second electrodes.

Claim 8

A microwave monolithic integrated circuit device as claimed in claim 5, wherein said transistor is a heterojunction bipolar transistor comprising: a spacer layer corresponding to said resistivity semiconductor layer; a collector layer formed on said spacer layer; a base layer formed on said collector layer; and an emitter layer formed on said base layer.

Claim 9

A microwave monolithic integrated circuit device as claimed in claim 5, wherein said transistor is a heterojunction field-effect transistor comprising: a spacer layer formed on said semiconductor substrate; a channel layer formed on said spacer layer; and an electron supply layer formed on said channel layer, said spacer layer and said channel layer comprising said high resistivity semiconductor layer.

Claim 10

A microwave monolithic integrated circuit device as claimed in claim 5, wherein said second electrode in said capacitor region is electrically connected to said high resistivity semiconductor layer by said plurality of semiconductor layers.

Claim 11

A microwave monolithic integrated circuit device as claimed in claim 5, wherein said transistor is a heterojunction field-effect transistor, and wherein said second electrode forms a drain electrode of said heterojunction field-effect transistor.

Claim 12

A microwave monolithic integrated circuit device as claimed in claim 5, wherein said semiconductor substrate comprises GaAs, and wherein said high resistivity semiconductor layer comprises intrinsic GaAs.

Claim 13

A microwave monolithic integrated circuit device comprising: a semiconductor substrate having a through-hole formed therein and having an upper surface and a lower surface; a high resistivity semiconductor layer forming a heterojunction with said upper surface of said semiconductor substrate; a transistor having a semiconductor active layer formed on said high resistivity semiconductor layer; an insulating separation region surrounding a portion of said high resistivity semiconductor layer; a first capacitor electrode formed on said semiconductor active layer over said portion of said high resistivity semiconductor layer and being in contact with said insulating separation region; and a second capacitor electrode formed on a surface of said portion of said high resistivity semiconductor layer in said through-hole, said second capacitor electrode being formed within said through-hole and being in contact with said insulating separation region, said first and second capacitor electrodes and said portion of said high resistivity semiconductor layer surrounded by said insulating separation region forming a capacitor.

Claim 14

A microwave monolithic integrated circuit device comprising: a semiconductor substrate having a through-hole formed therein and having an upper surface and a lower surface; a high resistivity semiconductor layer forming a heterojunction with said upper surface of said semiconductor substrate; a transistor having a semiconductor active layer formed on said high resistivity semiconductor layer; an insulating separation region surrounding a portion of said high resistivity semiconductor layer; a first capacitor electrode formed on said semiconductor active layer over said portion of said high resistivity semiconductor layer and being in contact with said insulating separation region; and a second capacitor electrode formed on a surface of said portion of said high resistivity semiconductor layer in said through-hole, said second capacitor electrode being formed within said through-hole and being in contact with said insulating separation region, said first and second capacitor electrodes and said portion of said high resistivity semiconductor layer surrounded by said insulating separation region forming a capacitor.

Claim 15

A microwave monolithic integrated circuit device as claimed in claim 11, wherein said first capacitor electrode extends to an electrode of said transistor.

Claim 16

A microwave monolithic integrated circuit device as claimed in claim 12, wherein said first capacitor electrode is electrically coupled to said semiconductor active layer.

Claim 17

A microwave monolithic integrated circuit device as claimed in claim 13, wherein a portion of said semiconductor active layer under said first capacitor electrode includes impurity ions.

Claim 18

A microwave monolithic integrated circuit device as claimed in claim 11, wherein said second capacitor electrode extends to said lower surface of said semiconductor substrate.

Claim 19

A microwave monolithic integrated circuit device comprising: a semiconductor substrate having a through-hole formed therein; a high resistivity semiconductor layer formed on said semiconductor substrate and forming a heterojunction with said semiconductor substrate; a semiconductor active layer formed on said high resistivity semiconductor layer and forming a heterojunction with said high resistivity semiconductor layer; a transistor including at least a first portion of said semiconductor active layer formed on a first portion of said high resistivity semiconductor layer; an insulating separation region surrounding a second portion of said high resistivity semiconductor layer and a second portion of said semiconductor active layer formed thereon, said second portion of said semiconductor active layer being different from first portion of said semiconductor active layer; a first capacitor electrode formed on said second portion of said semiconductor active layer and contacting said insulating separation region; and a second capacitor electrode formed on said second portion of said high resistivity semiconductor layer in said through-hole, said second capacitor electrode being formed within said through-hole and contacting said insulating separation region, a capacitor being formed by said first and second capacitor electrodes and said high resistivity semiconductor layer.

Claim 20

A microwave monolithic integrated circuit device comprising: a semiconductor substrate having a through-hole formed therein; a high resistivity semiconductor layer formed on said semiconductor substrate and forming a heterojunction with said semiconductor substrate; a semiconductor active layer formed on said high resistivity semiconductor layer and forming a heterojunction with said high resistivity semiconductor layer; a transistor including at least a first portion of said semiconductor active layer formed on a first portion of said high resistivity semiconductor layer; an insulating separation region surrounding a second portion of said high resistivity semiconductor layer and a second portion of said semiconductor active layer formed thereon, said second portion of said semiconductor active layer being different from first portion of said semiconductor active layer; a first capacitor electrode formed on said second portion of said semiconductor active layer and contacting said insulating separation region; and a second capacitor electrode formed on said second portion of said high resistivity semiconductor layer in said through-hole, said second capacitor electrode being formed within said through-hole and contacting said insulating separation region, a capacitor being formed by said first and second capacitor electrodes and said high resistivity semiconductor layer.

Claim 21

A microwave monolithic integrated circuit device as claimed in claim 16, wherein said first capacitor electrode is electrically coupled to said second portion of said semiconductor active layer.

Claim 22

A microwave monolithic integrated circuit device as claimed in claim 16, wherein said transistor is a heterojunction field-effect transistor, and wherein said first capacitor electrode forms a drain electrode of said heterojunction field-effect transistor.

Claim 23

A microwave monolithic integrated circuit device, comprising: a substrate having first and second surfaces and having a through-hole formed therein; a spacer layer formed on said substrate and over said through-hole, said spacer layer being an intrinsic semiconductor layer forming a heterojunction with said substrate; a channel layer formed on said spacer layer, said channel layer being an intrinsic semiconductor layer; an electron supplying layer formed on said channel layer; a gate electrode formed on said electron supplying layer for forming a transistor; an insulating separation region surrounding said spacer layer, said channel layer and said electron supplying layer at a different region from said gate electrode, said insulating separating region contacting said through-hole; a first capacitor electrode formed on said electron supplying layer surrounded by said insulating separating region and on said insulating separating region; and a second capacitor electrode formed on said spacer layer surrounded by said insulating separating region and on said insulating separating region, said second capacitor electrode being formed within said through-hole.

Claim 24

A microwave monolithic integrated circuit device, comprising: a substrate having first and second surfaces and having a through-hole formed therein; a spacer layer formed on said substrate and over said through-hole, said spacer layer being an intrinsic semiconductor layer forming a heterojunction with said substrate; a channel layer formed on said spacer layer, said channel layer being an intrinsic semiconductor layer; an electron supplying layer formed on said channel layer; a gate electrode formed on said electron supplying layer for forming a transistor; an insulating separation region surrounding said spacer layer, said channel layer and said electron supplying layer at a different region from said gate electrode, said insulating separating region contacting said through-hole; a first capacitor electrode formed on said electron supplying layer surrounded by said insulating separating region and on said insulating separating region; and a second capacitor electrode formed on said spacer layer surrounded by said insulating separating region and on said insulating separating region, said second capacitor electrode being formed within said through-hole.

Claim 25

A microwave monolithic integrated circuit device, comprising: a substrate having first and second surfaces and having a through-hole formed therein; a spacer layer formed on the second surface of said substrate, said spacer layer being an intrinsic semiconductor layer forming a heterojunction with said substrate; a first layer forming a collector layer formed on said spacer layer; a second layer forming a base layer formed on said first layer; a third layer forming an emitter layer formed on said second layer; an emitter electrode formed on said emitter layer; an insulating separating region surrounding said spacer layer, first layer, second layer, and third layer at a portion different from where said emitter electrode is formed, said insulating separating region being in contact with said through-hole; a first capacitor electrode formed on said first layer surrounded by said insulating separating region and on said insulating separating region; and a second capacitor electrode formed on said spacer layer surrounded by said insulating separation region and formed in and on said insulating separating region, said second capacitor electrode being formed within said through-hole.

Claim 26

A microwave monolithic integrated circuit device, comprising: a substrate having first and second surfaces and having a through-hole formed therein; a spacer layer formed on the second surface of said substrate, said spacer layer being an intrinsic semiconductor layer forming a heterojunction with said substrate; a first layer forming a collector layer formed on said spacer layer; a second layer forming a base layer formed on said first layer; a third layer forming an emitter layer formed on said second layer; an emitter electrode formed on said emitter layer; an insulating separating region surrounding said spacer layer, first layer, second layer, and third layer at a portion different from where said emitter electrode is formed, said insulating separating region being in contact with said through-hole; a first capacitor electrode formed on said first layer surrounded by said insulating separating region and on said insulating separating region; and a second capacitor electrode formed on said spacer layer surrounded by said insulating separation region and formed in and on said insulating separating region, said second capacitor electrode being formed within said through-hole.