US4739382A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Package for a charge-coupled device with temperature dependent cooling
Assignee: Bank One Kentucky NA
•
Filing: 1985-05-31
•
Granted: 1988-04-19
•
Expires: 2005-05-31
Abstract
Abstract A charge-coupled device package comprises a substrate of dielectric material and a charge-coupled device die mounted on one main face of the substrate. The substrate is placed in heat exchange relationship with a cold sink, such as a bath of LN 2 . A temperature sensor senses the temperature at a location on the main face that is in close proximity ot the die. A film resistor is adhered to the opposite main face of the substrate and receives a current that depends upon the temperature sensed by the sensor.
Inventors
- 👤 Morley M. Blouke
- 👤 Raymond S. Enochs
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-31 13:46
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/30; H10W40/305
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
55 words
A hybrid integrated circuit package comprising a substrate of dielectric material having two main faces, at least one integrated circuit die mounted on one main face of the substrate, a temperature sensing resistor incorporated within said at least one integrated circuit die, and a film resistor adhered to the opposite main face of the substrate.
Claim 2
Dependent Claim
55 words
A hybrid integrated circuit package comprising a substrate of dielectric material having two main faces, at least one integrated circuit die mounted on one main face of the substrate, a temperature sensing resistor incorporated within said at least one integrated circuit die, and a film resistor adhered to the opposite main face of the substrate.
Claim 3
Dependent Claim
16 words
A package according to claim 1, wherein the integrated circuit die is a charge-coupled device die.
Claim 4
Dependent Claim
64 words
A hybrid integrated circuit package comprising a substrate of dielectric material having two main faces, at least one integrated circuit die mounted on one main face of the substrate, means for sensing the temperature at a location on said one main face that is in close proximity to the die, and a thick film resistor adhered to the opposite main face of the substrate.
Claim 5
Dependent Claim
64 words
A hybrid integrated circuit package comprising a substrate of dielectric material having two main faces, at least one integrated circuit die mounted on one main face of the substrate, means for sensing the temperature at a location on said one main face that is in close proximity to the die, and a thick film resistor adhered to the opposite main face of the substrate.
Claim 6
Dependent Claim
16 words
A package according to claim 3, wherein the integrated circuit die is a charge-coupled device die.
Claim 7
Independent Claim
80 words
A device for controlling the temperature of an integrated circuit comprising: a substrate of dielectric material having two main faces, at least one integrated circuit die mounted on one main face of the substrate; means for sensing the temperature at a location on said one main face that is in close proximity to the die a film resistor adhered to the opposite main face of the substrate, and a heat absorbing means that is loosely thermally coupled to said substrate.
Claim 8
Independent Claim
80 words
A device for controlling the temperature of an integrated circuit comprising: a substrate of dielectric material having two main faces, at least one integrated circuit die mounted on one main face of the substrate; means for sensing the temperature at a location on said one main face that is in close proximity to the die a film resistor adhered to the opposite main face of the substrate, and a heat absorbing means that is loosely thermally coupled to said substrate.
Claim 9
Dependent Claim
35 words
The device of claim 5 wherein said heat absorbing means comprises a cryogenically cooled vessel, a block of thermally conductive metal attached to said substrate, and connective means for interconnecting said vessel and said metal.
Claim 10
Dependent Claim
19 words
The device of claim 6 wherein said thermally conductive metal is copper and said connective means comprises copper braid.
References Cited (Backward Citations)
US3440407A
Cited
US3431392A
Cited
US3714527A
Cited
US4009482A
Cited
US3872418A
Cited
US3887785A
Cited
US4329701A
Cited
US4374316A
Cited
US4422091A
Cited
JPS59104187A
Cited
JPS59136968A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1991-04-19 | 1991-10-19 | 1992-04-19 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1995-04-19 | 1995-10-19 | 1996-04-19 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1999-04-19 | 1999-10-19 | 2000-04-19 | $7700.00 | Window Closed / Lapsed |