Composite metal laminate material and lead frame
Abstract
Abstract A COMPOSITE METAL LAMINATE MATERIAL IS DISCLOSED AS WELL AS A LEAD FRAME FABRICATED THEREFROM WHICH IS PARTICULARLY ADAPTED FOR USE IN THE MANUFACTURE OF PLASTIC ENCAPSULATED INTEGRATED CIRCUIT DEVICES. THE COMPOSITE METAL LAMINATE INCLUDES A CORE OF METALLIC MATERIAL DISPOSED INTERMEDIATE AND METALLURGICALLY BONDED TO OUTER METALLIC LAYERS OF A DIFFERENT MATERIAL FROM THE CORE AND FURTHER INCLUDES A STRIPE HAVING AN EXPOSED SURFACE OF A MATERIAL SELECTED FROM THE GROUP CONSISTING OF SILVER, GOLD, OR ALUMINUM, METALLURGICALLY BONDED TO ONE OF THE OUTER METALLIC LAYERS AND EXTENDING LONGITUDINALLY OF THE OUTER METALLIC LAYER IN ORDER TO PROVIDE A BONDING SURFACE. THE COMPOSITE METAL LAMINATE MATERIAL IS ADAPTED TO BE FORMED INTO A LEAD FRAME CONFIGURATION TO PERMIT THE MOUNTING OF AN INTEGRATED CIRCUIT DEVICE ON A PORTION OF THE STRIPE, WHILE ELECTRICAL CONNECTIONS MAY BE MADE BETWEEN THE DEVICE AND VARIOUS REGIONS OF THE LEAD FRAME BONDING SURFACE DEFINED BY THE STRIPE.
Inventors
- 👤 Marvin B Happ
- 👤 James G Harper
Bibliographic Details
Claims Analysis
Total Claims: 0References Cited (Backward Citations)
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