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US4732733A
Expired / Lapsed
US
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Copper-base alloys for leadframes
Assignee: Proterial Ltd
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Filing: 1986-08-22
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Granted: 1988-03-22
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Expires: 2006-08-22
Abstract
Abstract A copper-base alloy for leadframes consisting essentially of 0.8-4.0 weight % of Ni, 0.2-4.0 weight % of Ti and 0.05-0.6 weight % of Mg, the balance being essentially Cu and inevitable impurities, and a ratio of Ni to Ti being 1-4. This copper-base alloy has high mechanical strength of about 50 kgf/mm 2 or more and electric conductivity of 30% IACS or more as well as good solderability and solder durability. Thus, it may be used as a highly reliable material for leadframes of semiconductor devices.
Inventors
- 👤 Daiji Sakamoto
- 👤 Rikizo Watanabe
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 13:35
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/456; C; C22; C22C; C22C9/00; C22C9/06; Y; Y10; Y10T; Y10T428/00; Y10T428/12; Y10T428/12493; Y10T428/12528
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
41 words
A copper-base alloy for leadframes consisting essentially of 0.8-4.0 weight % of Ni, 0.2-4.0 weight % of Ti and 0.05-0.6 weight % of Mg, the balance being essentially Cu and inevitable impurities, and a ratio of Ni to Ti being 1-4.
Claim 2
Dependent Claim
41 words
A copper-base alloy for leadframes consisting essentially of 0.8-4.0 weight % of Ni, 0.2-4.0 weight % of Ti and 0.05-0.6 weight % of Mg, the balance being essentially Cu and inevitable impurities, and a ratio of Ni to Ti being 1-4.
Claim 3
Dependent Claim
48 words
A copper-base alloy for leadframes consisting essentially of 0.8-4.0 weight % of Ni, 0.2-4.0 weight % of Ti, 0.05-0.6 weight % of Mg and 0.1-1.0 weight % of Mn in total, the balance being essentially Cu and inevitable impurities, and a ratio of Ni to Ti being 1-4.
Claim 4
Dependent Claim
48 words
A copper-base alloy for leadframes consisting essentially of 0.8-4.0 weight % of Ni, 0.2-4.0 weight % of Ti, 0.05-0.6 weight % of Mg and 0.1-1.0 weight % of Mn in total, the balance being essentially Cu and inevitable impurities, and a ratio of Ni to Ti being 1-4.
Claim 5
Dependent Claim
26 words
The copper-base alloy for leadframes according to claim 1, wherein Ni is 1.0-3.0 weight %, Ti is 0.5-1.5 weight % and Mg is 0.05-0.40 weight %.
Claim 6
Dependent Claim
26 words
The copper-base alloy for leadframes according to claim 2, wherein Ni is 1.0-3.0 weight %, Ti is 0.5-1.5 weight % and Mg is 0.05-0.40 weight %.
Claim 7
Dependent Claim
47 words
The copper-base alloy for leadframes according to claim 1, wherein Ni is about 2 weight %, Ti is about 1 weight % and Mg is about 0.2 weight %, the balance being essentially Cu and inevitable impurities, and the ratio of Ni to Ti being about 2.
Claim 8
Dependent Claim
51 words
A leadframe for use in semiconductor devices, said leadframe being made of a copper-base alloy consisting essentially of 0.8-4.0 weight % of Ni, 0.2-4.0 weight % of Ti and 0.05-0.6 weight % of Mg, the balance being essentially Cu and inevitable impurities, and a ratio of Ni to Ti being 1-4.
Claim 9
Dependent Claim
51 words
A leadframe for use in semiconductor devices, said leadframe being made of a copper-base alloy consisting essentially of 0.8-4.0 weight % of Ni, 0.2-4.0 weight % of Ti and 0.05-0.6 weight % of Mg, the balance being essentially Cu and inevitable impurities, and a ratio of Ni to Ti being 1-4.
Claim 10
Dependent Claim
58 words
A leadframe for use in semiconductor devices, said leadframe being made of a copper-base alloy consisting essentially of 0.8-4.0 weight % of Ni, 0.2-4.0 weight % of Ti, 0.05-0.6 weight % of Mg and 0.1-1.0 weight % of Mn in total, the balance being essentially Cu and inevitable impurities, and a ratio of Ni to Ti being 1-4.
Claim 11
Dependent Claim
58 words
A leadframe for use in semiconductor devices, said leadframe being made of a copper-base alloy consisting essentially of 0.8-4.0 weight % of Ni, 0.2-4.0 weight % of Ti, 0.05-0.6 weight % of Mg and 0.1-1.0 weight % of Mn in total, the balance being essentially Cu and inevitable impurities, and a ratio of Ni to Ti being 1-4.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1991-03-22 | 1991-09-21 | 1992-03-22 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1995-03-22 | 1995-09-21 | 1996-03-22 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1999-03-22 | 1999-09-21 | 2000-03-22 | $7700.00 | Window Closed / Lapsed |