Process for the treatment of copper oxide in the preparation of printed circuit boards

Claim 2

A process for improving the leach resistance of copper oxide to an acid copper electroplating bath comprising contacting the copper oxide layer on top of a copper layer of a printed circuit board laminate for a sufficient time to provide increased leach resistance to said copper electroplating bath with an aqueous solution containing an element selected from the group consisting of selenium, tellerium, sulfur and mixtures thereof and having a pH of about 1 to 5.

Claim 3

The process of claim 1 wherein the copper oxide is a surface coating on a copper layer, which copper layer is bonded to a printed circuit dielectric substrate.

Claim 4

The process of claim 1 wherein the solution contains HCl or H 3 PO 4 acid and selenium dioxide.

Claim 5

The process of claim 3 wherein the acid is about 0.15 to 1 g/l and the selenium dioxide is about 2 to 5 g/l.

Claim 6

A process for preparing a multilayer printed circuit board comprising: (a) contacting a dielectric material laminate layer having a copper layer with a copper oxide coating on the copper layer, said copper oxide having been formed by an oxide forming composition, with an aqueous solution containing an element selected from the group consisting of selenium, tellurium, sulfur and mixtures thereof and having a pH of about 1 to 5 for a sufficient time to increase the leach resistance of the copper oxide layer to an acid copper electroplating bath; and (b) forming the multilayer printed circuit board by laminating together the layer from step (a) with other layers needed to form the multilayer board.

Claim 7

A process for preparing a multilayer printed circuit board comprising: (a) contacting a dielectric material laminate layer having a copper layer with a copper oxide coating on the copper layer, said copper oxide having been formed by an oxide forming composition, with an aqueous solution containing an element selected from the group consisting of selenium, tellurium, sulfur and mixtures thereof and having a pH of about 1 to 5 for a sufficient time to increase the leach resistance of the copper oxide layer to an acid copper electroplating bath; and (b) forming the multilayer printed circuit board by laminating together the layer from step (a) with other layers needed to form the multilayer board.

Claim 8

The process of claim 5 wherein the copper oxide coating is formed using as the oxidant an aqueous alkaline solution of a chlorite salt.

Claim 9

The process of claim 5 wherein the solution contains a phosphorus acid in an amount of about 0.1 to 50 g/l.

Claim 10

The process of claim 7 wherein the phosphrous acid is phosphoric acid.

Claim 11

The process of claim 5 wherein the solution contains HCl and selenium dioxide.

Claim 12

The process of claim 9 wherein the HCl is about 0.15 to 1 g/l and the selenium dioxide is about 2 to 5 g/l.