← Back to Patent Explorer
US4778583A Expired / Lapsed US ⏱️ 0.0 years remaining

Semiconductor etching process which produces oriented sloped walls

Assignee: Eastman Kodak Co
•
Filing: 1987-05-11
•
Granted: 1988-10-18
•
Expires: 2007-05-11
📄 Original PDF 🌐 Google Patents 🔄 Sync Now

Abstract

Abstract A method is disclosed of forming a semiconductor device including performing a dry plasma etch at one major surface of a monocrystalline silicon substrate to form a sloped lateral wall lying in a selected crystallographic plane intersecting one major surface. The oriented sloped lateral wall is formed during plasma etching by introducing into contact with said major surface at unprotected locations a chlorofluorocarbon gas and employing during etching a pressure of at least 6.67 Pa and a radio frequency power density of less than 3 watts per square centimeter.

Inventors

  • 👤 John J. Wagner
  • 👤 Antonio R. Gallo

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-29 17:40
CPC Classifications
H; H10; H10P; H10P50/00; H10P50/20; H10P50/24; H10P50/242

Claims Analysis

Total Claims: 11
Claim 1
Independent Claim 144 words
A method of forming a semiconductor device including performing a dry plasma etch at one major surface of a monocrystalline silicon substrate to form a constant sloped lateral wall intersecting said one major surface comprising selectively protecting a portion of said major surface, positioning said substrate on one of two spaced electrodes, providing a gaseous atmosphere between said electrodes, and establishing an electric field between said electrodes capable of creating a plasma in said gaseous atmosphere, characterized in that said sloped lateral wall is oriented along a selected crystallographic plane of said monocrystalline silicon substrate by introducing into contact with said major surface at unprotected locations a chlorofluorocarbon gas which, when formed into a plasma crystallographically etches monocrystalline silicon and employing during etching a pressure of at least 6.67 Pa and a radio frequency power density of less than 3 watts per square centimeter.
Claim 2
Independent Claim 144 words
A method of forming a semiconductor device including performing a dry plasma etch at one major surface of a monocrystalline silicon substrate to form a constant sloped lateral wall intersecting said one major surface comprising selectively protecting a portion of said major surface, positioning said substrate on one of two spaced electrodes, providing a gaseous atmosphere between said electrodes, and establishing an electric field between said electrodes capable of creating a plasma in said gaseous atmosphere, characterized in that said sloped lateral wall is oriented along a selected crystallographic plane of said monocrystalline silicon substrate by introducing into contact with said major surface at unprotected locations a chlorofluorocarbon gas which, when formed into a plasma crystallographically etches monocrystalline silicon and employing during etching a pressure of at least 6.67 Pa and a radio frequency power density of less than 3 watts per square centimeter.
Claim 3
Dependent Claim 16 words
A method according to claim 1 further characterized in that said gas is a chlorofluoromethane gas.
Claim 4
Dependent Claim 16 words
A method according to claim 2 further characterized in that said chlorofluoromethane gas is trichlorofluoromethane gas.
Claim 5
Dependent Claim 16 words
A method according to claim 3 further characterized in that said chlorofluoromethane gas is dichlorodifluoromethane gas.
Claim 6
Dependent Claim 23 words
A method according to claim 1 further characterized in that said pressure is maintained in the range of from 25 to 70 Pa.
Claim 7
Dependent Claim 27 words
A method according to claim 1 further characterized in that said power density is maintained in the range of from 0.3 to 3 watts per square centimeter.
Claim 8
Dependent Claim 19 words
A method according to claim 1 further characterized in that said major surface is protected by a patterned photoresist.
Claim 9
Dependent Claim 22 words
A method according to claim 1 further characterized in that said major surface is protected by a patterned silicon oxide or nitride.
Claim 10
Dependent Claim 19 words
A method according to claim 1 further characterized in that said major surface is protected by a patterned metal.
Claim 11
Dependent Claim 15 words
A method according to claim 9 further characterized in that said patterned metal is aluminum.

References Cited (Backward Citations)

US3880684A Cited
US3984301A Cited
US4352724A Cited
US4352724B1 Cited
US4717447A Cited
US4465553A Cited
US4733823A Cited
US4702795A Cited
US4741799A Cited
US4680086A Cited
US4698128A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1991-10-18 1992-04-18 1992-10-18 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1995-10-18 1996-04-18 1996-10-18 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1999-10-18 2000-04-18 2000-10-18 $7700.00 Window Closed / Lapsed

Assigned Categories & Tags

No categories assigned to this patent yet.

Assign Category Tag