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US4000045A Expired / Lapsed US ⏱️ 0.0 years remaining

Electroplating contacts of printed circuits

Assignee: Unisys Corp
•
Filing: 1975-11-21
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Granted: 1976-12-28
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Expires: 1995-11-21
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Abstract

Abstract A printed-circuit board requiring precious metal electroplating of its contact finger areas is adapted for such plating by a temporarily affixed electroplating current carrier of metallic foil held in contact with other printed wiring interconnected with the contact finger areas. The metallic foil is shielded from contact with electroplating baths by a strip of dielectric plastic film, the film and the foil being temporarily held in a selected position on the board by a layer of non-setting pressure-sensitive adhesive.

Inventors

  • 👤 Richard Ralph Rotzow

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-27 22:27
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/22; H05K3/24; H05K3/241; H05K3/242; C; C25; C25D; C25D5/00; C25D5/02; C25D5/022; C25D7/00; C25D7/06; C25D7/0614; C25D7/0671; C25D7/0678; H05K1/00; H05K1/02; H05K1/11; H05K1/117; H05K2203/00; H05K2203/01; H05K2203/0191

Claims Analysis

Total Claims: 5
Claim 1
Independent Claim 279 words
A method of electroplating selected printed wiring formed on a first region of a substrate while preventing electroplating of printed wiring formed on an adjacent second region of the substrate, said method comprising the steps of: forming the printed wiring on said first and second regions of said substrate so that said selected printed wiring on said first region which is to be electroplated is electrically connected to predetermined portions of the printed wiring on said second region which are not to be electroplated; positioning a removable shielding tape having a backing of insulative material coated with a non-setting pressure-sensitive insulative adhesive material and having an elongated conductor held on the tape by the adhesive over a second region of the substrate; said positioning of the tape and the path of said elongated conductor on said shielding tape being chosen so that said positioning brings said conductor into electrical contact with said predetermined portions of the printed wiring on said second region; rolling the substrate between resilient pressure rollers so as to press the shielding tape and its conductor against said second region of the substrate to form a seal which prevents seepage of liquid under the tape during electroplating, said conductor being located sufficiently spaced from the edges of the tape so as not to interfere with the formation of said seal and so as not to be electroplated; electroplating onto the selected printed wiring on said first region using said conductor for providing an electrical path for electroplating current to flow to said selected printed wiring via said predetermined portions of said second region; and removing the shielding tape along with its conductor after completion of electroplating.
Claim 2
Independent Claim 279 words
A method of electroplating selected printed wiring formed on a first region of a substrate while preventing electroplating of printed wiring formed on an adjacent second region of the substrate, said method comprising the steps of: forming the printed wiring on said first and second regions of said substrate so that said selected printed wiring on said first region which is to be electroplated is electrically connected to predetermined portions of the printed wiring on said second region which are not to be electroplated; positioning a removable shielding tape having a backing of insulative material coated with a non-setting pressure-sensitive insulative adhesive material and having an elongated conductor held on the tape by the adhesive over a second region of the substrate; said positioning of the tape and the path of said elongated conductor on said shielding tape being chosen so that said positioning brings said conductor into electrical contact with said predetermined portions of the printed wiring on said second region; rolling the substrate between resilient pressure rollers so as to press the shielding tape and its conductor against said second region of the substrate to form a seal which prevents seepage of liquid under the tape during electroplating, said conductor being located sufficiently spaced from the edges of the tape so as not to interfere with the formation of said seal and so as not to be electroplated; electroplating onto the selected printed wiring on said first region using said conductor for providing an electrical path for electroplating current to flow to said selected printed wiring via said predetermined portions of said second region; and removing the shielding tape along with its conductor after completion of electroplating.
Claim 3
Dependent Claim 20 words
A method of electroplating as recited in claim 1 wherein the elongated conductor is an elongated strip of metallic foil.
Claim 4
Dependent Claim 19 words
A method of electroplating as recited in claim 1 wherein the backing of the shielding tape is plastic film.
Claim 5
Dependent Claim 84 words
The invention in accordance with claim 1, wherein said selected portion of printed wiring on said first region which is to be electroplated includes a particular portion which is not normally electrically connected to any portion of the printed wiring on said second region, and wherein said step of forming includes forming a printed wire which is connected to said particular portion of said first region and extends into said second region so as to be electrically contacted by said conductor during said positioning.

References Cited (Backward Citations)

US2834723A Cited
US3014851A Cited
US3597333A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1979-12-28 1980-06-28 1980-12-28 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1983-12-28 1984-06-28 1984-12-28 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1987-12-28 1988-06-28 1988-12-28 $7700.00 Window Closed / Lapsed

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