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US4789643A Expired / Lapsed US ⏱️ 0.0 years remaining

Method of manufacturing a heterojunction bipolar transistor involving etch and refill

Assignee: Mitsubishi Electric Corp
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Filing: 1987-09-16
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Granted: 1988-12-06
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Expires: 2007-09-16
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Abstract

Abstract A heterojunction bipolar transistor and method of manufacturing the same is disclosed in which, a semi-insulation layer and an external base layer sequentially epitaxially grown on a collector layer are selectively mesa-etched through a mask of an insulation film provided with an opening so that the external base layer, the semi-insulation layer and the collector layer are selectively exposed. Subsequently an internal base layer and an emitter layer are selectively epitaxially grown in sequence on the exposed regions of the external base layer, the semi-insulation layer and the collector layer. An emitter electrode is formed in a self-aligned manner through the opening of the insulation film. Thus, transistor performance is improved and element size accuracy is improved.

Inventors

  • 👤 Yasutomo Kajikawa

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-29 16:32
CPC Classifications
H; H10; H10D; H10D10/00; H10D10/01; H10D10/021; H10D62/00; H10D62/80; H10D62/85; Y; Y10; Y10S; Y10S148/00; Y10S148/011; Y10S148/026; Y10S148/05

Claims Analysis

Total Claims: 6
Claim 1
Independent Claim 141 words
A method of manufacturing a heterojunction bipolar transistor, said method comprising: a first step of sequentially epitaxially growing a first conductivity type collector layer, a semi-insulating layer and a second conductivity type external base layer on the upper part of a semi-insulating substrate; a second step of performing selective mesa etching from said external base layer to said collector layer by utilizing a insulation film having a selectively formed opening as a mask to form a cavity exposing said external base layer, said semi-insulating layer and said collector layer; a third step of sequentially epitaxially growing a second conductivity type internal base layer and a first conductivity type emitter layer in said cavity by utilizing said insulation film as a mask; and a fourth step of forming an emitter electrode in a self-aligned manner through said opening of said insulation film.
Claim 2
Independent Claim 141 words
A method of manufacturing a heterojunction bipolar transistor, said method comprising: a first step of sequentially epitaxially growing a first conductivity type collector layer, a semi-insulating layer and a second conductivity type external base layer on the upper part of a semi-insulating substrate; a second step of performing selective mesa etching from said external base layer to said collector layer by utilizing a insulation film having a selectively formed opening as a mask to form a cavity exposing said external base layer, said semi-insulating layer and said collector layer; a third step of sequentially epitaxially growing a second conductivity type internal base layer and a first conductivity type emitter layer in said cavity by utilizing said insulation film as a mask; and a fourth step of forming an emitter electrode in a self-aligned manner through said opening of said insulation film.
Claim 3
Dependent Claim 34 words
A method of manufacturing a heterojunction bipolar transistor in accordance with claim 1, further including a step of epitaxially growing a first conductivity type subcollector layer between said semi-insulating substrate and said collector layer.
Claim 4
Dependent Claim 30 words
A method of manufacturing a heterojunction bipolar transistor in accordance with claim 1, further including a step of epitaxially growing a first conductivity type cap layer on said emitter layer.
Claim 5
Dependent Claim 46 words
A method of manufacturing a heterojunction bipolar transistor in accordance with claim 1, further including a step of forming a base electrode and providing a through hole in said insulation film to form a base electrode connection to said external base layer via said through hole.
Claim 6
Dependent Claim 47 words
A method of manufacturing a heterojunction bipolar transistor in accordance with claim 2, further including a step of forming an electrode cavity from said insulation film to said subcollector layer to form a collector electrode on an exposed region of said subcollector layer in said electrode cavity.

References Cited (Backward Citations)

US3322581A Cited
US3762966A Cited
US4663381A Cited
US4593457A Cited
US4644381A Cited
EP0206787A2 Cited
US4746626A Cited
US4716445A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1991-12-06 1992-06-06 1992-12-06 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1995-12-06 1996-06-06 1996-12-06 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1999-12-06 2000-06-06 2000-12-06 $7700.00 Window Closed / Lapsed

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