Manufacture of microsieves and the resulting microsieves

Claim 2

In the method of making a microsieve in which (a) a layer of photoresist is applied to an electrically conductive substrate, (b) preselected areas of the photoresist are fixed to provide a patterned surface in the form of a grid-like array of discrete areas of fixed photoresist, (c) the remaining photoresist is removed to expose a continuous area of the electrically conductive substrate, (d) the substrate is electroplated, and (e) the substrate and fixed photoresist are removed to provide a finished microsieve; the improvement comprising imparting to the finished microsieve greater rigidity and resistance to mechanical distortion by: preparing the electrically conductive substrate required for step (a) by the sub-steps of: (i) providing a rigid, electrically conductive frame member having a relatively large aperture defined within a major surface thereof, the area constituting the large aperture being at least equal to the area of the grid-like array of micro-apertures possessed by the finished microsieve; (ii) filling the large aperture with a hardenable electrically conductive material; and (iii) permitting the electrically conductive material to harden to provide a smooth-surfaced electrically conductive substrate corresponding to the configuration of the large aperture and surrounded by the electrically conductive frame member.

Claim 3

The method of claim 1 wherein the electrically conductive frame member is fabricated from copper or brass.

Claim 4

The method of claim 1 wherein the hardenable electrically conductive material is Wood's metal.

Claim 5

The method of claim 1 wherein the large aperture is defined by a circle of from about 1000 to about 3000 microns diameter, the center of the aperture being fixed at the geometric center of the major surface of the frame member.

Claim 6

The method of claim 1 wherein the photoresist is a photoemulsion.

Claim 7

The method of claim 1 wherein the discrete areas of fixed photoresist are about 1 to about 2 microns in height, from about 7 to about 11 microns across and separated from each other by a distance of from about 15 to about 25 microns, there being a total of from about 100 to about 10,000 of said discrete areas of fixed photoresist.

Claim 8

The method of claim 1 wherein the electroplated metal is nickel.

Claim 9

The method of claim 1 wherein the hardened, smooth surface electrically conductive material extends a short distance out from the plane of the surrounding surface of the frame member.

Claim 10

The method of claim 1 wherein the smooth surface of the hardened electrically conductive material is substantially optically flat.

Claim 11

In the method of making a microsieve in which (a) a layer of photoresist is applied to an electrically conductive substrate, (b) preselected areas of the photoresist are fixed to provide a patterned surface in the form of a grid-like array of discrete areas of fixed photoresist, (c) the remaining photoresist is removed to expose a continuous area of the electrically conductive substrate, (d) the substrate is electroplated, and (e) the substrate and fixed photoresist are removed to provide the finished microsieve; the improvement comprising imparting to the finished microsieve greater rigidity and resistance to mechanical distortion by: preparing the electrically conductive substrate required for step (a) by the sub-steps of: (i) providing a rigid frame member fabricated from an electrically conductive first metal and having a continuous upper and lower surface; and (ii) applying to the lower surface an electrically non-conductive coating which is resistant to the action of an etchant for the metal of the frame member, said coating surrounding an exposed area of said lower surface which is directly below that portion of the upper surface to be provided with the microsieve, the uncoated upper surface providing the required substrate; and thereafter in step (d) the electroplating is effected with a second metal which differs from the first metal; and in step (e) the metal of the frame member directly beneath the electroplated metal which will constitute the microsieve is selectively etched, and finally the fixed photoresist is removed.

Claim 12

In the method of making a microsieve in which (a) a layer of photoresist is applied to an electrically conductive substrate, (b) preselected areas of the photoresist are fixed to provide a patterned surface in the form of a grid-like array of discrete areas of fixed photoresist, (c) the remaining photoresist is removed to expose a continuous area of the electrically conductive substrate, (d) the substrate is electroplated, and (e) the substrate and fixed photoresist are removed to provide the finished microsieve; the improvement comprising imparting to the finished microsieve greater rigidity and resistance to mechanical distortion by: preparing the electrically conductive substrate required for step (a) by the sub-steps of: (i) providing a rigid frame member fabricated from an electrically conductive first metal and having a continuous upper and lower surface; and (ii) applying to the lower surface an electrically non-conductive coating which is resistant to the action of an etchant for the metal of the frame member, said coating surrounding an exposed area of said lower surface which is directly below that portion of the upper surface to be provided with the microsieve, the uncoated upper surface providing the required substrate; and thereafter in step (d) the electroplating is effected with a second metal which differs from the first metal; and in step (e) the metal of the frame member directly beneath the electroplated metal which will constitute the microsieve is selectively etched, and finally the fixed photoresist is removed.

Claim 13

The method of claim 10 wherein the metal of the frame member is copper or brass and the electroplated metal is nickel.

Claim 14

The method of claim 10 wherein the photoresist is a photoemulsion.

Claim 15

In the method of making a microsieve in which (a) a layer of photoresist is applied to an electrically conductive substrate, (b) preselected areas of the photoresist are fixed to provide a patterned surface in the form of a grid-like array of discrete areas of fixed photoresist, (c) the remaining photoresist is removed to expose a continuous area of the electrically conductive substrate, (d) the substrate is electroplated, and (e) the substrate and fixed photoresist are removed to provide a finished microsieve; the improvement comprising imparting to the finished microsieve greater rigidity and resistance to mechanical distortion by: preparing the electrically conductive substrate required for step (a) by the sub-steps of: (i) providing a rigid, electrically conductive frame member having a relatively large aperture defined within a major surface thereof, the area constituting the large aperture being at least equal to the area of the grid-like array of micro-apertures possessed by the finished microsieve; (ii) filling the large aperture with a hardenable electrically non-conductive material; (iii) permitting the electrically nonconductive material to harden to provide a smoothsurfaced electrically non-conductive material corresponding to the configuration of the large aperture and surrounded by the electrically conductive frame member; and (iv) vapor depositing an electrically conductive metal upon the entire combined surface of non-conductive material surrounded by electrically conductive material; and thereafter step (e) is effected by removing the non-electrically conductive material from the large aperture to expose vapor deposited metal, and removing the fixed photoresist.

Claim 16

In the method of making a microsieve in which (a) a layer of photoresist is applied to an electrically conductive substrate, (b) preselected areas of the photoresist are fixed to provide a patterned surface in the form of a grid-like array of discrete areas of fixed photoresist, (c) the remaining photoresist is removed to expose a continuous area of the electrically conductive substrate, (d) the substrate is electroplated, and (e) the substrate and fixed photoresist are removed to provide a finished microsieve; the improvement comprising imparting to the finished microsieve greater rigidity and resistance to mechanical distortion by: preparing the electrically conductive substrate required for step (a) by the sub-steps of: (i) providing a rigid, electrically conductive frame member having a relatively large aperture defined within a major surface thereof, the area constituting the large aperture being at least equal to the area of the grid-like array of micro-apertures possessed by the finished microsieve; (ii) filling the large aperture with a hardenable electrically non-conductive material; (iii) permitting the electrically nonconductive material to harden to provide a smoothsurfaced electrically non-conductive material corresponding to the configuration of the large aperture and surrounded by the electrically conductive frame member; and (iv) vapor depositing an electrically conductive metal upon the entire combined surface of non-conductive material surrounded by electrically conductive material; and thereafter step (e) is effected by removing the non-electrically conductive material from the large aperture to expose vapor deposited metal, and removing the fixed photoresist.

Claim 17

The method of claim 13 wherein the electrically non-conductive material is a paraffin wax.

Claim 18

The method of claim 13 wherein the photoresist is a photoemulsion.

Claim 19

In the method of making a microsieve in which (a) a layer of photoresist is applied to a smooth-surfaced electrically conductive substrate, (b) preselected areas of the photoresist are fixed to provide a patterned surface in the form of a grid-like array of discrete areas of fixed photoresist, (c) the remaining photoresist is removed to expose a continuous area of the electrically conductive substrate, (d) the substrate is electroplated, and (e) the substrate and fixed photoresist are removed to provide a finished microsieve; the improvement comprising imparting to the finished microsieve greater rigidity and resistance to mechanical distortion by: effecting step (d) by electroplating metal upon the exposed substrate to substantially the same height, or thickness, of the areas of fixed photoresist to provide a patterned surface in the form of a grid-like array in minute, closely spaced, precisely dimensioned areas of fixed photoresist surrounded by a continuous area of electroplated metal; and prior to step (e), applying another layer of photoresist upon the patterned surface, and repeating the sequence of steps taken so far, one or more times, provided that with each repetition of step (b), the areas of fixed photoresist are superimposed upon, and in predetermined alignment with, the previously obtained areas of fixed photoresist, provided also that in the last repetition of the sequence of steps, step (d) is omitted.

Claim 20

In the method of making a microsieve in which (a) a layer of photoresist is applied to a smooth-surfaced electrically conductive substrate, (b) preselected areas of the photoresist are fixed to provide a patterned surface in the form of a grid-like array of discrete areas of fixed photoresist, (c) the remaining photoresist is removed to expose a continuous area of the electrically conductive substrate, (d) the substrate is electroplated, and (e) the substrate and fixed photoresist are removed to provide a finished microsieve; the improvement comprising imparting to the finished microsieve greater rigidity and resistance to mechanical distortion by: effecting step (d) by electroplating metal upon the exposed substrate to substantially the same height, or thickness, of the areas of fixed photoresist to provide a patterned surface in the form of a grid-like array in minute, closely spaced, precisely dimensioned areas of fixed photoresist surrounded by a continuous area of electroplated metal; and prior to step (e), applying another layer of photoresist upon the patterned surface, and repeating the sequence of steps taken so far, one or more times, provided that with each repetition of step (b), the areas of fixed photoresist are superimposed upon, and in predetermined alignment with, the previously obtained areas of fixed photoresist, provided also that in the last repetition of the sequence of steps, step (d) is omitted.

Claim 21

The method of claim 16 wherein the photoresist is a photoemulsion.

Claim 22

In the method of making a microsieve in which (a) a layer of photoresist is applied to a smooth-surfaced electrically conductive substrate, (b) preselected areas of the photoresist are fixed to provide a pattern surface in the form of a grid-like array of discrete areas of fixed photoresist, (c) the remaining photoresist is removed to expose a continuous area of the electrically conductive substrate, (d) the substrate is electroplated, and (e) the substrate and fixed photoresist are removed to provide a finished microsieve; the improvement comprising imparting to the finished microsieve greater rigidity and resistant to mechanical distortion by: effecting step (d) by electroplating metal upon the exposed substrate to substantially the same height, or thickness, of the areas of fixed photoresist to provide a patterned surface in the form of a grid-like array in minute, closely spaced, precisely dimensioned areas of fixed photoresist surrounded by a continuous area of electroplated metal; prior to step (e), applying another layer of photoresist upon the patterned surface, and repeating the sequence of steps taken so far, one or more times, provided that with each repetition of step (b), the areas of fixed photoresist are superimposed upon, and in predetermined alignment with, the previously obtained areas of fixed photoresist, provided also that in the last repetition of the sequence of steps, step (d) is omitted and further, layers of vapor deposited metal are interposed between successive layers of electroplated metal.

Claim 23

In the method of making a microsieve in which (a) a layer of photoresist is applied to a smooth-surfaced electrically conductive substrate, (b) preselected areas of the photoresist are fixed to provide a pattern surface in the form of a grid-like array of discrete areas of fixed photoresist, (c) the remaining photoresist is removed to expose a continuous area of the electrically conductive substrate, (d) the substrate is electroplated, and (e) the substrate and fixed photoresist are removed to provide a finished microsieve; the improvement comprising imparting to the finished microsieve greater rigidity and resistant to mechanical distortion by: effecting step (d) by electroplating metal upon the exposed substrate to substantially the same height, or thickness, of the areas of fixed photoresist to provide a patterned surface in the form of a grid-like array in minute, closely spaced, precisely dimensioned areas of fixed photoresist surrounded by a continuous area of electroplated metal; prior to step (e), applying another layer of photoresist upon the patterned surface, and repeating the sequence of steps taken so far, one or more times, provided that with each repetition of step (b), the areas of fixed photoresist are superimposed upon, and in predetermined alignment with, the previously obtained areas of fixed photoresist, provided also that in the last repetition of the sequence of steps, step (d) is omitted and further, layers of vapor deposited metal are interposed between successive layers of electroplated metal.