Apparatus for the application of a conductive adhesive medium to a printed circuit board

Claim 1

An apparatus for the application of a conductive adhesive medium in a fluid state, such as solder, to the side printed with circuitry of a board bearing electronic components, said apparatus comprising a hollow nozzle standing in a supply tank for the adhesive medium, and an obliquely rising conveyor belt for one circuit board at a time, wherein the upper end of the hollow nozzle possesses two overflow edges arranged perpendicular to the direction of transportation for the formation of a wave, through the crest of which the side of the circuit board, previously moistened with a flux, is passed, wherein close to the leading overflow edge with respect to the transportation direction, an adjustable damming means is arranged for the temporary raising of the fluid level such that the crest of the wave is shifted from above the nozzle toward said leading overflow edge, said damming means comprising a channel arranged perpendicular to the direction of transportation and means for pumping the fluid adhesive medium upwards out of the channel.

Claim 2

An apparatus for the application of a conductive adhesive medium in a fluid state, such as solder, to the side printed with circuitry of a board bearing electronic components, said apparatus comprising a hollow nozzle standing in a supply tank for the adhesive medium, and an obliquely rising conveyor belt for one circuit board at a time, wherein the upper end of the hollow nozzle possesses two overflow edges arranged perpendicular to the direction of transportation for the formation of a wave, through the crest of which the side of the circuit board, previously moistened with a flux, is passed, wherein close to the leading overflow edge with respect to the transportation direction, an adjustable damming means is arranged for the temporary raising of the fluid level such that the crest of the wave is shifted from above the nozzle toward said leading overflow edge, said damming means comprising a channel arranged perpendicular to the direction of transportation and means for pumping the fluid adhesive medium upwards out of the channel.

Claim 7

An apparatus for the application of a conductive adhesive medium in a fluid state, such as solder, to the side printed with circuitry of a board being electronic components, said apparatus comprising a hollow nozzle standing in a supply tank for the adhesive medium, and an obliquely rising conveyor belt for one circuit board at a time, wherein the upper end of the hollow nozzle possesses two overflow edges arranged perpendicular to the direction of transportation for the formation of a wave, through the crest of which the side of the circuit board, previously moistened with a flux, is passed, wherein close to the leading overflow edge with respect to the transportation direction, an adjustable damming means is arranged for the temporary raising of the fluid level such that the crest of the wave is shifted from above the nozzle toward said leading overflow edge, said damming means comprising a channel arranged perpendicular to the direction of transportation and means for pumping the fluid adhesive medium upwards out of the channel, said channel being adjustable in height with respect to the nozzle.

Claim 8

An apparatus for the application of a conductive adhesive medium in a fluid state, such as solder, to the side printed with circuitry of a board being electronic components, said apparatus comprising a hollow nozzle standing in a supply tank for the adhesive medium, and an obliquely rising conveyor belt for one circuit board at a time, wherein the upper end of the hollow nozzle possesses two overflow edges arranged perpendicular to the direction of transportation for the formation of a wave, through the crest of which the side of the circuit board, previously moistened with a flux, is passed, wherein close to the leading overflow edge with respect to the transportation direction, an adjustable damming means is arranged for the temporary raising of the fluid level such that the crest of the wave is shifted from above the nozzle toward said leading overflow edge, said damming means comprising a channel arranged perpendicular to the direction of transportation and means for pumping the fluid adhesive medium upwards out of the channel, said channel being adjustable in height with respect to the nozzle.

Claim 9

An apparatus for the application of a conductive adhesive medium in a fluid state, such as solder, to the side printed with circuitry of a board bearing electronic components, said apparatus comprising a hollow nozzle standing in a supply tank for the adhesive medium, and an obliquely rising conveyor belt for one circuit board at a time, wherein the upper end of the hollow nozzle possesses two overflow edges arranged perpendicular to the direction of transportation for the formation of a wave, through the crest of which the side of the circuit board, previously moistened with a flux, is passed, wherein close to the leading overflow edge with respect to the transportation direction, an adjustable damming means is arranged for the temporary raising of the fluid level such that the crest of the wave is shifted from above the nozle toward said leading overflow edge, said damming means comprising a channel arranged perpendicular to the direction of transportation and defining a portion of a circle in cross section and means for pumping the fluid adhesive medium upwards out of the channel comprising a rolling body, rotatably journalled in the longitudinal direction of the channel and driven, with a non-round transverse section.

Claim 10

An apparatus for the application of a conductive adhesive medium in a fluid state, such as solder, to the side printed with circuitry of a board bearing electronic components, said apparatus comprising a hollow nozzle standing in a supply tank for the adhesive medium, and an obliquely rising conveyor belt for one circuit board at a time, wherein the upper end of the hollow nozzle possesses two overflow edges arranged perpendicular to the direction of transportation for the formation of a wave, through the crest of which the side of the circuit board, previously moistened with a flux, is passed, wherein close to the leading overflow edge with respect to the transportation direction, an adjustable damming means is arranged for the temporary raising of the fluid level such that the crest of the wave is shifted from above the nozle toward said leading overflow edge, said damming means comprising a channel arranged perpendicular to the direction of transportation and defining a portion of a circle in cross section and means for pumping the fluid adhesive medium upwards out of the channel comprising a rolling body, rotatably journalled in the longitudinal direction of the channel and driven, with a non-round transverse section.