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US4019671A Expired / Lapsed US ⏱️ 0.0 years remaining

Method for dip-soldering semiconductor components

Assignee: BBC Brown Boveri AG Switzerland
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Filing: 1976-03-11
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Granted: 1977-04-26
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Expires: 1996-03-11
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Abstract

Abstract A method and apparatus for dip-soldering semiconductor components is disclosed as including a temperature-controlled solder bath and a gas supply line disposed along one edge of the upper surface of the bath. Hydrogen and nitrogen gases are selectively supplied and discharged from nozzles of the supply line by means of a two-way control valve, and the supply line is vertically, horizontally, and rotatably adjustable with respect to the bath container and the bath surface so as to precisely locate the position of the gas nozzles with respect thereto.

Inventors

  • 👤 Altan Akyuerek

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-31 21:07
CPC Classifications
H; H10; H10W; H10W99/00; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/3465; H05K3/3468; H05K3/3489

Claims Analysis

Total Claims: 3
Claim 1
Independent Claim 49 words
A method of dip-soldering semicondictor components, in particular components mass-produced with the use of comb elements, comprising the steps of: homogeneously sweeping the surface of a solder bath with a hydrogen gas flame; and dipping said semiconductor components and contact elements, in a flux-free state, into said solder bath.
Claim 2
Independent Claim 49 words
A method of dip-soldering semicondictor components, in particular components mass-produced with the use of comb elements, comprising the steps of: homogeneously sweeping the surface of a solder bath with a hydrogen gas flame; and dipping said semiconductor components and contact elements, in a flux-free state, into said solder bath.
Claim 3
Dependent Claim 38 words
A method as set forth in claim 1, additionally comprising the steps of: passing nitrogen gas through the hydrogen gas supply line and exit nozzles; and shutting off the nitrogen gas flow prior to igniting the hydrogen gas.

References Cited (Backward Citations)

GB567286A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1980-04-25 1980-10-25 1981-04-26 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1984-04-25 1984-10-25 1985-04-26 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1988-04-25 1988-10-25 1989-04-26 $7700.00 Window Closed / Lapsed

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