US4778583A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor etching process which produces oriented sloped walls
Assignee: Eastman Kodak Co
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Filing: 1987-05-11
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Granted: 1988-10-18
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Expires: 2007-05-11
Abstract
Abstract A method is disclosed of forming a semiconductor device including performing a dry plasma etch at one major surface of a monocrystalline silicon substrate to form a sloped lateral wall lying in a selected crystallographic plane intersecting one major surface. The oriented sloped lateral wall is formed during plasma etching by introducing into contact with said major surface at unprotected locations a chlorofluorocarbon gas and employing during etching a pressure of at least 6.67 Pa and a radio frequency power density of less than 3 watts per square centimeter.
Inventors
- 👤 John J. Wagner
- 👤 Antonio R. Gallo
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-29 17:40
CPC Classifications
H; H10; H10P; H10P50/00; H10P50/20; H10P50/24; H10P50/242
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
144 words
A method of forming a semiconductor device including performing a dry plasma etch at one major surface of a monocrystalline silicon substrate to form a constant sloped lateral wall intersecting said one major surface comprising selectively protecting a portion of said major surface, positioning said substrate on one of two spaced electrodes, providing a gaseous atmosphere between said electrodes, and establishing an electric field between said electrodes capable of creating a plasma in said gaseous atmosphere, characterized in that said sloped lateral wall is oriented along a selected crystallographic plane of said monocrystalline silicon substrate by introducing into contact with said major surface at unprotected locations a chlorofluorocarbon gas which, when formed into a plasma crystallographically etches monocrystalline silicon and employing during etching a pressure of at least 6.67 Pa and a radio frequency power density of less than 3 watts per square centimeter.
Claim 2
Independent Claim
144 words
A method of forming a semiconductor device including performing a dry plasma etch at one major surface of a monocrystalline silicon substrate to form a constant sloped lateral wall intersecting said one major surface comprising selectively protecting a portion of said major surface, positioning said substrate on one of two spaced electrodes, providing a gaseous atmosphere between said electrodes, and establishing an electric field between said electrodes capable of creating a plasma in said gaseous atmosphere, characterized in that said sloped lateral wall is oriented along a selected crystallographic plane of said monocrystalline silicon substrate by introducing into contact with said major surface at unprotected locations a chlorofluorocarbon gas which, when formed into a plasma crystallographically etches monocrystalline silicon and employing during etching a pressure of at least 6.67 Pa and a radio frequency power density of less than 3 watts per square centimeter.
Claim 3
Dependent Claim
16 words
A method according to claim 1 further characterized in that said gas is a chlorofluoromethane gas.
Claim 4
Dependent Claim
16 words
A method according to claim 2 further characterized in that said chlorofluoromethane gas is trichlorofluoromethane gas.
Claim 5
Dependent Claim
16 words
A method according to claim 3 further characterized in that said chlorofluoromethane gas is dichlorodifluoromethane gas.
Claim 6
Dependent Claim
23 words
A method according to claim 1 further characterized in that said pressure is maintained in the range of from 25 to 70 Pa.
Claim 7
Dependent Claim
27 words
A method according to claim 1 further characterized in that said power density is maintained in the range of from 0.3 to 3 watts per square centimeter.
Claim 8
Dependent Claim
19 words
A method according to claim 1 further characterized in that said major surface is protected by a patterned photoresist.
Claim 9
Dependent Claim
22 words
A method according to claim 1 further characterized in that said major surface is protected by a patterned silicon oxide or nitride.
Claim 10
Dependent Claim
19 words
A method according to claim 1 further characterized in that said major surface is protected by a patterned metal.
Claim 11
Dependent Claim
15 words
A method according to claim 9 further characterized in that said patterned metal is aluminum.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1991-10-18 | 1992-04-18 | 1992-10-18 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1995-10-18 | 1996-04-18 | 1996-10-18 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1999-10-18 | 2000-04-18 | 2000-10-18 | $7700.00 | Window Closed / Lapsed |