Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
186 words
A method for fabricating Schottky barrier or heterojunction solar cells which comprises: coating a heterojunction or Schottky barrier device having opposed upper and lower surfaces on most of the lower surface of the substrate of each said device with a layer of a conductive metal base layer; coating the upper surface of said device with a metal alloy layer; contacting said metal alloy layer with a heat sink having protruding portions which, with contiguous void spaces, define a pattern on said metal alloy layer; oxidizing said metal alloy layer to a transparent mixed metal oxide layer only in those regions of the layer exposed to a gaseous oxidant in said void spaces thereby forming a mixed metal alloy grid network embedded with the formed oxide layer in those regions of said alloy layer in contact with said protruding portions; providing said substrate with an insulating layer between said conductive metal base layer and said transparent conductive metal oxide layer; and providing said grid network with a wraparound metal conductor which coats said insulating layer thereby providing a conductive metal collector for said embedded alloy grid network.
Claim 2
Independent Claim
186 words
A method for fabricating Schottky barrier or heterojunction solar cells which comprises: coating a heterojunction or Schottky barrier device having opposed upper and lower surfaces on most of the lower surface of the substrate of each said device with a layer of a conductive metal base layer; coating the upper surface of said device with a metal alloy layer; contacting said metal alloy layer with a heat sink having protruding portions which, with contiguous void spaces, define a pattern on said metal alloy layer; oxidizing said metal alloy layer to a transparent mixed metal oxide layer only in those regions of the layer exposed to a gaseous oxidant in said void spaces thereby forming a mixed metal alloy grid network embedded with the formed oxide layer in those regions of said alloy layer in contact with said protruding portions; providing said substrate with an insulating layer between said conductive metal base layer and said transparent conductive metal oxide layer; and providing said grid network with a wraparound metal conductor which coats said insulating layer thereby providing a conductive metal collector for said embedded alloy grid network.
Claim 3
Dependent Claim
57 words
The method of claim 1, which further comprises forming said heterojunction device by depositing an n-type transparent, semiconductive layer of SnO 2 or a mixture of SnO 2 and In 2 0 3 on a p-type Si substrate and then providing the exposed surface of the p-type substrate of said device with said conductive metal base layer.
Claim 4
Dependent Claim
21 words
The method of claim 1, wherein said conductive base metal layer is aluminum of a thickness ranging from 3μm to 5μm.
Claim 5
Dependent Claim
13 words
The method of claim 1, wherein said insulating layer is SiO 2 .
Claim 6
Dependent Claim
31 words
The method of claim 1, wherein said alloy of said alloy layer is indium-tin or indium-antimony and wherein said alloy layer is of a thickness ranging from 500 A to 10μm.
Claim 7
Dependent Claim
23 words
The method of claim 1, wherein said heterojunction device has a CdS-Cu 2 S, Si-GaP, CdSe-Cu 2 S, GaAs-ZnSe or GaAs-SnO 2 structure.
Claim 8
Dependent Claim
20 words
The method of claim 1, wherein said Schottky barrier device has an Si-Au, Si-Pt, GaAs-Au, GaAs-Al, GaAs-Ag or Si-Ag structure.
Claim 9
Dependent Claim
36 words
The method of claim 1, wherein said insulating layer is applied by masking said metal base layer and oxide layer coated device, applying a paste of silica in an organic binder and decomposing said organic binder.