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US4716184A
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US
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Epoxy resin encapsulating composition with enhanced moisture resistance and method for producing the same
Assignee: Panasonic Electric Works Co Ltd
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Filing: 1986-12-03
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Granted: 1987-12-29
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Expires: 2006-12-03
Abstract
Abstract An epoxy resin encapsulating composition for semiconductor packages consisting essentially of an epoxy resin adduct of epichlorohydrin and an aromatic hydroxyl-containing compound, and an inorganic ion-exchange solid material admixed with the epoxy resin adduct. The ion-exchange solid material is selected to have the capability of exchanging its mobile anions with the undesired chlorine ions which occur inherently in the package made from the encapsulating composition and are very likely to corrode the metallic conductor on the semiconductor to be encapsulated. The ion-exchange solid material is characterized to include antimony and bismuth as basic materials forming an ion-exchange network which carries the mobile anions to be substituted with the chlorine ions. This ion-exchange material also is found to be also effective for trapping undesired alkali metal ions, for example, Na + which may be present in the composition itself or permeate in the packages made therefrom and also act to corrode the conductor. Preferred ion-exchange material for the epoxy resin encapsulating composition is found to be represented by the formula: SbBixOy(OH)z(NO.sub.3)w.n(H.sub.2 O) in which x represents 0.2 to 2.0, y represent 1.0 to 5.0, z represents 0.1 to 3.0, w represents 0.1 to 3.0 and n represents 0.5 to 3.0.
Inventors
- 👤 Hirohiko Kagawa
- 👤 Yasuhiro Kyotani
- 👤 Munetomo Torii
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 02:40
CPC Classifications
C; C08; C08K; C08K3/00; C08K3/28; C08K3/10; C08K3/11
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
141 words
An epoxy resin encapsulating composition with enhanced moisture resistance for semiconductor packages consisting essentially of the admixture of an epoxy resin adduct of epichlorohydrin and an aromatic hydroxyl-containing compound, and an inorganic ion-exchange solid material, said ion-exchange solid material be-ing in the form of particles dispersed in the epoxy resin adduct and capable of exchanging its mobile anions with the chlorine ions which originate from the epichlorohydrin and occur in the epoxy resin adduct as a result of possible hydrolysis of the corresponding chlorides, said ion-exchange solid material being represented by the general formula: SbBixOy(OH)z(NO.sub.3)w.n(H.sub.2 O) in which x represents 0.2 to 2.0, y represent 1.0 to 5.0, z represents 0.1 to 3.0, w represents 0.1 to 3.0 and n represents 0.5 to 3.0 and forming an ion-exchange network which carries said mobile anions to be substituted with said chlorine ions.
Claim 2
Dependent Claim
141 words
An epoxy resin encapsulating composition with enhanced moisture resistance for semiconductor packages consisting essentially of the admixture of an epoxy resin adduct of epichlorohydrin and an aromatic hydroxyl-containing compound, and an inorganic ion-exchange solid material, said ion-exchange solid material be-ing in the form of particles dispersed in the epoxy resin adduct and capable of exchanging its mobile anions with the chlorine ions which originate from the epichlorohydrin and occur in the epoxy resin adduct as a result of possible hydrolysis of the corresponding chlorides, said ion-exchange solid material being represented by the general formula: SbBixOy(OH)z(NO.sub.3)w.n(H.sub.2 O) in which x represents 0.2 to 2.0, y represent 1.0 to 5.0, z represents 0.1 to 3.0, w represents 0.1 to 3.0 and n represents 0.5 to 3.0 and forming an ion-exchange network which carries said mobile anions to be substituted with said chlorine ions.
Claim 3
Dependent Claim
38 words
An epoxy resin encapsulating composition as set forth in claim 1, wherein said mobile anion is hydroxyl group of which hydrogen acts as cation to be substituted with possible alkali metal ions present in the epoxy resin adduct.
Claim 4
Dependent Claim
33 words
An epoxy resin encapsulating composition as set forth in claim wherein 0.1 to 10 parts by weight of said ion-exchange material is mixed with 100 parts by weight of the epoxy resin adduct.
Claim 5
Dependent Claim
38 words
An epoxy resin encapsulating composition as set forth in claim 1, wherein said ion-exchange solid material having an average particle size of not more than 5 μ and having a maximum particle size of not more than 100μ.
Claim 6
Independent Claim
234 words
A method of preparing an epoxy resin encapsulating composition with enhanced moisture resistance for semiconductor packages utilizing an epoxy resin adduct of epichlorohydrin and an aromatic hydroxyl-containing compound, and an inorganic ion-exchange solid material, said ion-exchange solid material being in the form of particles dispersed in the epoxy resin adduct and and capable of exchanging its mobile anions with the chlorine ions which originate from the epichlorohydrin and occur in the epoxy resin adduct as a result of possible hydrolysis of the corresponding chlorides, and said ion-exchange material being represented by the general formula: SbBixOy(OH)z(NO.sub.3)w.n(H.sub.2 O) in which x represents 0.2 to 2.0, y represent 1.0 to 5.0, z represents 0.1 to 3.0, w represents 0.1 to 3.0 and n represents 0.5 to 3.0, said method comprising the steps of: mixing the particles of said ion-exchange material into the molten epoxy resin to provide a first mixture; kneading the resulting first mixture so as to disperse the particles of the ion-exchange material uniformly into the epoxy resin; cooling the first mixture to solidify; milling the solidified first mixture to the corresponding powder; blending a curing agent for the epoxy resin with the powder of the first mixture to provide a second mixture; heating the second mixture to melt for partially curing of the epoxy resin; cooling the second mixture to solidify; and grinding the solidified second mixture to produce the encapsulation composition in powder.
Claim 7
Independent Claim
234 words
A method of preparing an epoxy resin encapsulating composition with enhanced moisture resistance for semiconductor packages utilizing an epoxy resin adduct of epichlorohydrin and an aromatic hydroxyl-containing compound, and an inorganic ion-exchange solid material, said ion-exchange solid material being in the form of particles dispersed in the epoxy resin adduct and and capable of exchanging its mobile anions with the chlorine ions which originate from the epichlorohydrin and occur in the epoxy resin adduct as a result of possible hydrolysis of the corresponding chlorides, and said ion-exchange material being represented by the general formula: SbBixOy(OH)z(NO.sub.3)w.n(H.sub.2 O) in which x represents 0.2 to 2.0, y represent 1.0 to 5.0, z represents 0.1 to 3.0, w represents 0.1 to 3.0 and n represents 0.5 to 3.0, said method comprising the steps of: mixing the particles of said ion-exchange material into the molten epoxy resin to provide a first mixture; kneading the resulting first mixture so as to disperse the particles of the ion-exchange material uniformly into the epoxy resin; cooling the first mixture to solidify; milling the solidified first mixture to the corresponding powder; blending a curing agent for the epoxy resin with the powder of the first mixture to provide a second mixture; heating the second mixture to melt for partially curing of the epoxy resin; cooling the second mixture to solidify; and grinding the solidified second mixture to produce the encapsulation composition in powder.
Claim 8
Dependent Claim
38 words
A method of preparing an epoxy resin encapsulating composition as set forth in claim 5, wherein 0.1 to 10 parts by weight of said ion-exchange material is mixed with 100 parts by weight of the epoxy resin adduct.
Claim 9
Dependent Claim
42 words
A method of preparing an epoxy resin encapsulating composition as set forth in claim 5, wherein said ion-exchange solid material having an average particle size of not more than 5 μ and having a maximum particle size of not more than 100μ.
Claim 10
Dependent Claim
54 words
A method of preparing an epoxy resin encapsulating composition as set forth in claim 5, wherein an silica filler particles are blended in the first mixture at the step of providing the second mixture, said ion-exchange material being selected to have a maximum particle size of not greater than that of silica filler particles.
Claim 11
Dependent Claim
141 words
A method of preparing an epoxy resin encapsulating composition as set forth in claim 5, wherein a large volume of water is mixed together with the particles of said ion-exchange material into the molten epoxy resin adduct at the step of providing the first mixture in order to positively hydrolyze the chloride attached to the molecules of the epoxy resin into the chlorine ion and at the same time to trap the same ions on the network of the ion-exchange material by exchanging the mobile anions on the network with the chlorine ions in the water solution, said ion-exchange material being mixed in excess amount relative to the chlorine ions to be removed for remaining sufficient amount of the mobile anion on the network for another ion-exchange reaction, the resulting first mixture being dewatered prior to milling the solidified first mixture.
Claim 12
Dependent Claim
43 words
A method of preparing an epoxy resin encapsulating composition as set forth in claim 8, wherein 0.01 to 10 parts by weight of ion-exchange material and 10 to 100 parts of water are mixed with 100 parts by weight of the epoxy resin.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1990-12-28 | 1991-06-29 | 1991-12-29 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1994-12-28 | 1995-06-29 | 1995-12-29 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1998-12-28 | 1999-06-29 | 1999-12-29 | $7700.00 | Window Closed / Lapsed |