Patent US4820547A successfully refreshed from Google Patents.
US4820547A
Expired / Lapsed
US
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Activators for colloidal catalysts in electroless plating processes
Assignee: Surface Technology Inc
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Filing: 1988-06-27
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Granted: 1989-04-11
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Expires: 2008-06-27
Abstract
Abstract Metallic surfaces are imparted to non-conductor substrates by an electroless plating process comprising contacting the substrate with colloidal composition comprising colloids of catalytic metals capable of electroless plating initiation and activator(s) capable of modifying and extending the useful life-time for the colloidal composition from further deterioration.
Inventors
- 👤 Deborah J. Lindsay
- 👤 Nathan Feldstein
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 06:21
CPC Classifications
C; C23; C23C; C23C18/00; C23C18/16; C23C18/18; C23C18/20; C23C18/28
Claims Analysis
Total Claims: 22
Claim 1
Independent Claim
102 words
A process for the electroless plating of a non-conductor substrate comprising the steps of: (a) contacting said substrate with an aqueous colloidal dispersion, said dispersion comprising a non-noble catalytic metal for the electroless plating initiation, a colloidal stabilizer and an activator, said activator being a reducing agent capable of reducing metallic ions of said catalytic metal and further wherein said activator is incorporated into said colloidal dispersion subsequent to the step of colloidal nucleation thereby extending the useful life for said colloidal dispersion, and thereafter (b) contacting the treated substrate with a compatible electroless plating bath to deposit a metallic layer thereof.
Claim 2
Dependent Claim
102 words
A process for the electroless plating of a non-conductor substrate comprising the steps of: (a) contacting said substrate with an aqueous colloidal dispersion, said dispersion comprising a non-noble catalytic metal for the electroless plating initiation, a colloidal stabilizer and an activator, said activator being a reducing agent capable of reducing metallic ions of said catalytic metal and further wherein said activator is incorporated into said colloidal dispersion subsequent to the step of colloidal nucleation thereby extending the useful life for said colloidal dispersion, and thereafter (b) contacting the treated substrate with a compatible electroless plating bath to deposit a metallic layer thereof.
Claim 3
Dependent Claim
12 words
The process according to claim 1 wherein said catalytic metal is copper.
Claim 4
Dependent Claim
16 words
The process according to claim 1 wherein said activator is hydrazine or a derivative of hydrazine.
Claim 5
Dependent Claim
12 words
The process according to claim 1 wherein said electroless plating is copper.
Claim 6
Dependent Claim
17 words
The process according to claim 1 wherein said colloidal dispersion is used at pH 7 and above.
Claim 7
Dependent Claim
27 words
The process according to claim 1 further containing the step of prewetting, said step being prior to the step of contacting the substrate with said colloidal dispersion.
Claim 8
Dependent Claim
38 words
The process according to claim 6 wherein said prewetting step comprises the contacting of said substrate with a composition comprising a member selected from the group consisting of surfactant, hydrous oxide sol, complexing agent, and a chelating agent.
Claim 9
Dependent Claim
15 words
The process according to claim 1 wherein said substrate is a printed circuitry type substrate.
Claim 10
Dependent Claim
19 words
The process according to claim 8 wherein said electroless plating bath is copper and is operating above room temperature.
Claim 11
Dependent Claim
14 words
The process according to claim 1 wherein said printed circuitry type substrate contains thru-holes.
Claim 12
Dependent Claim
21 words
The process according to claim 1 wherein said colloidal dispersion comprises colloids in the size range of 10 to 200 Angstroms.
Claim 13
Dependent Claim
14 words
The process according to claim 1 wherein said colloidal stabilizer is a secondary colloid.
Claim 14
Dependent Claim
12 words
The process according to claim 1 wherein said colloidal stabilizer is gelatin.
Claim 15
Dependent Claim
108 words
A process for the electroless plating of a non-conductor substrate comprising (a) contacting said substrate with a stable colloidal dispersion, said dispersion comprising a colloid stabilizer, a colloid of a non-noble metal for electroless plating initiation, said metal being in a reduced oxidation state, and an activator, said activator being hydrazine or derivatives thereof, a reducing agent capable of reducing metal ions of said non-noble metal to a lower oxidation state thereby extending the useful life-time for said colloidal dispersion, said activator being added subsequent to the colloid nucleation process, and (b) contacting the treated substrate with a compatible electroless plating bath to deposit a metallic layer thereof.
Claim 16
Dependent Claim
108 words
A process for the electroless plating of a non-conductor substrate comprising (a) contacting said substrate with a stable colloidal dispersion, said dispersion comprising a colloid stabilizer, a colloid of a non-noble metal for electroless plating initiation, said metal being in a reduced oxidation state, and an activator, said activator being hydrazine or derivatives thereof, a reducing agent capable of reducing metal ions of said non-noble metal to a lower oxidation state thereby extending the useful life-time for said colloidal dispersion, said activator being added subsequent to the colloid nucleation process, and (b) contacting the treated substrate with a compatible electroless plating bath to deposit a metallic layer thereof.
Claim 17
Dependent Claim
12 words
The process according to claim 14 wherein said non-noble metal is copper.
Claim 18
Independent Claim
76 words
A method for extending the useful lifetime of an aqueous colloidal dispersion useful in the catalytic treatment of substrates prior to electroless plating, said method encompassing the step of incorporating an activator along with non-noble colloids of a catalytic metal capable of electroless plating initiation, said step being carried forth subsequent to the nucleation of said non-noble colloids, and further wherein said activator is a reducing agent capable of reducing metallic ions of said catalytic metal.
Claim 19
Independent Claim
76 words
A method for extending the useful lifetime of an aqueous colloidal dispersion useful in the catalytic treatment of substrates prior to electroless plating, said method encompassing the step of incorporating an activator along with non-noble colloids of a catalytic metal capable of electroless plating initiation, said step being carried forth subsequent to the nucleation of said non-noble colloids, and further wherein said activator is a reducing agent capable of reducing metallic ions of said catalytic metal.
Claim 20
Dependent Claim
12 words
The method according to claim 16 wherein said catalytic metal is copper.
Claim 21
Dependent Claim
12 words
The method according to claim 16 wherein said electroless plating is copper.
Claim 22
Dependent Claim
19 words
The method according to claim 16 wherein said colloidal dispersion is used at an approximate pH value of 7.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1992-04-10 | 1992-10-10 | 1993-04-11 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1996-04-10 | 1996-10-10 | 1997-04-11 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2000-04-10 | 2000-10-10 | 2001-04-11 | $7700.00 | Window Closed / Lapsed |