US4766009A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Selective working method
Assignee: Hitachi Ltd
•
Filing: 1987-01-06
•
Granted: 1988-08-23
•
Expires: 2007-01-06
Abstract
Abstract A selective working method in which the surface to be worked of a workpiece is locally irradiated with energy beams and an electroless plating solution or an electroless etching solution is contacted with the irradiated workpiece surface, with the electroless plating solution or the electroless etching solution flowing continuously in the substantially same direction of as the direction of an irradiation of energy beams. The electroless plating of the electroless etching can be conducted selectively by this method. Above selective working method is best suited for the formation or correction (repair, filling up etc.) of micro-patterns on the workpiece such as metals, semi-conductors, insulators, etc.
Inventors
- 👤 Midori Imura
- 👤 Makoto Morijiri
- 👤 Masanobu Hanazono
- 👤 Shinichi Kazui
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 17:40
CPC Classifications
C; C23; C23C; C23C18/00; C23C18/16; C23C18/1601; C23C18/1633; C23C18/1655; C23C18/1664; C23C18/1669; B; B23; B23K; B23K26/00; B23K26/14; B23K26/146; C23C18/1603; C23C18/1607; C23C18/161; C23C18/1612; C23F; C23F1/00; C23F1/02; H; H05; H05K; H05K3/00; H05K3/22; H05K3/225; H05K2203/00; H05K2203/10; H05K2203/107; H05K2203/17; H05K2203/173; H05K2203/175; H05K3/02; H05K3/06; H05K3/068; H05K3/10; H05K3/18; H05K3/181; H05K3/187
Claims Analysis
Total Claims: 32
Claim 1
Independent Claim
203 words
A method for selectively electrolessly plating or etching a surface of a workpiece having a defective portion thereon, comprising the steps of: locally circulating a continuously flowing electroless solution, being selected from one of a plating solution and an etching solution, to the defective portion of the workpiece and an immediately surrounding area thereof, whereby another area of the workpiece does not have the electroless solution circulated thereto, so that only the defective portion and the immediately surrounding area thereof, or the workpiece, is supplied with electroless solution, wherein during the locally circulating step an electroless solution cell is positioned above the workpiece, so as to locally supply the continuously flowing electroless solution to the defective portion of the workpiece and the immediately surrounding area thereof, and a pad is directly positioned on the surface of the workpiece so as to expose only the defective portion of the workpiece and the immediately surrounding area thereof, the pad and electroless solution cell, in combination, confining the continuously flowing electroless solution, in its exposure to the workpiece, to the defective portion and the immediately surrounding area thereof; and locally irradiating an energy beam onto the defective portion of the workpiece to heat the defective portion.
Claim 2
Independent Claim
203 words
A method for selectively electrolessly plating or etching a surface of a workpiece having a defective portion thereon, comprising the steps of: locally circulating a continuously flowing electroless solution, being selected from one of a plating solution and an etching solution, to the defective portion of the workpiece and an immediately surrounding area thereof, whereby another area of the workpiece does not have the electroless solution circulated thereto, so that only the defective portion and the immediately surrounding area thereof, or the workpiece, is supplied with electroless solution, wherein during the locally circulating step an electroless solution cell is positioned above the workpiece, so as to locally supply the continuously flowing electroless solution to the defective portion of the workpiece and the immediately surrounding area thereof, and a pad is directly positioned on the surface of the workpiece so as to expose only the defective portion of the workpiece and the immediately surrounding area thereof, the pad and electroless solution cell, in combination, confining the continuously flowing electroless solution, in its exposure to the workpiece, to the defective portion and the immediately surrounding area thereof; and locally irradiating an energy beam onto the defective portion of the workpiece to heat the defective portion.
Claim 3
Dependent Claim
25 words
A method for selectively electrolessly plating or etching a surface of a workpiece according to claim 1, wherein said energy beam is a laser beam.
Claim 4
Dependent Claim
30 words
A method for selectively electrolessly plating or etching a surface of a workpiece according to claim 1, wherein said energy beam is supplied through the flow of said electroless solution.
Claim 5
Dependent Claim
36 words
A method for selectively electrolessly plating or etching a surface of a workpiece according to claim 1, wherein said energy beam is applied toward the workpiece without being contacted with the flow of said electroless solution.
Claim 6
Dependent Claim
34 words
A method for selectively electrolessly plating or etching a surface of a workpiece according to claim 2, wherein said laser beam is conducted by an optical fiber to the defective portion to be worked.
Claim 7
Independent Claim
252 words
A method for selectively electrolessly plating or etching a surface of a workpiece having a defective portion thereon, comprising the steps of: setting the workpiece in an electroless solution, selected from one of a plating solution and an etching solution, so that only the defective portion and a surrounding area thereof, of the workpiece, are exposed to the electroless solution; locally circulating a continuous flow of said electroless solution to the defective portion and an immediately surrounding area thereof, whereby another area of the workpiece does not have the electroless solution circulated thereto, so that only the defective portion and the immediately surrounding area thereof, of the workpiece, is in contact with the electroless solution, wherein during the locally circulating step an electroless solution cell is positioned above the workpiece, so as to locally supply the continuously flowing electroless solution to the defective portion of the workpiece and the immediately surrounding area thereof, and a pad is directly positioned on the surface of the workpiece so as to expose only the defective portion of the workpiece and the immediately surrounding area thereof, the pad and electroless solution cell, in combination, confining the continuously flowing electroless solution, in its exposure to the workpiece, to the defective portion and the immediately surrounding area thereof; and locally irradiating an energy beam onto the defective portion of the workpiece, to heat the defective portion of the workpiece, said electroless solution flowing in substantially the same direction as a direction of an irradiation of said energy beam.
Claim 8
Independent Claim
252 words
A method for selectively electrolessly plating or etching a surface of a workpiece having a defective portion thereon, comprising the steps of: setting the workpiece in an electroless solution, selected from one of a plating solution and an etching solution, so that only the defective portion and a surrounding area thereof, of the workpiece, are exposed to the electroless solution; locally circulating a continuous flow of said electroless solution to the defective portion and an immediately surrounding area thereof, whereby another area of the workpiece does not have the electroless solution circulated thereto, so that only the defective portion and the immediately surrounding area thereof, of the workpiece, is in contact with the electroless solution, wherein during the locally circulating step an electroless solution cell is positioned above the workpiece, so as to locally supply the continuously flowing electroless solution to the defective portion of the workpiece and the immediately surrounding area thereof, and a pad is directly positioned on the surface of the workpiece so as to expose only the defective portion of the workpiece and the immediately surrounding area thereof, the pad and electroless solution cell, in combination, confining the continuously flowing electroless solution, in its exposure to the workpiece, to the defective portion and the immediately surrounding area thereof; and locally irradiating an energy beam onto the defective portion of the workpiece, to heat the defective portion of the workpiece, said electroless solution flowing in substantially the same direction as a direction of an irradiation of said energy beam.
Claim 9
Dependent Claim
89 words
A method for selectively electrolessly plating or etching a surface of a workpiece according to claim 6, wherein the electroless solution cell is selected from one of a plating solution cell and an etching solution cell, and is provided close to the defective portion to be worked, a separately prepared electroless solution forms a flow on the defective portion to be worked and the immediately surrounding area thereof, and further said separately prepared solution flows in substantially the same direction as the direction of irradiating of said energy beam.
Claim 10
Dependent Claim
36 words
A method of selectively electrolessly plating or etching a surface of a workpiece according to claim 1, wherein said electroless solution flows in substantially the same direction as a direction of irradiation of the energy beam.
Claim 11
Dependent Claim
36 words
A method of selectively electrolessly plating or etching a surface of a workpiece according to claim 1, wherein the circulating a continuously flowing electroless solution includes directing the solution on a slant against the defective portion.
Claim 12
Independent Claim
220 words
A method of selectively electrolessly plating or etching a surface of a workpiece, comprising the steps of: locally and selectively directing a flow of electroless solution, selected from the group consisting of electroless plating solution and electroless etching solution, to a selected portion of the workpiece, with only said selected portion of the workpiece and an immediately surrounding area thereof, of the workpiece, being in contact with said electroless solution, whereby another area of the workpiece does not have the electroless solution locally and selectively directed thereto, so as to electrolessly plate or electrolessly etch, respectively, said selected portion of the workpiece, wherein during the local and selective directing step an electroless solution cell is positioned above the workpiece, so as to locally supply the flowing electroless solution to the selected portion of the workpiece and the immediately surrounding area thereof, and a pad is directly positioned on the surface of the workpiece so as to expose only the selected portion of the workpiece and the immediately surrounding area thereof, the pad and electroless solution cell, in combination, confining the flowing electroless solution, in its exposure to the workpiece, to the selected portion and the immediately surrounding area thereof; and locally irradiating an energy beam onto said selected portion of the workpiece to heat the selected portion of the workpiece.
Claim 13
Independent Claim
220 words
A method of selectively electrolessly plating or etching a surface of a workpiece, comprising the steps of: locally and selectively directing a flow of electroless solution, selected from the group consisting of electroless plating solution and electroless etching solution, to a selected portion of the workpiece, with only said selected portion of the workpiece and an immediately surrounding area thereof, of the workpiece, being in contact with said electroless solution, whereby another area of the workpiece does not have the electroless solution locally and selectively directed thereto, so as to electrolessly plate or electrolessly etch, respectively, said selected portion of the workpiece, wherein during the local and selective directing step an electroless solution cell is positioned above the workpiece, so as to locally supply the flowing electroless solution to the selected portion of the workpiece and the immediately surrounding area thereof, and a pad is directly positioned on the surface of the workpiece so as to expose only the selected portion of the workpiece and the immediately surrounding area thereof, the pad and electroless solution cell, in combination, confining the flowing electroless solution, in its exposure to the workpiece, to the selected portion and the immediately surrounding area thereof; and locally irradiating an energy beam onto said selected portion of the workpiece to heat the selected portion of the workpiece.
Claim 14
Dependent Claim
42 words
A method for selectively electrolessly plating or etching a workpiece according to claim 10, wherein the locally irradiating is performed in a predetermined direction, and the locally and selectively directing of the flow of electroless solution is performed in said predetermined direction.
Claim 15
Dependent Claim
22 words
A method for selectively electrolessly plating or etching a workpiece according to claim 10, wherein the energy beam is a laser beam.
Claim 16
Dependent Claim
90 words
A method for selectively electrolessly plating or etching a workpiece according to claim 10, wherein the electroless solution cell has an inlet and outlet for electroless solution, and an opening; and prior to the irradiating and the directing a flow of electroless solution, the electroless solution cell is positioned so that the opening is over said selected portion of the workpiece, and electroless solution is passed through the cell from the inlet to the outlet so as to provide the local and selective directing of the flow of electroless solution.
Claim 17
Dependent Claim
33 words
A method for selectively electrolessly plating or etching a workpiece according to claim 13, wherein said opening is positioned over only said selected portion of the workpiece and the immediately surrounding area thereof.
Claim 18
Dependent Claim
32 words
A method for selectively electrolessly plating or etching a workpiece according to claim 10, wherein a continuous flow of electroless solution is locally selectively directed to said selected portion of the workpiece.
Claim 19
Independent Claim
220 words
A method for selectively electrolessly plating or etching a surface of a workpiece having a defective portion thereon, comprising the steps of: locally circulating a continuously flowing electroless solution, being selected from one of a plating solution and an etching solution, so as to cause the defective portion of the workpiece and an immediately surrounding area thereof to be in contact with a fresh electroless solution, whereby another area of the workpiece does not have the electroless solution in contact therewith, so that only the defective portion and the immediately surrounding area thereof, of the workpiece, is in contact with electroless solution, wherein during the locally circulating step an electroless solution cell is positioned above the workpiece, so as to locally supply the continuously flowing electroless solution to the defective portion of the workpiece and the immediately surrounding area thereof, and a pad is directly positioned on the surface of the workpiece so as to expose only the defective portion of the workpiece and the immediately surrounding area thereof, the pad and electroless solution cell, in combination, confining the continuously flowing electroless solution, in its exposure to the workpiece, to the defective portion and the immediately surrounding area thereof; and locally irradiating an energy beam onto the defective portion of the workpiece to heat the defective portion of the workpiece.
Claim 20
Independent Claim
220 words
A method for selectively electrolessly plating or etching a surface of a workpiece having a defective portion thereon, comprising the steps of: locally circulating a continuously flowing electroless solution, being selected from one of a plating solution and an etching solution, so as to cause the defective portion of the workpiece and an immediately surrounding area thereof to be in contact with a fresh electroless solution, whereby another area of the workpiece does not have the electroless solution in contact therewith, so that only the defective portion and the immediately surrounding area thereof, of the workpiece, is in contact with electroless solution, wherein during the locally circulating step an electroless solution cell is positioned above the workpiece, so as to locally supply the continuously flowing electroless solution to the defective portion of the workpiece and the immediately surrounding area thereof, and a pad is directly positioned on the surface of the workpiece so as to expose only the defective portion of the workpiece and the immediately surrounding area thereof, the pad and electroless solution cell, in combination, confining the continuously flowing electroless solution, in its exposure to the workpiece, to the defective portion and the immediately surrounding area thereof; and locally irradiating an energy beam onto the defective portion of the workpiece to heat the defective portion of the workpiece.
Claim 21
Independent Claim
194 words
A method for selectively electrolessly plating or etching a surface of a substrate to form a micro-pattern on the surface of the workpiece, comprising the steps of: locally continuously circulating an electroless solution, being selected from one of a plating solution and an etching solution, so as to cause the surface of the substrate to be in contact with said electroless solution, with only a portion of the surface of the substrate being exposed to the electroless solution, wherein during the locally continuously circulating step an electroless solution cell is positioned above the substrate, so as to locally supply the electroless solution to the portion of the surface exposed to the electroless solution, and a pad is directly positioned on the surface of the substrate so as to expose said portion of the surface exposed to the electroless solution, the pad and electroless solution cell, in combination, confining the electroless solution, in its exposure to the substrate, to said portion of the surface; and locally irradiating an energy beam onto the surface of the substrate to heat the surface of the workpiece; so as to form a micro-pattern on the surface of the substrate.
Claim 22
Independent Claim
194 words
A method for selectively electrolessly plating or etching a surface of a substrate to form a micro-pattern on the surface of the workpiece, comprising the steps of: locally continuously circulating an electroless solution, being selected from one of a plating solution and an etching solution, so as to cause the surface of the substrate to be in contact with said electroless solution, with only a portion of the surface of the substrate being exposed to the electroless solution, wherein during the locally continuously circulating step an electroless solution cell is positioned above the substrate, so as to locally supply the electroless solution to the portion of the surface exposed to the electroless solution, and a pad is directly positioned on the surface of the substrate so as to expose said portion of the surface exposed to the electroless solution, the pad and electroless solution cell, in combination, confining the electroless solution, in its exposure to the substrate, to said portion of the surface; and locally irradiating an energy beam onto the surface of the substrate to heat the surface of the workpiece; so as to form a micro-pattern on the surface of the substrate.
Claim 23
Dependent Claim
57 words
A method for selectively electrolessly plating or etching a surface of a substrate according to claim 17, wherein the energy beam is locally irradiated onto said portion of the surface of the substrate to heat said portion of the surface of the substrate, and said micro-pattern is formed on said portion of the surface of the substrate.
Claim 24
Independent Claim
124 words
A method for selectively electrolessly plating or etching a surface of a workpiece having a defective portion thereon, comprising the steps of: locally circulating a continuously flowing electroless solution, being selected from one of a plating solution and an etching solution, to the defective portion of the workpiece and a surrounding area thereof, with only the defective portion and a surrounding area thereof, of the workpiece, being supplied with electroless solution, wherein during the locally circulating step a cell is positioned directly on the workpiece so as to locally supply the continuously flowing electroless solution to the portion of the workpiece and the surrounding area thereof; and locally irradiating an energy beam onto the defective portion of the workpiece to heat the defective portion.
Claim 25
Independent Claim
124 words
A method for selectively electrolessly plating or etching a surface of a workpiece having a defective portion thereon, comprising the steps of: locally circulating a continuously flowing electroless solution, being selected from one of a plating solution and an etching solution, to the defective portion of the workpiece and a surrounding area thereof, with only the defective portion and a surrounding area thereof, of the workpiece, being supplied with electroless solution, wherein during the locally circulating step a cell is positioned directly on the workpiece so as to locally supply the continuously flowing electroless solution to the portion of the workpiece and the surrounding area thereof; and locally irradiating an energy beam onto the defective portion of the workpiece to heat the defective portion.
Claim 26
Dependent Claim
40 words
A method for selectively electrolessly plating or etching a surface of a workpiece according to claim 19, wherein the defective portion of the workpiece and immediately surrounding area thereof are caused to be in contact with a fresh electroless solution.
Claim 27
Independent Claim
173 words
A method for selectively electrolessly plating or etching a surface of a workpiece having a defective portion thereon, comprising the steps of: setting the workpiece in an electroless solution, selected from one of a plating solution and an etching solution, so that only the defective portion and a surrounding area thereof, of the workpiece, are exposed to the electroless solution; locally circulating a continuous flow of said electroless solution to the defective portion and a surrounding area thereof, with only the defective portion and a surrounding area thereof, of the workpiece, being in contact with the electroless solution, wherein during the locally circulating step a cell is positioned directly on the workpiece so as to locally supply the continuously flowing electroless solution to the portion of the workpiece and the surrounding area thereof; and locally irradiating an energy beam onto the defective portion of the workpiece, to heat the defective portion of the workpiece, said electroless solution flowing in substantially the same direction as a direction of an irradiation of said energy beam.
Claim 28
Independent Claim
173 words
A method for selectively electrolessly plating or etching a surface of a workpiece having a defective portion thereon, comprising the steps of: setting the workpiece in an electroless solution, selected from one of a plating solution and an etching solution, so that only the defective portion and a surrounding area thereof, of the workpiece, are exposed to the electroless solution; locally circulating a continuous flow of said electroless solution to the defective portion and a surrounding area thereof, with only the defective portion and a surrounding area thereof, of the workpiece, being in contact with the electroless solution, wherein during the locally circulating step a cell is positioned directly on the workpiece so as to locally supply the continuously flowing electroless solution to the portion of the workpiece and the surrounding area thereof; and locally irradiating an energy beam onto the defective portion of the workpiece, to heat the defective portion of the workpiece, said electroless solution flowing in substantially the same direction as a direction of an irradiation of said energy beam.
Claim 29
Dependent Claim
40 words
A method for selectively electrolessly plating or etching a surface of a workpiece according to claim 21, wherein the defective portion of the workpiece and immediately surrounding area thereof are caused to be in contact with a fresh electroless solution.
Claim 30
Independent Claim
140 words
A method of selectively electrolessly plating or etching a surface of a workpiece, comprising the steps of: locally and selectively directing a flow of electroless solution, selected from the group consisting of electroless plating solution and electroless etching solution, to a selected portion of the workpiece, with only said selected portion of the workpiece and a surrounding area thereof, of the workpiece, being in contact with said electroless solution, so as to electrolessly plate or electrolessly etch, respectively, said selected portion of the workpiece, wherein during the locally circulating step a cell is positioned directly on the workpiece so as to locally supply the continuously flowing electroless solution to the portion of the workpiece and the surrounding area thereof; and locally irradiating an energy beam onto said selected portion of the workpiece to heat the selected portion of the workpiece.
Claim 31
Independent Claim
140 words
A method of selectively electrolessly plating or etching a surface of a workpiece, comprising the steps of: locally and selectively directing a flow of electroless solution, selected from the group consisting of electroless plating solution and electroless etching solution, to a selected portion of the workpiece, with only said selected portion of the workpiece and a surrounding area thereof, of the workpiece, being in contact with said electroless solution, so as to electrolessly plate or electrolessly etch, respectively, said selected portion of the workpiece, wherein during the locally circulating step a cell is positioned directly on the workpiece so as to locally supply the continuously flowing electroless solution to the portion of the workpiece and the surrounding area thereof; and locally irradiating an energy beam onto said selected portion of the workpiece to heat the selected portion of the workpiece.
Claim 32
Dependent Claim
40 words
A method for selectively electrolessly plating or etching a surface of a workpiece according to claim 23, wherein the selected portion of the workpiece and immediately surrounding area thereof are caused to be in contact with a fresh electroless solution.
References Cited (Backward Citations)
US2956900A
Cited
US3761305A
Cited
US4042006A
Cited
US4239789A
Cited
US4259367A
Cited
US4349583A
Cited
US4511595A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1991-08-23 | 1992-02-22 | 1992-08-23 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1995-08-23 | 1996-02-22 | 1996-08-23 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1999-08-23 | 2000-02-22 | 2000-08-23 | $7700.00 | Window Closed / Lapsed |