US3567844A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Terminal pad for perforated circuit boards and substrates
Assignee: McDonnell Douglas Corp
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Filing: 1969-06-23
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Granted: 1971-03-02
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Expires: 1989-06-23
Abstract
Abstract Printed terminal pad structure is formed on a circuit board or substrate surface around and adjacent to the periphery of a terminal pin opening, the pad structure being characterized by a radially extending slot of appropriate width therein to prevent the pin opening from being plugged during a subsequent dip soldering process when a coating of solder is applied to the exposed surface of the pad structure. A solder-coated terminal pad around a solder-free terminal pin opening is thus obtained from the printed terminal pad structure.
Inventors
- 👤 Ludwig L Krcmar
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-29 09:00
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/3447; H05K1/00; H05K1/02; H05K1/11; H05K1/115; H05K1/116; H05K1/09; H05K1/092; H05K2201/00; H05K2201/09; H05K2201/09209; H05K2201/09372; H05K2201/09463; H05K2203/00; H05K2203/04; H05K2203/044; H05K3/3465; H05K3/3468
Claims Analysis
Total Claims: 7
Claim 1
Independent Claim
95 words
A terminal pad structure for a perforated printed circuit substrate including a terminal pin opening therein, said pad structure comprising: a printed circuit layer on a surface of said substrate, said circuit layer including a printed pad having a pad opening aligned with said terminal pin opening in said substrate; and a slot extending laterally and vertically through said printed pad and connecting said pad opening with said surface of said substrate surrounding said printed pad, said slot having a width which prevents said pin opening from being plugged during a subsequent solder application process.
Claim 2
Dependent Claim
95 words
A terminal pad structure for a perforated printed circuit substrate including a terminal pin opening therein, said pad structure comprising: a printed circuit layer on a surface of said substrate, said circuit layer including a printed pad having a pad opening aligned with said terminal pin opening in said substrate; and a slot extending laterally and vertically through said printed pad and connecting said pad opening with said surface of said substrate surrounding said printed pad, said slot having a width which prevents said pin opening from being plugged during a subsequent solder application process.
Claim 3
Dependent Claim
21 words
The invention as defined in claim 1 including a coating of solder on the exposed surfaces of said printed circuit layer.
Claim 4
Dependent Claim
33 words
The invention as defined in claim 1 wherein said pad opening is larger than said pin opening whereby a relatively small spacing is provided between the peripheries of said pad and pin openings.
Claim 5
Dependent Claim
21 words
The invention as defined in claim 3 including a coating of solder on the exposed surfaces of said printed circuit layer.
Claim 6
Dependent Claim
31 words
The inveNtion as defined in claim 1 wherein said slot extends in a generally radial direction from the center of said pad opening and is a gap of relatively uniform width.
Claim 7
Dependent Claim
21 words
The invention as defined in claim 5 including a coating of solder on the exposed surfaces of said printed circuit layer.
References Cited (Backward Citations)
No citation records indexed.
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1974-03-01 | 1974-08-31 | 1975-03-02 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1978-03-01 | 1978-08-31 | 1979-03-02 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1982-03-01 | 1982-08-31 | 1983-03-02 | $7700.00 | Window Closed / Lapsed |