Treatment basin for semiconductor material

Claim 1

A square basin for applying a treatment such as etching, development, plating or washing to surfaces of semiconductor materials supported in a carrier having at least two leg portions, said basin comprising: a base, the surface of said base facing the treatment liquid being downwardly slanting, and four side walls, said carrier being disposed within said basin, a passage in the center of the base at the bottom of said downwardly-slanting surface for introducing treatment liquid upwardly into the basin, said liquid then overflowing the top periphery of the side walls of the basin, two essentially parallel channels integrally formed within the base of the basin, two rows of inwardly-upwardly directed straight holes of 0.5 to 2.0 mm diameter integrally formed within the base of the basin, each row connecting one of the channels to the inside of the basin, the holes in one row being in staggered relation to the holes in the other row, wherein each hole discharges a single jet of treatment liquid in an upward-inward direction into a zone between the leg portions of the carrier, to thereby cause an up and down swirling motion in the liquid.