Patent US4775444A successfully refreshed from Google Patents.
US4775444A
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US
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Process for fabricating multilayer circuit boards
Assignee: MacDermid Acumen Inc
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Filing: 1987-08-26
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Granted: 1988-10-04
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Expires: 2007-08-26
Abstract
Abstract Printed circuit boards having copper circuit patterns coated with an adhesion promoter (e.g., copper oxide, tin) are subjected to the action of an aqueous chromic acid solution prior to incorporation in a multi-layer board by interposing layers of semi-cured polymeric non-conductive material between the individual boards and laminating the assembly using heat and pressure. The chromic acid treatment serves to improve adhesion between the layers and, in particular, to overcome or minimize the "pink ring" effect which is frequently observed around holes drilled through multilayer boards.
Inventors
- 👤 John L. Cordani
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 18:46
CPC Classifications
C; C23; C23C; C23C22/00; C23C22/05; C23C22/60; C23C22/63; C23C22/06; C23C22/24; C23C22/78; C23C22/82; C23C22/83; H; H05; H05K; H05K3/00; H05K3/38; H05K3/382; H05K3/384; H05K3/385; H05K2203/00; H05K2203/03; H05K2203/0315; H05K2203/07; H05K2203/0703; H05K2203/072; H05K3/46; H05K3/4611
Claims Analysis
Total Claims: 16
Claim 1
Independent Claim
114 words
In a process for the preparation of a multilayer printed circuit board which comprises the steps of: providing a non-conductive substrate clad on each side with a copper circuit pattern layer; applying a coating of adhesion promoter to the copper circuit pattern layers; and incorporating the resulting board and one or more additional boards prepared in the same manner into a multilayer board by interposing layers of semi-cured polymeric non-conductive material between said boards and laminating the assembly using heat and pressure; the improvement which comprises exposing the copper circuit patterns coated with adhesion promoter to the action of an aqueous chromic acid solution prior to incorporation of said boards into the multilayer board.
Claim 2
Dependent Claim
114 words
In a process for the preparation of a multilayer printed circuit board which comprises the steps of: providing a non-conductive substrate clad on each side with a copper circuit pattern layer; applying a coating of adhesion promoter to the copper circuit pattern layers; and incorporating the resulting board and one or more additional boards prepared in the same manner into a multilayer board by interposing layers of semi-cured polymeric non-conductive material between said boards and laminating the assembly using heat and pressure; the improvement which comprises exposing the copper circuit patterns coated with adhesion promoter to the action of an aqueous chromic acid solution prior to incorporation of said boards into the multilayer board.
Claim 3
Dependent Claim
16 words
A process according to claim 1 wherein the adhesion promoter is a layer of copper oxide.
Claim 4
Dependent Claim
60 words
A processing according to claim 2 wherein said copper oxide is applied by contacting the copper circuit pattern with an aqueous solution containing an alkali metal chlorite or alkaline earth metal chlorite at a concentration of from 50 grams per liter to complete saturation and sodium or potassium hydroxide at a concentration of from 5 to 25 grams per liter.
Claim 5
Dependent Claim
15 words
A process according to claim 1 wherein the adhesion promoter is a layer of tin.
Claim 6
Dependent Claim
35 words
A process according to claim 1 wherein the chromic acid solution is obtained by acidifying an aqueous solution of an alkali metal bichromate to a pH in the range of about 1.5 to about 2.5.
Claim 7
Dependent Claim
26 words
A process according to claim 1 wherein the chromic acid solution is at a temperature in the range of about 20° C. to about 90° C.
Claim 8
Dependent Claim
36 words
A process according to claim 1 wherein the substrate with copper circuit patterns coated with adhesion promoter is immersed in the aqueous chromic acid solution for a period of about 10 seconds to about 5 minutes.
Claim 9
Dependent Claim
29 words
A process according to claim 1 wherein the chromic acid solution is applied to the copper circuit patterns coated with adhesion promoter by spraying said solution on said patterns.
Claim 10
Dependent Claim
26 words
A process according to claim 1 wherein the solution of chromic acid contains from about 0.1 to about 50 grams per liter of the said acid.
Claim 11
Dependent Claim
112 words
In a process for the preparation of a multilayer printed circuit board the steps comprising: providing a plurality of non-conductive substrates clad on each side with a layer of copper; applying a relief resist image of a circuit pattern to each copper layer and etching away the exposed copper; removing the resist and applying a coating of copper oxide to the exposed copper circuit pattern; exposing the copper oxide-coated copper circuit pattern to the action of an aqueous chromic acid solution; and thereafter incorporating said plurality of boards so prepared into multilayer board by interposing layers of semi-cured polymeric nonconductive material between said boards and laminating the assembly using heat and pressure.
Claim 12
Dependent Claim
112 words
In a process for the preparation of a multilayer printed circuit board the steps comprising: providing a plurality of non-conductive substrates clad on each side with a layer of copper; applying a relief resist image of a circuit pattern to each copper layer and etching away the exposed copper; removing the resist and applying a coating of copper oxide to the exposed copper circuit pattern; exposing the copper oxide-coated copper circuit pattern to the action of an aqueous chromic acid solution; and thereafter incorporating said plurality of boards so prepared into multilayer board by interposing layers of semi-cured polymeric nonconductive material between said boards and laminating the assembly using heat and pressure.
Claim 13
Dependent Claim
62 words
A process according to claim 10 wherein the layer of copper oxide is applied by contacting the copper circuit pattern with an aqueous solution containing an alkali metal chlorite or alkaline earth metal chlorite at a concentration of from 50 grams per liter to complete saturation and sodium or potassium hydroxide at a concentration of from 5 to 25 grams per liter.
Claim 14
Dependent Claim
39 words
A process according to claim 10 wherein the copper oxide-coated copper circuit pattern is immersed in the chromic acid solution at about 20° C. to about 90° C. for a period of about 10 seconds to about 5 minutes.
Claim 15
Dependent Claim
35 words
A process according to claim 10 wherein the chromic acid solution is obtained by acidifying an aqueous solution of an alkali metal bichromate to a pH in the range of about 1.5 to about 2.5.
Claim 16
Dependent Claim
27 words
A process according to claim 10 wherein the amount of chromic acid present in the solution thereof is from about 0.1 to about 50 grams per liter.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1991-10-04 | 1992-04-04 | 1992-10-04 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1995-10-04 | 1996-04-04 | 1996-10-04 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1999-10-04 | 2000-04-04 | 2000-10-04 | $7700.00 | Window Closed / Lapsed |