US4278712A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method for activating non-noble metal colloidal dispersion by controlled oxidation for electroless plating
Assignee: Surface Technology Inc
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Filing: 1979-06-28
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Granted: 1981-07-14
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Expires: 1999-06-28
Abstract
Abstract Metallic surfaces are imparted to non-conductors or dielectric substrates by electroless (chemical) plating process comprised of coating the substrates with activated colloid(s) of non-precious metals and wherein the activated colloids are prepared by the controlled oxidation of weakly active colloids.
Inventors
- 👤 Thomas G. Thomann
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 07:36
CPC Classifications
C; C23; C23C; C23C18/00; C23C18/16; C23C18/18; C23C18/20; C23C18/28; H; H05; H05K; H05K3/00; H05K3/10; H05K3/18; H05K3/181
Claims Analysis
Total Claims: 20
Claim 1
Independent Claim
115 words
A process for the metallizing of a non-conductor substrate by electroless (chemical) metal deposition comprising the steps of: (1) contacting said substrate with an activated colloidal dispersion comprising of non-noble catalytic metal capable of electroless plating initiation and wherein said metal may be part of an alloy or elemental state and mixtures thereof and wherein said activated colloidal dispersion is prepared by the admixing of a chemical oxidizing agent with a weakly active stable colloidal dispersion and wherein said admixing is carried forth in a manner of achieving a controlled oxidation and thereby producing the activated colloidal dispersion, and (2) contacting the treated substrate with an electroless plating bath for the deposition of a metal.
Claim 2
Dependent Claim
115 words
A process for the metallizing of a non-conductor substrate by electroless (chemical) metal deposition comprising the steps of: (1) contacting said substrate with an activated colloidal dispersion comprising of non-noble catalytic metal capable of electroless plating initiation and wherein said metal may be part of an alloy or elemental state and mixtures thereof and wherein said activated colloidal dispersion is prepared by the admixing of a chemical oxidizing agent with a weakly active stable colloidal dispersion and wherein said admixing is carried forth in a manner of achieving a controlled oxidation and thereby producing the activated colloidal dispersion, and (2) contacting the treated substrate with an electroless plating bath for the deposition of a metal.
Claim 3
Dependent Claim
12 words
The process according to claim 1 wherein said catalytic metal is copper.
Claim 4
Dependent Claim
25 words
The process according to claim 1 wherein said weakly active colloidal dispersion was prepared by the interaction of catalytic metal ions with a reducing agent.
Claim 5
Dependent Claim
26 words
The process according to claim 1 wherein said colloidal dispersion is derived by the suspension of a dry powder or semi-dried powder in a suitable solvent.
Claim 6
Dependent Claim
11 words
The process according to claim 4 wherein said solvent is water.
Claim 7
Dependent Claim
15 words
The process according to claim 1 wherein said colloidal composition further contains thio containing compounds.
Claim 8
Dependent Claim
11 words
The process according to claim 6 wherein said thio is thirurea.
Claim 9
Dependent Claim
20 words
The process according to claim 1 wherein said controlled oxidation is achieved by the addition of a chemical oxidizing agent.
Claim 10
Dependent Claim
17 words
The process according to claim 1 wherein said controlled oxidation is achieved by dispersion of a gas.
Claim 11
Dependent Claim
13 words
The process according to claim 1 wherein said electroless metal deposition is copper.
Claim 12
Dependent Claim
18 words
The process according to claim 1 wherein said weakly active colloidal dispersion is prepared by a precipitation reaction.
Claim 13
Dependent Claim
16 words
The process according to claim 1 wherein said controlled oxidation is carried forth utilizing hydrogen peroxide.
Claim 14
Dependent Claim
19 words
The process according to claim 1 further containing the step of contacting the non-conductor substrate with a reducing composition.
Claim 15
Dependent Claim
13 words
The process according to claim 1 wherein said non-conductor substrate is a plastic.
Claim 16
Dependent Claim
13 words
The process according to claim 1 further containing the step of water rinsing.
Claim 17
Dependent Claim
13 words
The process according to claim 1 wherein said colloidal dispersion is aqueous based.
Claim 18
Dependent Claim
25 words
The process according to claim 1 further containing the step of activation and wherein said activation takes place prior to the step of electroless plating.
Claim 19
Dependent Claim
24 words
The process according to claim 1 wherein said substrate is etched prior to the step of contacting the substrate with said activated colloidal dispersion.
Claim 20
Dependent Claim
20 words
The process according to claim 1 wherein said electroless plating bath is electroless copper and is operative at room temperature.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1984-07-13 | 1985-01-12 | 1985-07-14 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1988-07-13 | 1989-01-12 | 1989-07-14 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1992-07-13 | 1993-01-12 | 1993-07-14 | $7700.00 | Window Closed / Lapsed |