US4433009A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of manufacturing printed circuits
Assignee: Bayer Pharma AG
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Filing: 1981-06-08
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Granted: 1984-02-21
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Expires: 2001-06-08
Abstract
Abstract In accordance with the method of manufacturing printed circuits, a base material is provided with a plurality of holes in correspondence with the required conductors pattern, the base material with the holes is coated by a photopolymer layer, the photopolymer layer is selectively exposed and developed so as to release zones and boreholes for forming conductive paths, solder eyes and connecting contacts between both sides of the plate, then the layer of the current conductive material is applied in the regions of the thus released zones and boreholes so as to form the above-mentioned conductive paths, solder eyes and connecting contacts.
Inventors
- 👤 Helmut Henze
- 👤 Ronald Capell
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-27 03:58
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/10; H05K3/18; H05K3/181; H05K3/182; H05K3/184; H05K2203/00; H05K2203/07; H05K2203/0779; H05K2203/0786; H05K2203/0789; H05K2203/14; H05K2203/1415; H05K3/38; H05K3/386; H05K3/387; H05K3/40; H05K3/42; H05K3/425; H05K3/426
Claims Analysis
Total Claims: 17
Claim 1
Independent Claim
146 words
A method of manufacturing printed circuits, comprising the steps of successively providing a base material having two sides and provided with an adhesive agent; forming a plurality of holes in the base material, in correspondence with a required conductors pattern, so as to subsequently provide for metal contact between conductive trains applied on both sides of a plate; coating the base material provided with the holes, by a photopolymer layer; selectively exposing and developing the photopolymer layer on the base material so as to release zones and boreholes for forming conductive paths, solder eyes and connecting contacts between both sides of the plate; selectively roughening the adhesive agent on the base material in the thus released zones; and applying a current-conductive layer in the regions of the thus released and roughened zones and boreholes so as to form the conductive paths, solder eyes and connecting contacts.
Claim 2
Independent Claim
146 words
A method of manufacturing printed circuits, comprising the steps of successively providing a base material having two sides and provided with an adhesive agent; forming a plurality of holes in the base material, in correspondence with a required conductors pattern, so as to subsequently provide for metal contact between conductive trains applied on both sides of a plate; coating the base material provided with the holes, by a photopolymer layer; selectively exposing and developing the photopolymer layer on the base material so as to release zones and boreholes for forming conductive paths, solder eyes and connecting contacts between both sides of the plate; selectively roughening the adhesive agent on the base material in the thus released zones; and applying a current-conductive layer in the regions of the thus released and roughened zones and boreholes so as to form the conductive paths, solder eyes and connecting contacts.
Claim 3
Dependent Claim
22 words
A method as defined in claim 1, wherein said step of applying a current-conductive layer includes using a current-conductive layer of metal.
Claim 4
Dependent Claim
31 words
A method as defined in claim 1, wherein said step of coating with a photopolymer layer includes using a film and applying the polymer layer by direct suction of the latter.
Claim 5
Dependent Claim
25 words
A method as defined in claim 3, wherein said step of selectively exposing and developing the photopolymer layer includes exposing the latter with a UV-lamp.
Claim 6
Dependent Claim
42 words
A method as defined in claim 1, wherein said roughening step includes dissolving the zones of the base material with the adhesive agent, which zones have been released by the exposing and developing, said dissolving step includes dissolving by a solving agent.
Claim 7
Dependent Claim
47 words
A method as defined in claim 5, wherein said roughening step includes disintegrating the zones of the base material provided with the adhesive agent, which zones have been released by the exposing and developing, said disintegrating step includes disintegrating the same by an aggressive agent layer thereto.
Claim 8
Dependent Claim
27 words
A method as defined in claim 5, wherein said step of disintegrating by the aggressive agent includes using for the same a chromium sulphuric acid etching agent.
Claim 9
Dependent Claim
44 words
A method as defined in claim 5, wherein said step of coating the base material with a photopolymer layer to be exposed and developed includes using for the photopolymer layer a layer resistant to a respective one of said solving agent and disintegrating agent.
Claim 10
Dependent Claim
49 words
A method as defined in claim 6; and further comprising the step of activating the zones released by the exposing and developing of the photopolymer layer, after the roughening, said step of applying a current-conductive layer includes applying a first chemically deposited metal layer after the roughening and activating.
Claim 11
Dependent Claim
24 words
A method as defined in claim 9; and further comprising the step of removing the photopolymer layer after applying the first chemically deposited layer.
Claim 12
Dependent Claim
23 words
A method as defined in claim 10, wherein said step of removing the photopolymer layer includes removing the same by a solving agent.
Claim 13
Dependent Claim
23 words
A method as defined in claim 11, wherein said step of removing the photopolymer layer includes removing the same by an organic solvent.
Claim 14
Dependent Claim
24 words
A method as defined in claim 11, wherein said step of removing the photopolymer layer includes removing the same by a water alkaline solution.
Claim 15
Dependent Claim
29 words
A method as defined in claim 1; and further comprising the step of current-free copperplating of the conductors, selectively without masking of a plate region determining an insulating surface.
Claim 16
Independent Claim
208 words
A method of manufacturing printed circuits, comprising the steps of successively providing a base insulating material having two sides and provided with an adhesive agent; forming a plurality of holes in the base material, in correspondence with a required conductors pattern, so as to subsequently provide for metal contact between conductive trains applied on both sides of a plate; coating the base material provided with the holes, by a photopolymer layer; selectively exposing and developing the photopolymer layer on the base material so as to release zones and boreholes for forming conductive paths, solder eyes and connecting contacts between both sides of the plate; selectively roughening the adhesive agent in the thus released zones and boreholes by dissolving the zone of the insulating material with the adhesive agent by a solving agent and/or by disintegrating the zones of the insulating material provided with the adhesive agent by an aggressive agent; activating the zones released by the exposing and developing of the photopolymer layer after the roughening; and applying a first chemically deposited metal layer after the roughening and activating and then a current-conductive layer in the regions of the thus released and roughened zones and boreholes so as to form the conductive paths, solder eyes and connecting contacts.
Claim 17
Independent Claim
208 words
A method of manufacturing printed circuits, comprising the steps of successively providing a base insulating material having two sides and provided with an adhesive agent; forming a plurality of holes in the base material, in correspondence with a required conductors pattern, so as to subsequently provide for metal contact between conductive trains applied on both sides of a plate; coating the base material provided with the holes, by a photopolymer layer; selectively exposing and developing the photopolymer layer on the base material so as to release zones and boreholes for forming conductive paths, solder eyes and connecting contacts between both sides of the plate; selectively roughening the adhesive agent in the thus released zones and boreholes by dissolving the zone of the insulating material with the adhesive agent by a solving agent and/or by disintegrating the zones of the insulating material provided with the adhesive agent by an aggressive agent; activating the zones released by the exposing and developing of the photopolymer layer after the roughening; and applying a first chemically deposited metal layer after the roughening and activating and then a current-conductive layer in the regions of the thus released and roughened zones and boreholes so as to form the conductive paths, solder eyes and connecting contacts.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1987-02-20 | 1987-08-22 | 1988-02-21 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1991-02-20 | 1991-08-22 | 1992-02-21 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1995-02-20 | 1995-08-22 | 1996-02-21 | $7700.00 | Window Closed / Lapsed |