Low loss and high speed diodes

Claim 1

A low loss, high speed and high breakdown voltage diode comprising: a semiconductor substrate; a semiconductor layer deposited on the upper surface of the semiconductor substrate and having a thickness dimension W whose value lies between upper and lower predetermined limiting critical values 5 μm<W<30 μm and having a resistivity p above a predetermined lower critical value p>1 Ωcm; first metal electrode means directly formed over the entire surface of the active region of the semiconductor layer and forming a Schottky barrier metal contact with the semiconductor layer, said Schottky barrier metal contact acting as one of the metal electrodes of said diode and forming bidirectional conducting Schottky potential barriers φh and φB with respect to hole and electron carriers, respectively, said Schottky potential barriers lying within critical values 0.1 eV<φh<0.4 eV or 0.7 eV<φB<1.0 eV which allows both hole and electron carriers to pass bidirectionally therethrough in opposite directions; second metal electrode means formed on the lower surface of said semiconductor substrate; and wherein the said diode is a silicon p-n junction diode, the semiconductor substrate is of n-type, the semiconductor layer is formed of a p-type epitaxial layer, and the said first electrode means makes a Schottky potential barrier with the p-type epitaxial layer to form the said bidirectional conducting Schottky barrier and wherein the said p-type epitaxial layer has the thickness of W and the resistivity of p, the first electrode means is formed by a metal layer having a Schottky potential barrier with a value of φh for holes moving from the said metal layer to the p-type epitaxial layer, and the values of p, φh, and W are in the range as defined below P>1 Ωcm 0.15 eV<φh<0.35 eV 5 μm<W<30 μm.