US3464855A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Process for forming interconnections in a multilayer circuit board
Assignee: Boeing North American Inc
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Filing: 1966-09-06
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Granted: 1969-09-02
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Expires: 1986-09-06
Abstract
No abstract record available.
Inventors
- 👤 Joseph M Shaheen
- 👤 Leo J Quintana
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-30 17:54
CPC Classifications
C; C25; C25D; C25D5/00; C25D5/02; H; H05; H05K; H05K3/00; H05K3/40; H05K3/42; H05K3/423; H05K3/46; H05K3/4644; H05K3/4647; H05K2201/00; H05K2201/03; H05K2201/0302; H05K2201/0305; H05K2201/0332; H05K2201/0335; H05K2201/0355; H05K2201/0388; H05K2201/0394; H05K2203/00; H05K2203/05; H05K2203/0502; H05K2203/0542; H05K2203/06; H05K2203/063; H05K2203/07; H05K2203/0703; H05K2203/0733; H05K3/10; H05K3/18; H05K3/181; H05K3/22; H05K3/24; H05K3/243; H05K3/30; H05K3/32; H05K3/34; H05K3/346; H05K3/38; H05K3/386; H05K3/4038
Claims Analysis
Total Claims: 0
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References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1972-09-01 | 1973-03-03 | 1973-09-02 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1976-09-01 | 1977-03-03 | 1977-09-02 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1980-09-01 | 1981-03-03 | 1981-09-02 | $7700.00 | Window Closed / Lapsed |