Multi-layered ceramic capacitor

Claim 2

a multi-layered ceramic capacitor comprising in combination: (a) a plurality of ceramic thin film pieces having been independently fired,; (b) joining layers formed on said ceramic thin film pieces in which those are alternatively laminated therein, said ceramic thin film piece having been independently fired, and being sandwiched between two joining layers sandwiching said joining layer, said joining layer consisting essentially of; (i) glass material layer and/or (ii) conductive layer, and said conductive material layer being in a pre-determined inner electrode pattern, one or both of the glass material layer and conductive material layer functioning to bind the two ceramic film pieces sandwiching said glass and/or conductive material layer being formed from conductive paste or conductive binder material.

Claim 3

The capacitor as claimed in claim 1 wherein said conductive material layers being enclosed in the ceramic thin film pieces and glass material layers, and being not exposed to the outside of the capacitor.

Claim 4

The capacitor as claimed in claim 1, wherein said ceramic thin film pieces have dielectric loss of lower than 0.01, and being less than 200 micro-meter in thickness.

Claim 5

The multi-layered ceramic capacitor as claimed in claim 1, wherein said conductive material layer consisting essentially of silver, copper, palladium and the combination thereof.

Claim 6

a multi-layered ceramic capacitor comprising in combination: (a) dielectric layers and conductive material layers alternatively layered therein, said dielectric layer being formed from very thin ceramic plate which has been independently fired, said conductive material layer being formed on one or both surface of said ceramic plate, and said ceramic plates with the conductive layer (s) formed on the surface (s) thereof being mutually bonded by a joining, layer consisting essentially of glass material.

Claim 7

a multi-layered ceramic capacitor comprising in combination: (a) dielectric layers and conductive material layers alternatively layered therein, said dielectric layer being formed from very thin ceramic plate which has been independently fired, said conductive material layer being formed on one or both surface of said ceramic plate, and said ceramic plates with the conductive layer (s) formed on the surface (s) thereof being mutually bonded by a joining, layer consisting essentially of glass material.

Claim 8

The multi-layered ceramic capacitor as claimed in claim 5, wherein the each couple of the conductive material layers sandwiching said glass material joining layer are equal in their potential by conductive coupling therewith together.

Claim 9

A method of the production of the multi-layered ceramic capacitor of claim 1 wherein comprises: (A) preparing predetermined number of fired ceramic film pieces, the ceramic material being dielectric material such as alumina, barium titanate and the like; (B) forming predetermined conductive patterns of thick coatings of conductive material paste on the surfaces of said fired ceramic film pieces by printing said patterns of conductive electroding base metal paste on the said plates by a printing techniques such as silk screen printing; (C) forming a glass paste material layer over each of the conductive patterns formed on said ceramic film pieces and the whole surfaces of the ceramic film pieces by applying a paste consisting of glass powder and binder medium to the whole surface including the conductive patterns, of said ceramic film pieces. (D) stacking at least two of such formed ceramic film pieces with said conductive patterns and said glass material layer, (E) further positioning two fired ceramic film pieces each on the most top and on the bottom of the resulting stack. (F) firing such formed stack at relatively lower temperature so as to melt the glass paste material in said glass paste layer to join together the two adjacent ceramic layers sandwiching the corresponding glass paste layer to provide a multi-layered capacitor with enclosed inner electrodes.

Claim 10

A method of preparation of a multi-layered ceramic capacitor of claim 5, which comprises: (A) firing dielectric material films to prepare number of fired ceramic thin film pieces; (B) applying conductive electroding paste consisting essentially of metal powder and binding medium on the prepared film pieces to form predetermined patterns as inner electrodes; (C) further applying glass past consisting essentially of glass powder and binding medium over the surface of each the electroding film pieces to form a glass material layer on the whole surfaces of said prepared film pieces; (D) stacking at least two of thus formed film pieces; (E) heating thus formed stack comprising the fired ceramic film pieces, the electroding enclosed in the glass material layer and the ceramic film layer, at relatively lower temperature so as to melt the glass material thereby to form binding between the thus formed film pieces.

Claim 11

A multi-layered ceramic capacitor comprising, in combination: fired ceramic film pieces, electroding layers and glass material layers, said fired ceramic material having dielectric loss of lower than 0.01, said electroding layer being formed from conductive paste consisting essentially of metal powder and binding medium, said glass material layer being formed by applying glass powder paste consisting essentially of glass powder and binding medium to the surface of the corresponding ceramic film pieces and melting the glass powder paste to form a glass layer.

Claim 12

A multi-layered ceramic capacitor comprising, in combination: fired ceramic film pieces, electroding layers and glass material layers, said fired ceramic material having dielectric loss of lower than 0.01, said electroding layer being formed from conductive paste consisting essentially of metal powder and binding medium, said glass material layer being formed by applying glass powder paste consisting essentially of glass powder and binding medium to the surface of the corresponding ceramic film pieces and melting the glass powder paste to form a glass layer.

Claim 13

The multi-layered capacitor of claim 9, wherein the electroding pattern is enclosed among the glass material layer and the ceramic film piece.

Claim 14

The multi-layered capacitor of claim 10, wherein the ceramic film pieces have thickness of lower than 130 micrometer.

Claim 15

The multi-layered capacitor of claim 9, wherein the metal powder for the electroding pattern is selected from silver, copper, palladium and the combination thereof.

Claim 16

The multi-layered capacitor of claim 9, wherein the electroding pattern is formed by printing technique such as screen printing to form thick coating on the surface of the film pieces.

Claim 17

The multi-layered capacitor of claim 9, wherein the glass material layer is formed by applying the glass paste over the surfaces of the electroding patterns and the ceramic film pieces.

Claim 18

The multi-layered capacitor of claim 9, wherein one or the both of the elecrtroding layer and the glass material layer can act to bind the film pieces each the other.

Claim 19

The multi-layered capacitor of claim 9, wherein the dielectric material of the ceramic film pieces is selected from alumina, mullite, steatite, forsterite, berria, titania, aluminium nitride, barrium titanate.

Claim 20

The multi-layered capacitor of claim 16, wherein the electric material is the composition which is consisting mainly of alumina, and may contain SiO 2 and MgO.