Patent US4793883A successfully refreshed from Google Patents.
US4793883A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of bonding a semiconductor chip to a substrate
Assignee: Ingredion Inc
•
Filing: 1986-07-14
•
Granted: 1988-12-27
•
Expires: 2006-07-14
Abstract
Abstract The bonding of semiconductor chips to a substrate is described wherein the first step involves the bonding of a tacky, curable and partially cured chip bonding adhesive, which is releasably supported on a support film, to the surface of the chip intended to be bonded to the substrate. The second step involves the further partial heat curing of the adhesive to convert it to a non-tacky state so that the adhesive will not undesirably stick during handling and storage operations. Thereafter, the chip with its adherent adhesive can be mounted to a substrate at elevated temperature to convert the adhesive to a more tacky state. The final step involves the curing of the adhesive after it has been used to bond the chip to the substrate.
Inventors
- 👤 Gregory M. Sheyon
- 👤 Joseph A. Aurichio
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 12:53
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/01; H10W72/013; H10P; H10P72/00; H10P72/70; H10P72/74; H10P72/7402; H10P72/7416; H10W72/01331; H10W72/071; H10W72/073; H10W72/07331; H10W72/07337; H10W72/07338; H10W72/30; H10W72/321; H10W72/325; H10W72/351; H10W72/353; H10W72/354; Y; Y10; Y10T; Y10T156/00; Y10T156/10; Y10T156/1052; Y10T156/1062; Y10T156/1064; Y10T156/1082
Claims Analysis
Total Claims: 3
Claim 1
Independent Claim
137 words
A method of bonding a semiconductor chip to a substrate which comprises: (a) bonding a tacky, curable and partially cured, non-viscous chip bonding adhesive, which is releasably supported on a support film, to the surface of the chip intended to be bonded to the substrate; (b) further partially heat curing the adhesive to convert it to a non-tacky state; (c) mounting the chip on the substrate at elevated temperature to change the adhesive to a more tacky state; and (d) curing of the adhesive, wherein the chip is in the configuration of a semiconductor wafer, the wafer is mounted on the adhesive on the support film, the wafer is scribed and then cracked into individual chips, the resulting chips with adhesive adhesives are removed from the support film, and the adhesive is converted to a non-tacky state.
Claim 2
Independent Claim
137 words
A method of bonding a semiconductor chip to a substrate which comprises: (a) bonding a tacky, curable and partially cured, non-viscous chip bonding adhesive, which is releasably supported on a support film, to the surface of the chip intended to be bonded to the substrate; (b) further partially heat curing the adhesive to convert it to a non-tacky state; (c) mounting the chip on the substrate at elevated temperature to change the adhesive to a more tacky state; and (d) curing of the adhesive, wherein the chip is in the configuration of a semiconductor wafer, the wafer is mounted on the adhesive on the support film, the wafer is scribed and then cracked into individual chips, the resulting chips with adhesive adhesives are removed from the support film, and the adhesive is converted to a non-tacky state.
Claim 3
Dependent Claim
24 words
The method of claim 1 wherein the adhesive comprises an epoxy resin, a soluble polyimide resin, a reactive diluent, and a polyalkenylphenol crosslinking agent.
References Cited (Backward Citations)
US3600246A
Cited
US3554832A
Cited
US4284457A
Cited
JPS57145339A
Cited
JPS5957438A
Cited
US4606962A
Cited
EP0134606A2
Cited
US4664739A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1991-12-27 | 1992-06-27 | 1992-12-27 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1995-12-27 | 1996-06-27 | 1996-12-27 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1999-12-27 | 2000-06-27 | 2000-12-27 | $7700.00 | Window Closed / Lapsed |