Abstract In a semiconductor photoelectric conversion device in which a first light-transparent conductive layer for an electrode is formed on a light transparent substrate, a non-single-crystal semiconductor laminate member having formed therein at least one PIN or PN junction is formed on the first conductive layer and a second conductive layer for another electrode is formed on the semiconductor laminate member, the boundary between the substrate and the first conductive layer is formed by a first uneven surface including a number of surfaces of convexities, each having triangular, trapezoidal or like cross-section the base of which extend along the substrate surface and the two lateral edges of which are inclined thereto and make an angle φ to each other, where 45°≦φ<120°. The boundary between the first conductive layer and the semiconductor laminate member is formed by a second uneven surface corresponding to the first one. Further, the second conductive layer is reflective, and the boundary between the semiconductor laminate member and the second conductive layer is formed by a third uneven surface.
A method of manufacturing photoelectric conversion devices comprising the steps of: forming first convexities on a surface of a silicon crystalline substrate; pressing said surface having said first convexities against a sheet-like substrate to produce second convexities on said sheet-like substrate corresponding to the inversion of said first convexities; subsequently forming a first electrode on said sheet-like substrate, said first electrode having imparted thereto third convexities corresponding to said first convexities; subsequently depositing a photosensitive semiconductor film on said first electrode, said photosensitive semiconductor film having fourth convexities imparted thereto corresponding to said first convexities; and forming a second electrode on said photosensitive semiconductor film.
Claim 2
Independent Claim
105 words
A method of manufacturing photoelectric conversion devices comprising the steps of: forming first convexities on a surface of a silicon crystalline substrate; pressing said surface having said first convexities against a sheet-like substrate to produce second convexities on said sheet-like substrate corresponding to the inversion of said first convexities; subsequently forming a first electrode on said sheet-like substrate, said first electrode having imparted thereto third convexities corresponding to said first convexities; subsequently depositing a photosensitive semiconductor film on said first electrode, said photosensitive semiconductor film having fourth convexities imparted thereto corresponding to said first convexities; and forming a second electrode on said photosensitive semiconductor film.
Claim 3
Dependent Claim
23 words
The method as claimed in claim 1 wherein all of said convexities have inclined surfaces having an angle of 45° to 120° therebetween.
Claim 4
Dependent Claim
16 words
The method as claimed in claim 2 wherein said photosensitive semiconductor film is a PIN junction.