Patent US4857484A successfully refreshed from Google Patents.
US4857484A
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US
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Method of making an ion-implanted bonding connection of a semiconductor integrated circuit device
Assignee: Ricoh Co Ltd
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Filing: 1988-02-22
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Granted: 1989-08-15
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Expires: 2008-02-22
Abstract
Abstract A method for forming a bonding connection in a semiconductor integrated cirucit device includes a step of ion implanting a bonding pad of aluminum with silicon atoms before bonding a bonding wire to the bonding pad. The silicon atoms are introduced into the bonding pad only at its surface and its vicinity, so that the bonding pad is provided with an enhanced humidity-resistant characteristic while maintaining the overall electrical resistance of an interconnection system at a low level.
Inventors
- 👤 Masami Nishikawa
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-31 12:06
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/01; H10W72/019; H10W72/012; H10W72/20; H10W72/251; H10W72/29; H10W72/50; H10W72/531; H10W72/536; H10W72/551; H10W72/552; H10W72/5522; H10W72/59; H10W72/90; H10W72/931; H10W72/932; H10W72/934; H10W72/951; H10W72/952; H10W72/981; H10W72/983
Claims Analysis
Total Claims: 2
Claim 1
Independent Claim
62 words
A method for forming a bonding connection in a semiconductor integrated circuit device, comprising: (a) forming a bonding pad of aluminum on a semiconductor substrate over an intervening insulation layer; (b) ion implanting silicon ions into said bonding pad to a depth of about 500 Å from the bonding pad surface; and (c) bonding an electrically conductive wire to said bonding pad.
Claim 2
Independent Claim
62 words
A method for forming a bonding connection in a semiconductor integrated circuit device, comprising: (a) forming a bonding pad of aluminum on a semiconductor substrate over an intervening insulation layer; (b) ion implanting silicon ions into said bonding pad to a depth of about 500 Å from the bonding pad surface; and (c) bonding an electrically conductive wire to said bonding pad.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1992-08-14 | 1993-02-13 | 1993-08-15 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1996-08-14 | 1997-02-13 | 1997-08-15 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2000-08-14 | 2001-02-13 | 2001-08-15 | $7700.00 | Window Closed / Lapsed |