US4758459A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Molded circuit board
Assignee: Nortel Networks Ltd
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Filing: 1987-01-28
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Granted: 1988-07-19
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Expires: 2007-01-28
Abstract
Abstract A circuit board is molded of a heat resistant synthetic resin. Component mounting positions are formed at the time of molding, the mounting positions comprising formations, such as recesses or protrusions, on at least one surface. A circuit pattern is formed on at least one surface and the circuit pattern extends to and over a surface of each formation. A circuit board can be planar or non-planar and be of any desired shape, not necessarily rectangular.
Inventors
- 👤 Mahendra C. Mehta
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-26 11:02
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/36; H05K3/366; H05K1/00; H05K1/02; H05K1/11; H05K1/119; H05K1/18; H05K1/182; H05K1/183; H05K3/30; H05K3/32; H05K3/325; H05K3/326; H05K1/0284; H05K1/117; H05K2201/00; H05K2201/09; H05K2201/09009; H05K2201/09036; H05K2201/09045; H05K2201/09081; H05K2201/09118; H05K2201/09209; H05K2201/09372; H05K2201/09472; H05K2201/10; H05K2201/10431; H05K2201/1059; H05K3/34; H05K3/341; H05K3/3431; H05K3/3442; Y; Y10; Y10S; Y10S428/00; Y10S428/901; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49155; Y10T29/49158; Y10T428/00; Y10T428/24; Y10T428/24273; Y10T428/24802; Y10T428/24917
Claims Analysis
Total Claims: 29
Claim 1
Independent Claim
67 words
A circuit board of molded heat resistant synthetic resin, comprising: a circuit pattern on at least one of opposite surfaces of said board; a plurality of component mounting positions molded on at least one said surface, said mounting positions further comprising integrally molded formations, said circuit pattern extending to said formations and over at least part of a surface of each of said formations to form contacts.
Claim 2
Dependent Claim
67 words
A circuit board of molded heat resistant synthetic resin, comprising: a circuit pattern on at least one of opposite surfaces of said board; a plurality of component mounting positions molded on at least one said surface, said mounting positions further comprising integrally molded formations, said circuit pattern extending to said formations and over at least part of a surface of each of said formations to form contacts.
Claim 3
Dependent Claim
18 words
A circuit board as claimed in claim 1, said formations comprising recesses in said at least one surface.
Claim 4
Dependent Claim
18 words
A circuit board as claimed in claim 1, said formations comprising protrusions on said at least one surface.
Claim 5
Dependent Claim
15 words
A circuit board as claimed in claim 1, said formations comprising holes through said board.
Claim 6
Dependent Claim
14 words
A circuit board as claimed in claim 1, comprising a flat, planar molded board.
Claim 7
Dependent Claim
13 words
A circuit board as claimed in claim 1, having a rectangular plan form.
Claim 8
Dependent Claim
34 words
A circuit board as claimed in claim 1, at least one of said mounting positions comprising a wall extending from at least one surface, and at least one component mounting position on said wall.
Claim 9
Dependent Claim
19 words
A circuit board as claimed in claim 7, including a component mounting position on opposite sides of said wall.
Claim 10
Dependent Claim
15 words
A circuit board as claimed in claim 1, including component mounting positions on both surfaces.
Claim 11
Dependent Claim
19 words
A circuit board as claimed in claim 1, said component mounting positions comprising mounting positions for further circuit boards.
Claim 12
Dependent Claim
21 words
A circuit board as claimed in claim 1, each said formation forming a contact formation for one contact of a component.
Claim 13
Dependent Claim
26 words
A circuit board as claimed in claim 1, at least one of said formations having a plurality of contact areas for mounting of a multi-contact component.
Claim 14
Dependent Claim
23 words
A circuit board as claimed in claim 1, said component mounting positions on one surface, and a metal layer on the other surface.
Claim 15
Dependent Claim
38 words
A circuit board as claimed in claim 1, said circuit board being in the form of a hollow box and including mounting positions on at least one wall of said box for mounting of further circuit boards thereon.
Claim 16
Dependent Claim
14 words
A circuit board as claimed in claim 1, including apertures formed in said board.
Claim 17
Independent Claim
100 words
A method of forming a circuit board comprising the steps of: molding a heat resistant synthetic resin into a circuit board having a plurality of component mounting positions on at least one of opposite surfaces of said circuit board, integrally molding formations at said component mounting positions at the time of molding said resin into a said circuit board, forming a circuit pattern on at least one surface of said circuit board, extending said circuit pattern to said formation, and forming contacts at each said formation by extending said circuit pattern over at least a part of each said formation.
Claim 18
Independent Claim
100 words
A method of forming a circuit board comprising the steps of: molding a heat resistant synthetic resin into a circuit board having a plurality of component mounting positions on at least one of opposite surfaces of said circuit board, integrally molding formations at said component mounting positions at the time of molding said resin into a said circuit board, forming a circuit pattern on at least one surface of said circuit board, extending said circuit pattern to said formation, and forming contacts at each said formation by extending said circuit pattern over at least a part of each said formation.
Claim 19
Dependent Claim
28 words
A method of forming a circuit board as recited in claim 16 wherein the step of molding formations further comprises forming recesses in at least one said surface.
Claim 20
Dependent Claim
28 words
A method of forming a circuit board as recited in claim 16 wherein the step of molding formations further comprises forming protrusions on at least one said surface.
Claim 21
Dependent Claim
26 words
A method of forming a circuit board as recited in claim 16 wherein the step of molding formations further comprises forming holes through said circuit board.
Claim 22
Dependent Claim
33 words
A method of forming a circuit board as recited in claim 16 wherein the step of molding a heat resistant resin into a circuit board further comprises forming a flat, planar molded board.
Claim 23
Dependent Claim
37 words
A method of forming a circuit board as recited in claim 16 further comprising: forming a wall extending from at least one surface of said board, and forming at least one component mounting position on said wall.
Claim 24
Dependent Claim
27 words
A method of forming a circuit board as recited in claim 21 further comprising forming at least one component mounting position on opposite sides of said wall.
Claim 25
Dependent Claim
25 words
A method of forming a circuit board as recited in claim 16 further comprising forming component mounting positions on opposite surfaces of said circuit board.
Claim 26
Dependent Claim
28 words
A method for forming a circuit board as recited in claim 16 further comprising forming a contact area for one contact of a component of each said formation.
Claim 27
Dependent Claim
32 words
A method of forming a circuit board as recited in claim 16 further comprising forming at least one of said formations with a plurality of contact areas for mounting a multicontact components.
Claim 28
Dependent Claim
37 words
A method of a circuit board as recited in claim 16 furhter comprising forming component mounting positions on one surface of said circuit board and forming a metal layer on said opposite surface of said circuit board.
Claim 29
Dependent Claim
43 words
A mtheod of forming a circuit board as recited in claim 16 further comprising: forming said circuit board in the form of a hollow box, and forming mounting positions for mounting further circuit boards in at least one wall of said hollow box.
References Cited (Backward Citations)
US4295183A
Cited
US4402135A
Cited
US4433009A
Cited
US4403107A
Cited
US4604799A
Cited
US4614837A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1991-07-19 | 1992-01-18 | 1992-07-19 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1995-07-19 | 1996-01-18 | 1996-07-19 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1999-07-19 | 2000-01-18 | 2000-07-19 | $7700.00 | Window Closed / Lapsed |