Process for handling and mounting semiconductor dice

Abstract

Abstract A SCRIBED SEMICONDUCTOR WAFER IS DETACHABLY SECURED TO A PLASTIC FILM. THE WAFER IS CRACKED ALONG THE SCRIBED LINES INTO INDIVIDUAL DICE WHICH REMAIN SECURED TO THE FILM. THE FILM IS STRETCHED TO PROVIDE A SPACED ARRAY OF THE DICE. EACH DIE IS THEN MOUNTED TO A HEADER BY POSITIONING THE PLASTIC FILM SO THAT THE DIE IS ADJACENT THE HEADER. A ROD IS PUSHED AGAINST THE PLASTIC FILM OPPOSITE THE DIE TO DEPRESS THE FILM AND BRING THE DIE INTO CONTACT WITH THE HEADER. WHEN THE DIE CONTACTS THE HEADER, IT ADHERES TO THE HEADER AND DETACHES FROM THE PLASTIC FILM.

Inventors

• 👤 Adam Fischer Jr

Bibliographic Details