US4707418A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Nickel plated copper tape
Assignee: National Semiconductor Corp
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Filing: 1985-06-26
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Granted: 1987-11-17
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Expires: 2005-06-26
Abstract
Abstract An improved copper bump tape for tape automated bonding inhibits electromigration of the copper after bonding to a semiconductor device. The improved tape is characterized by the plating of a migration resistant metal onto the inner ends of connector beams of the tape. The migration resistant metal is coated onto all surfaces of the connector bump, except for the surface which is to be bonded to the semiconductor device. In this way, the surfaces of the bump which remain exposed after connection to the semiconductor are inhibited from electromigration.
Inventors
- 👤 Hem P. Takiar
- 👤 Divyesh P. Shah
- 👤 Robert E. Hilton
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-27 08:23
CPC Classifications
H; H10; H10P; H10P72/00; H10P72/04; H10P72/0446; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49121; Y10T428/00; Y10T428/12; Y10T428/12493; Y10T428/12771; Y10T428/12861; Y10T428/12903; Y10T428/1291
Claims Analysis
Total Claims: 5
Claim 1
Independent Claim
80 words
An improved copper tape of the type used for tape automated bonding, said tape including beams having bumps formed on their inner ends for connection to metallization pads on a semiconductor die, wherein said bumps each include a bonding surface intended to bond to a metallization pad and a plurality of side surfaces adjacent the bonding surface, said improvement comprising a migration resistant metal layer formed on all side surfaces of the bump but not formed on the bonding surface.
Claim 2
Dependent Claim
80 words
An improved copper tape of the type used for tape automated bonding, said tape including beams having bumps formed on their inner ends for connection to metallization pads on a semiconductor die, wherein said bumps each include a bonding surface intended to bond to a metallization pad and a plurality of side surfaces adjacent the bonding surface, said improvement comprising a migration resistant metal layer formed on all side surfaces of the bump but not formed on the bonding surface.
Claim 3
Dependent Claim
20 words
An improved copper tape as in claim 1, wherein the migration resistant metal layer is nickel or a nickel alloy.
Claim 4
Dependent Claim
25 words
An improved copper tape as in claim 1, wherein the thickness of the migration resistant metal layer is in the range from 0.1μ to 10μ.
Claim 5
Dependent Claim
14 words
An improved copper tape as in claim 3, wherein the thickness is about 0.25μ.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1990-11-16 | 1991-05-18 | 1991-11-17 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1994-11-16 | 1995-05-18 | 1995-11-17 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1998-11-16 | 1999-05-18 | 1999-11-17 | $7700.00 | Window Closed / Lapsed |