Patent US4851614A successfully refreshed from Google Patents.
US4851614A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Non-occluding mounting hole with solder pad for printed circuit boards
Assignee: Hewlett Packard Development Co LP
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Filing: 1988-08-24
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Granted: 1989-07-25
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Expires: 2008-08-24
Abstract
Abstract A novel solder pad configuration for printed circuit boards is disclosed which is resistant to solder occlusion upon wave soldering. On the solder side of the circuit board the solder pad is substantially C-shaped and partially surrounds a non-plated through-hole. Via holes prvide electrical connection between the pad on the solder side of the board and the corresponding pad on the component side of the circuit boards. The invention is particularly applicable to the chassis ground mounting holes of PCB's.
Inventors
- 👤 Wayne P. Duncan, Jr.
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 16:42
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/0094; H05K1/00; H05K1/02; H05K1/0213; H05K1/0215; H05K1/11; H05K1/115; H05K1/116; H05K3/30; H05K3/32; H05K3/34; H05K3/3465; H05K3/3468; H05K2201/00; H05K2201/09; H05K2201/09209; H05K2201/09372; H05K2201/09463; H05K2201/09654; H05K2201/0979; H05K2201/09818; H05K2201/099; H05K2201/10; H05K2201/10227; H05K2201/10409; H05K2201/10613; H05K2201/10742; H05K2201/1075; H05K2201/10757; H05K2203/00; H05K2203/04; H05K2203/044; H05K2203/045; H05K3/325; H05K3/40; H05K3/42; H05K3/429; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49147; Y10T29/49149; Y10T29/49169
Claims Analysis
Total Claims: 14
Claim 1
Independent Claim
69 words
A laminated printed circuit board comprising: a plurality of conductor-containing layers; a C-shaped solder pad on an external layer of the circuit board disposed about a first hole through the circuit board; a second hole through the circuit board passing through the C-shaped solder pad, said second hole having a plated bore which electrically interconnects the C-shaped solder pad with selected conductors on other layers of the circuit board.
Claim 2
Dependent Claim
69 words
A laminated printed circuit board comprising: a plurality of conductor-containing layers; a C-shaped solder pad on an external layer of the circuit board disposed about a first hole through the circuit board; a second hole through the circuit board passing through the C-shaped solder pad, said second hole having a plated bore which electrically interconnects the C-shaped solder pad with selected conductors on other layers of the circuit board.
Claim 3
Dependent Claim
48 words
A printed circuit board comprising: a solder pad surrounding a first hole through the circuit board; via holes through the solder pad; and, solder mask covering a portion of the solder pad such that the unmasked portion of the solder pad is substantially C-shaped about the first hole.
Claim 4
Dependent Claim
48 words
A printed circuit board comprising: a solder pad surrounding a first hole through the circuit board; via holes through the solder pad; and, solder mask covering a portion of the solder pad such that the unmasked portion of the solder pad is substantially C-shaped about the first hole.
Claim 5
Dependent Claim
41 words
A printed circuit board comprising a solder pad disposed about and displaced from a hole through the circuit board and solder mask covering a portion of the solder pad such that the unmasked portion of the solder pad is substantially C-shaped
Claim 6
Dependent Claim
41 words
A printed circuit board comprising a solder pad disposed about and displaced from a hole through the circuit board and solder mask covering a portion of the solder pad such that the unmasked portion of the solder pad is substantially C-shaped
Claim 7
Independent Claim
86 words
A method of assembling a printed circuit board comprising: installing electrical components into a laminated multilayered printed circuit board; providing a substantially C-shaped solder pad disposed about a first hole through the circuit board with a second plated through-hole through the laminated circuit board at the location of the C-shaped solder pad; soldering the electrical components onto the circuit board using a wave-soldering technique whereby the wave of molten solder is in intimate contact with the leads on the electrical components and the C-shaped solder pad.
Claim 8
Independent Claim
86 words
A method of assembling a printed circuit board comprising: installing electrical components into a laminated multilayered printed circuit board; providing a substantially C-shaped solder pad disposed about a first hole through the circuit board with a second plated through-hole through the laminated circuit board at the location of the C-shaped solder pad; soldering the electrical components onto the circuit board using a wave-soldering technique whereby the wave of molten solder is in intimate contact with the leads on the electrical components and the C-shaped solder pad.
Claim 9
Dependent Claim
67 words
A printed circuit board having a first side and a second side comprising: an electrical conductor on the second side of the circuit board; a C-shaped solder pad on the first side of the circuit board disposed about a mounting hole through the circuit board; and a plated through-hole electrically interconnecting the C-shaped solder pad to the electrical conductor on the second side of the circuit board.
Claim 10
Dependent Claim
67 words
A printed circuit board having a first side and a second side comprising: an electrical conductor on the second side of the circuit board; a C-shaped solder pad on the first side of the circuit board disposed about a mounting hole through the circuit board; and a plated through-hole electrically interconnecting the C-shaped solder pad to the electrical conductor on the second side of the circuit board.
Claim 11
Dependent Claim
96 words
A printed circuit board having a first side and a second side comprising: a mounting hole through the circuit board; a C-shaped solder pad on the first side of the circuit board disposed about the mounting hole through the circuit board; a pad of conductive material on the second side of the circuit board disposed about the mounting hole through the circuit board; and, a plurality of plated through-holes passing through the C-shaped solder pad and electrically interconnecting the C-shaped solder pad to the pad of conductive material on the second side of the circuit board.
Claim 12
Dependent Claim
96 words
A printed circuit board having a first side and a second side comprising: a mounting hole through the circuit board; a C-shaped solder pad on the first side of the circuit board disposed about the mounting hole through the circuit board; a pad of conductive material on the second side of the circuit board disposed about the mounting hole through the circuit board; and, a plurality of plated through-holes passing through the C-shaped solder pad and electrically interconnecting the C-shaped solder pad to the pad of conductive material on the second side of the circuit board.
Claim 13
Dependent Claim
62 words
An electronic assembly comprising: an electrically conductive chassis; a printed circuit board comprising a substantially C-shaped solder pad disposed about a hole through the circuit board; mounting means attaching the printed circuit board to the chassis, said mounting means passing through the hole having a substantially C-shaped solder pad disposed about it and electrically bonding the chassis to the C-shaped solder pad.
Claim 14
Dependent Claim
62 words
An electronic assembly comprising: an electrically conductive chassis; a printed circuit board comprising a substantially C-shaped solder pad disposed about a hole through the circuit board; mounting means attaching the printed circuit board to the chassis, said mounting means passing through the hole having a substantially C-shaped solder pad disposed about it and electrically bonding the chassis to the C-shaped solder pad.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1992-07-24 | 1993-01-23 | 1993-07-25 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1996-07-24 | 1997-01-23 | 1997-07-25 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2000-07-24 | 2001-01-23 | 2001-07-25 | $7700.00 | Window Closed / Lapsed |