Capacitor built-in integrated circuit packaged unit and process of fabrication thereof

Claim 2

A capacitor built-in integrated circuit packaged unit comprising an electrically conductive support member having an extensive area larger than said capacitor, integrated circuit, (1) first and second lead elements associated with said conductive support member, said first lead element being electrically connected to said conductive support member and said second lead element being electrically isolated from said conductive support member, (2) a stack having a plurality of layers and comprising a first insulating layer of a highly dielectric material formed on said conductive support member, a first electrically conductive layer formed on said first insulating layer, said first insulating layer having a portion exposed by said first electrically conductive layer, a second insulating layer formed on said first electrically conductive layer and having a portion directly lying on the exposed portion of said first insulating layer, said first electrically conductive layer as a whole being less extensive than said first insulating layer and having a portion exposed by said second insulating layer, a second electrically conductive layer formed on said second insulating layer, said second electrically conductive layer as a whole being less extensive than said second insulating layer and than said first electrically conductive layer, and a layer of an electrically conductive adhesive material formed on the second electrically conductive layer, (3) a semiconductor integrated circuit chip having first and second electrodes which are electrically isolated from each other, said semiconductor integrated circuit chip having a surface portion bonded to said second electrically conductive layer via said electrically conductive adhesive material, (4) first coupling means electrically connecting the first electrode to said first lead element, and (5) second coupling means electrically connecting the second electrode to the exposed portion of said first electrically conductive layer and to said second lead element.

Claim 3

A capacitor built-in integrated circuit packaged unit as set forth in claim 1, wherein said exposed portion of said first electrically conductive layer has a layer of metal, to which said second coupling means is connected at one end thereof.

Claim 4

A capacitor built-in integrated circuit packaged unit as set forth in claim 1, wherein said second conductive layer has a layer of metal, to which said semiconductor integrated circuit chip is bonded.

Claim 5

A capacitor built-in integrated circuit packaged unit as set forth in claim 1, wherein said second insulating layer per se is constituted by a layer of an insulating adhesive material by means of which said semiconductor integrated circuit chip is bonded to said conductive layer.

Claim 6

A capacitor built-in integrated circuit packaged unit as set forth in claim 1, wherein said dielectric material is selected from the group consisting of titanium oxide, aluminum oxide and barium titanate.

Claim 7

A capacitor built-in integrated circuit packaged unit as set forth in claim 1, wherein said dielectric material is selected from the group consisting of silicon nitride, tantalum nitride and boron nitride.

Claim 8

A capacitor built-in integrated circuit packaged unit as set forth in claim 1, wherein said dielectric material is a composite glass.

Claim 9

A capacitor built-in integrated circuit packaged unit as set forth in claim 1, wherein said first insulating layer (56) is less than 30 microns thick.

Claim 10

A capacitor built-in integrated circuit packaged unit as set forth in claim 1, wherein said first electrically conductive layer is constructed of a material selected from the group consisting of titanium, aluminum, tantalum, chromium or nickel.

Claim 11

A capacitor built-in integrated circuit packaged unit as set forth in claim 1, wherein said second insulating layer is constructed of a material selected from the group consisting of titanium oxide, aluminum oxide and barium titanate.

Claim 12

A capacitor built-in integrated circuit packaged unit as set forth in claim 1, wherein said second insulating layer is constructed of a material selected from the group consisting of silicon nitride, tantalum nitride and boron nitride.

Claim 13

A capacitor built-in integrated circuit packaged unit as set forth in claim 1, wherein said second insulating layer is constructed of a composite glass.

Claim 14

A capacitor built-in integrated circuit packaged unit as set forth in claim 1, wherein said second conductive layer is constructed of a material selected from the group consisting of titanium, aluminum, tantalum, chromium or nickel.

Claim 15

A capacitor built-in integrated circuit packages unit as set forth in claim 1, wherein said second coupling means comprises a bonding wire electrically connecting said second electrode to the exposed portion of said first electrically conductive layer and a bonding wire electrically connecting said exposed portion to said second lead element.

Claim 16

A capacitor built-in integrated circuit packaged unit as set forth in claim 1, wherein said second coupling means comprises a bonding wire electrically connecting said second electrode to the exposed portion of said first electrically conductive layer and a bonding wire electrically connecting said second electrode direction to said second lead element.

Claim 17

A capacitor built-in integrated circuit packaged unit as set forth in claim 1, wherein said second coupling means comprises a conductive member fast on said exposed portion of said first electrically conductive layer, a bonding wire electrically connecting said second electrode to said conductive member and a bonding wire electrically connecting said conductive member to said second lead element.

Claim 18

A capacitor built-in integrated circuit packaged unit as set forth in claim 1, wherein said conductive support member and said first and second lead elements form part of a frame section of a lead frame of metal consisting of a series of frame sections.

Claim 19

A capacitor built-in integrated circuit packaged unit as set forth in claim 1, wherein said conductive support member constitutes a first conductive support member of two metallic support members which further includes a second conductive support member (68) to which said first conductive support member is bonded with an electrically conductive adhesive material.

Claim 20

A capacitor built-in integrated circuit packaged unit as set forth in claim 1, wherein said conductive support member is securely connected between said first and second lead elements.

Claim 21

A capacitor built-in integrated circuit packaged unit as set forth in claim 1, further comprising a body of a polymeric resin having said conductive support member, said stack of layers, said semiconductor integrated circuit chip and said first and second coupling means sealed therein.

Claim 22

A capacitor built-in integrated circuit packaged unit comprising an electrically conductive support member having an extensive area larger than said capacitor, integrated circuit, (1) first and second lead elements associated with said conductive support member, said first lead element being electrically connected to said conductive support member and said second lead element being electrically isolated from said conductive support member, (2) a stack having a plurality of layers comprising a first insulating layer of a highly dielectric material formed on said conductive support member, a first electrically conductive layer formed on said first insulating layer, said first insulating layer having a portion exposed by said first electrically conductive layer, a second insulating layer formed on said first electrically conductive layer and having a portion directly lying on the exposed portion of said first insulating layer, said first electrically conductive layer as a whole being less extensive than said first insulating layer and having a portion exposed by said second insultating layer, a second electrically conductive layer formed on said second insulating layer, said second electrically conductive layer as a whole being less extensive than said second insulating layer and than said first electrically conductive layer, and a layer of an electrically conductive adhesive material formed on the second electrically conductive layer, (3) a semiconductor integrated circuit chip having first and second electrodes which are electrically isolated from each other, said semiconductor integrated circuit chip having a surface portion bonded to said second electrically conductive layer via said electrically conductive adhesive material, (4) first coupling means electrically connecting the first electrode to said first lead element, (5) second coupling means electrically connecting the second electrode to the exposed portion of said first electrically conductive layer and to said second lead element, (6) a ceramic package case formed with a concavity having a bottom surface, (7) a metallized layer formed on the bottom surface, said first lead element being fastened onto said ceramic package case and electrically connected to said metallized layer, (8) said second lead element being fastened onto said ceramic package case and electrically isolated from said metallized layer, (9) said conductive support member being bonded to said metallized layer with an electrically conductive adhesive material, and (10) a cap member attached to said ceramic package case and closing said concavity.

Claim 23

A capacitor built-in integrated circuit packaged unit comprising an electrically conductive support member having an extensive area larger than said capacitor, integrated circuit, (1) first and second lead elements associated with said conductive support member, said first lead element being electrically connected to said conductive support member and said second lead element being electrically isolated from said conductive support member, (2) a stack having a plurality of layers comprising a first insulating layer of a highly dielectric material formed on said conductive support member, a first electrically conductive layer formed on said first insulating layer, said first insulating layer having a portion exposed by said first electrically conductive layer, a second insulating layer formed on said first electrically conductive layer and having a portion directly lying on the exposed portion of said first insulating layer, said first electrically conductive layer as a whole being less extensive than said first insulating layer and having a portion exposed by said second insultating layer, a second electrically conductive layer formed on said second insulating layer, said second electrically conductive layer as a whole being less extensive than said second insulating layer and than said first electrically conductive layer, and a layer of an electrically conductive adhesive material formed on the second electrically conductive layer, (3) a semiconductor integrated circuit chip having first and second electrodes which are electrically isolated from each other, said semiconductor integrated circuit chip having a surface portion bonded to said second electrically conductive layer via said electrically conductive adhesive material, (4) first coupling means electrically connecting the first electrode to said first lead element, (5) second coupling means electrically connecting the second electrode to the exposed portion of said first electrically conductive layer and to said second lead element, (6) a ceramic package case formed with a concavity having a bottom surface, (7) a metallized layer formed on the bottom surface, said first lead element being fastened onto said ceramic package case and electrically connected to said metallized layer, (8) said second lead element being fastened onto said ceramic package case and electrically isolated from said metallized layer, (9) said conductive support member being bonded to said metallized layer with an electrically conductive adhesive material, and (10) a cap member attached to said ceramic package case and closing said concavity.

Claim 24

A capacitor built-in integrated circuit packaged unit as set forth in claim 21, wherein said second coupling means comprises a conductive member fast on said exposed portion of said first electrically conductive layer, a bonding wire electrically connecting said second electrode to said conductive member and a bonding wire electrically connecting said conductive member to said second lead element.