Process for preparing the through hole walls of a printed wiring board for electroplating

Claim 2

A process for electroplating the walls of through holes in a laminated printed wiring board comprised of at least one non-conducting layer laminated to at least two separate conductive metal layers, which comprises the steps: (a) contacting said printed wiring board with an aqueous alkaline silicate solution, followed by; (b) contacting said printed wiring board with a dispersion of carbon black comprising: (1) carbon black particles having an average particle size of less than about 3.0 microns in said dispersion; (2) an effective dispersing amount of a surfactant which is compatible with said carbon black; and (3) a liquid dispersing medium, wherein the amount of carbon black is sufficient to coat substantially all of the non-conducting portions of said hole walls and is less than about 4% by weight of said liquid dispersion; then (c) separating substantially all of the liquid dispersing medium from said dispersion, thereby depositing said carbon black particles in a substantially continuous layer on said non-conducting portions of said hole walls; and (d) electroplating a substantially continuous metal layer over the deposited carbon black layer on said non-conducting portions of hole walls, thereby electrically connecting said metal layers of said printed wiring board.

Claim 3

The process of claim 1 wherein said contacting step (a) is carried out by immersing the printed wiring board in an aqueous bath containing said alkaline silicate.

Claim 4

The process of claim 2 wherein said alkaline silicate solution is made in situ by the reaction of an alkaline hydroxide and fumed silica.

Claim 5

The process of claim 3 wherein the amount of said alkaline silicate is from about 0.5 to about 2.0% by weight of said aqueous bath.

Claim 6

The process of claim 4 wherein said contacting step (a) occurs at a temperature from about 20° C. to about 70° C.

Claim 7

The process of claim 1 wherein contacting step (a) is preceded by, or concurrently carried out with, a contacting step with a cleaner solution.

Claim 8

The process of claim 6 wherein said cleaner solution comprises a surfactant and an alkaline compound selected from the group consisting of amines and hydroxides.

Claim 9

The process of claim 1 wherein said printed wiring board is contacted with an aqueous conditioning solution between steps (a) and (b).

Claim 10

The process of claim 8 wherein said conditioning solution comprises the mixture of monoethanolamine and a polyamine resin in water.

Claim 11

The process of claim 8 wherein said conditioning solution comprises a mixture of stearamidopropyldimethylhydroxyethylammonium-dihydrogen phosphate and triethanolamine in water.

Claim 12

The process of claim 1 wherein said carbon black particles have an initial pH from about 2 to about 4.

Claim 13

The process of claim 1 wherein said surfactant is a phosphate ester anionic surfactant.

Claim 14

The process of claim 1 wherein said liquid dispersing medium is water.

Claim 15

The process of claim 1 wherein said liquid dispersion further comprises a sufficient amount of at least one alkaline hydroxide to raise the pH of said liquid dispersion to about 9 to about 14.

Claim 16

The process of claim 14 wherein said alkaline hydroxide is selected from the group consisting of potassium hydroxide, sodium hydroxide and ammonium hydroxide.

Claim 17

The process of claim 1 wherein said liquid dispersion contains less than about 10% by weight solids constituents.

Claim 18

The process of claim 1 wherein said conductive metal is copper.

Claim 19

The process of claim 1 wherein said process further comprises microetching said metal layers of said printed wiring board after step (c) and before step (d) to remove any deposited carbon black therefrom.

Claim 20

The process of claim 18 wherein said process further comprises a water rinse after said microetching.

Claim 21

A process for electroplating the walls of through holes in a laminated printed wiring board comprised of at least one non-conducting layer laminated to at least two separate conductive metal layers, which comprises the steps: (a) contacting said printed wiring board with a combined aqueous cleaner and alkaline silicate solution; (b) contacting said cleaned and silicate-treated printed wiring board with an aqueous conditioner solution; (c) contacting said printed wiring board with a liquid dispersion of carbon black comprising: (1) carbon black particles having an average particle size of less than about 3.0 microns in said dispersion; (2) an effective dispersing amount of a surfactant which is compatible with said carbon black; (3) a sufficient amount of at least one alkaline hydroxide to raise the pH of said liquid dispersion to about 9.5 to about 12; and (4) a liquid dispersing medium, wherein the amount of carbon black is sufficient to coat substantially all of the non-conducting portions of said hole walls and is less than about 4% by weight of said liquid dispersion; then (d) separating substantially all of the liquid dispersing medium from said dispersion, thereby depositing said carbon black particles in a substantially continuous layer on said non-conducting portions of said hole walls; and (e) microetching said metal layers of printed wiring board to remove any deposited carbon black therefrom; and (f) electroplating a substantially continuous metal layer over the deposited carbon black layer on said non-conducting portions of hole walls, thereby electrically connecting said metal layers of said printed wiring board.

Claim 22

A process for electroplating the walls of through holes in a laminated printed wiring board comprised of at least one non-conducting layer laminated to at least two separate conductive metal layers, which comprises the steps: (a) contacting said printed wiring board with a combined aqueous cleaner and alkaline silicate solution; (b) contacting said cleaned and silicate-treated printed wiring board with an aqueous conditioner solution; (c) contacting said printed wiring board with a liquid dispersion of carbon black comprising: (1) carbon black particles having an average particle size of less than about 3.0 microns in said dispersion; (2) an effective dispersing amount of a surfactant which is compatible with said carbon black; (3) a sufficient amount of at least one alkaline hydroxide to raise the pH of said liquid dispersion to about 9.5 to about 12; and (4) a liquid dispersing medium, wherein the amount of carbon black is sufficient to coat substantially all of the non-conducting portions of said hole walls and is less than about 4% by weight of said liquid dispersion; then (d) separating substantially all of the liquid dispersing medium from said dispersion, thereby depositing said carbon black particles in a substantially continuous layer on said non-conducting portions of said hole walls; and (e) microetching said metal layers of printed wiring board to remove any deposited carbon black therefrom; and (f) electroplating a substantially continuous metal layer over the deposited carbon black layer on said non-conducting portions of hole walls, thereby electrically connecting said metal layers of said printed wiring board.

Claim 23

The process of claim 20 wherein said surfactant is a phosphate ester anionic surfactant, said alkaline hydroxide is potassium hydroxide and said liquid dispersing medium is water.

Claim 24

A printed wiring board having at least one through hole, the walls of said through hole contacted with an aqueous alkaline silicate solution and then having a substantially continuous layer of carbon black having an average particle size of less than about 3.0 microns and a surfactant deposited on the non-conductive portions of said through hole.

Claim 25

A printed wiring board having at least one through hole, the walls of said through hole contacted with an aqueous alkaline silicate solution and then having a substantially continuous layer of carbon black having an average particle size of less than about 3.0 microns and a surfactant deposited on the non-conductive portions of said through hole.

Claim 26

The printed wiring board of claim 22 wherein said surfactant is a phosphate ester anionic surfactant

Claim 27

The printed wiring board of claim 22 wherein said continuous layer of carbon black and surfactant additionally contains an alkaline hydroxide.

Claim 28

A printed wiring board having at least one metal-plated through hole, the walls of said metal-plated through hole contacted with an aqueous alkaline silicate solution and then having a substantially continuous layer of carbon black having an average particle size of less than about 3.0 microns and a surfactant deposited on the non-conductive portions of said through hole and underlying the plated on metal.

Claim 29

A printed wiring board having at least one metal-plated through hole, the walls of said metal-plated through hole contacted with an aqueous alkaline silicate solution and then having a substantially continuous layer of carbon black having an average particle size of less than about 3.0 microns and a surfactant deposited on the non-conductive portions of said through hole and underlying the plated on metal.

Claim 30

The printed wiring board of claim 25 wherein said surfactant is a phosphate ester anionic surfactant.

Claim 31

The printed wiring board of claim 25 wherein said continuous layer of carbon black and surfactant additionally contains an alkaline hydroxide.

Claim 32

The printed wiring board of claim 25 wherein said metal is copper.