Wafer processing method and device using processing solution

Abstract

Abstract PURPOSE:To prevent adhesion of floating matters on the wafer by a method wherein the floating matters on the surface of water are removed by forcedly flowing them out of a vessel. CONSTITUTION:Opening and closing valves 9 and 10 are opened, and water is supplied from two water feeding ports 4 and 8. The floating matters generated on the surface of water are flown to the lower stream by the water current which is parallel to the surface of water coming from the second water feeding port 8, and flown out of the vessel. When a carrier is pulled up, there exists no floating matters on the surface of water where the carrier passes, and the wafers 1 are not contaminated by the floating matters.

Inventors

• 👤 Itaru Yamanaka
• 👤 山仲　格

Bibliographic Details