Method for forming electrically conductive circuits on a base board

Claim 1

A method for forming electrically conductive circuits on a base board comprising the steps of: (a) forming a first electrically conductive circuit layer on one side of the base board, the first circuit layer being receptive to metal plating; (b) coating a plating-resistant resist of the same side of the base board in a pattern excluding certain portions of the first circuit layer which are required to be electrically connected to another circuit layer to be subsequently formed on the first circuit layer; (c) coating an electrically conductive copper paste receptive to metal plating on the same side of the base board in a manner as to electrically connect said portions of the first circuit layer, except on certain regions of said portions of the first circuit layer which are to be subsequently processed with a metal plating; (d) heating the base board to harden the conductive copper paste; (e) cleansing the coated base board; and (f) immersing the base board in a metal plating solution to form a metal plating on the electrically conductive copper paste and on said regions of said portions of the first circuit layer, to thereby form a second electrically conductive circuit layer on the first circuit layer.

Claim 2

A method for forming electrically conductive circuits on a base board comprising the steps of: (a) forming a first electrically conductive circuit layer on one side of the base board, the first circuit layer being receptive to metal plating; (b) coating a plating-resistant resist of the same side of the base board in a pattern excluding certain portions of the first circuit layer which are required to be electrically connected to another circuit layer to be subsequently formed on the first circuit layer; (c) coating an electrically conductive copper paste receptive to metal plating on the same side of the base board in a manner as to electrically connect said portions of the first circuit layer, except on certain regions of said portions of the first circuit layer which are to be subsequently processed with a metal plating; (d) heating the base board to harden the conductive copper paste; (e) cleansing the coated base board; and (f) immersing the base board in a metal plating solution to form a metal plating on the electrically conductive copper paste and on said regions of said portions of the first circuit layer, to thereby form a second electrically conductive circuit layer on the first circuit layer.

Claim 5

A method for forming electrically conductive circuits on a base board comprising the steps of: (a) attaching a copper layer on one side of the base board; (b) etching the copper layer to form a first electrically conductive circuit layer; (c) coating a plating-resistant resist on the same side of the base board except on certain portions of the first circuit layer which are required to be electrically connected to another circuit layer to be subsequently formed on the first circuit layer; (d) coating an electrically conductive copper paste receptive to metal plating on the same side of the base board in a manner as to electrically connect said portions of the first circuit layer, except on certain regions of said portions of the first circuit layer which are to be subsequently processed with a metal plating; (e) heating the base board to harden the conductive copper paste; (f) cleansing the coated base board; and (g) immersing the base board in a metal plating solution to form a metal plating on the electrically conductive copper paste and on said regions of the first circult layer, to thereby form a second electrically conductive circuit layer on the first circuit layer, thus providing at least two layers of circuits electrically connected to each other on one side of the base board.

Claim 6

A method for forming electrically conductive circuits on a base board comprising the steps of: (a) attaching a copper layer on one side of the base board; (b) etching the copper layer to form a first electrically conductive circuit layer; (c) coating a plating-resistant resist on the same side of the base board except on certain portions of the first circuit layer which are required to be electrically connected to another circuit layer to be subsequently formed on the first circuit layer; (d) coating an electrically conductive copper paste receptive to metal plating on the same side of the base board in a manner as to electrically connect said portions of the first circuit layer, except on certain regions of said portions of the first circuit layer which are to be subsequently processed with a metal plating; (e) heating the base board to harden the conductive copper paste; (f) cleansing the coated base board; and (g) immersing the base board in a metal plating solution to form a metal plating on the electrically conductive copper paste and on said regions of the first circult layer, to thereby form a second electrically conductive circuit layer on the first circuit layer, thus providing at least two layers of circuits electrically connected to each other on one side of the base board.

Claim 8

A method for forming electrically conductive circuits on a base board comprising the steps of: (a) coating an electrically conductive copper paste receptive to metal plating on one side of the base board; (b) heating the base board to harden the paste; (c) cleansing the base board; (d) immersing the base board in a metal plating solution to form a metal plating on the electrically conductive copper paste, to thereby form a first electrically conductive circuit layer; (e) coating a plating-resistant resist on the same side of the base board except on certain portions of the first circuit layer which are required to be electrically connected to another circuit layer to be subsequently formed on the first circuit layer; (f) coating said electrically conductive copper paste on the same side of the base board in a manner as to electrically connect said portions of the first circuit layer, except on certain regions of said portions of the first circuit layer which are to be subsequently processed with a metal plating; (g) heating the base board to harden the paste; (h) cleansing the base board; and (i) immersing the base board in a metal plating solution to form a metal plating on the electrically conductive copper paste and on said regions of the first circuit layer, to thereby form a second electrically conductive circuit layer on the first circuit layer, thus providing at least two layers of circuits electrically connected to each other on one side of the base board.

Claim 9

A method for forming electrically conductive circuits on a base board comprising the steps of: (a) coating an electrically conductive copper paste receptive to metal plating on one side of the base board; (b) heating the base board to harden the paste; (c) cleansing the base board; (d) immersing the base board in a metal plating solution to form a metal plating on the electrically conductive copper paste, to thereby form a first electrically conductive circuit layer; (e) coating a plating-resistant resist on the same side of the base board except on certain portions of the first circuit layer which are required to be electrically connected to another circuit layer to be subsequently formed on the first circuit layer; (f) coating said electrically conductive copper paste on the same side of the base board in a manner as to electrically connect said portions of the first circuit layer, except on certain regions of said portions of the first circuit layer which are to be subsequently processed with a metal plating; (g) heating the base board to harden the paste; (h) cleansing the base board; and (i) immersing the base board in a metal plating solution to form a metal plating on the electrically conductive copper paste and on said regions of the first circuit layer, to thereby form a second electrically conductive circuit layer on the first circuit layer, thus providing at least two layers of circuits electrically connected to each other on one side of the base board.