Circuit wiring disposed on solder mask coating

Claim 1

In a printed wiring board assembly having an insulation photopolymer resist coating such as a solder mask layer disposed to extend upwardly from a conductive circuit wiring pattern on a printed wiring board substrate surface to cover a substantial portion of the substrate surface while leaving exposed through a resist coating conductor pads at predetermined circuit contact positions on the substrate surface, the improvement comprising in combination providing increased efficiency of circuit space usage with given board substrate dimensions thereby permitting additional circuit board patterns to be printed without increasing the substrate area, namely, a thin conductive circuit pattern on the substrate surface, said insulation resist coating consisting of a cured liquid photopolymer with a glossy flush surface formed by contact of a flat plate with the polymer in liquid form which is adhered to the substrate surface and presents a flush flat surface plateau with access channels downwardly extending thereinto to expose the conductor pads on the substrate surface and having a thin conductive coating on the channel sidewalls electrically contacting the exposed conductor pads, and a layer of conductive material disposed on the surface of said insulation coating in a pattern with controlled electronic coupling to the circuit board wiring pattern.

Claim 21

The method of producing a printed wiring board assembly having an insulation resist coating such as a solder mask layer disposed to extend upwardly from a conductive circuit wiring pattern on the printed wiring board substrate surface leaving exposed conductor pads at predetermined circuit contact positions on the substrate surface, comprising the steps of: improving efficiency of circuit space usage with given board substrate dimensions thereby permitting additional circuit board patterns to be printed without increasing the substrate area by providing on the substrate surface a thin conductive circuit pattern, adhering to the substrate surface and insulation resist coating presenting a flush flat surface plateau with access channels downwardly extending thereinto the substrate surface, coating channel sidewalls with a thin conductive coating electrically contacting the exposed conductor pads, disposing on the surface of said insulation coating a layer of conductive material as indicia marking nomenclature in a pattern electronically coupled to the circuit board wiring pattern on the substrate surface, and disposing the conductive material in said indicia pattern in a dot matrix pattern to reduce capacitance coupling between conductor wires in said wiring pattern on the substrate surface.

Claim 22

The method of producing a printed wiring board assembly having an insulation resist coating such as a solder mask layer disposed to extend upwardly from a conductive circuit wiring pattern on the printed wiring board substrate surface leaving exposed conductor pads at predetermined circuit contact positions on the substrate surface, comprising the steps of: improving efficiency of circuit space usage with given board substrate dimensions thereby permitting additional circuit board patterns to be printed without increasing the substrate area by providing on the substrate surface a thin conductive circuit pattern, adhering to the substrate surface and insulation resist coating presenting a flush flat surface plateau with access channels downwardly extending thereinto the substrate surface, coating channel sidewalls with a thin conductive coating electrically contacting the exposed conductor pads, disposing on the surface of said insulation coating a layer of conductive material as indicia marking nomenclature in a pattern electronically coupled to the circuit board wiring pattern on the substrate surface, and disposing the conductive material in said indicia pattern in a dot matrix pattern to reduce capacitance coupling between conductor wires in said wiring pattern on the substrate surface.

Claim 23

The method of producing a printed wiring board assembly having an insulation resist coating such as a solder mask layer disposed to extend upwardly from a conductive circuit wiring pattern on the printed wiring board substrate surface leaving exposed conductor pads at predetermined circuit contact positions on the substrate surface, comprising the steps of: improving efficiency of circuit space usage with given board substrate dimensions thereby permitting additional circuit board patterns to be printed without increasing the substrate area by providing on the substrate surface a thin conductive circuit pattern, adhering to the substrate surface an insulation resist coating presenting a flush flat surface plateau with access channels downwardly extending thereinto exposing conductor pads in the conductive circuit pattern on the substrate surface, coating channel sidewalls with a thin conductive coating electrically contacting the exposed conductor pads, disposing on the surface of said insulation coating a layer of conductive material as indicia marking nomenclature in a pattern electronically coupled to the circuit board wiring pattern on the substrate surface, and photoprinting a layer of liquid photopolymer overlying the printed wiring on said board to produce a permanently adhered said resist coating.

Claim 24

The method of producing a printed wiring board assembly having an insulation resist coating such as a solder mask layer disposed to extend upwardly from a conductive circuit wiring pattern on the printed wiring board substrate surface leaving exposed conductor pads at predetermined circuit contact positions on the substrate surface, comprising the steps of: improving efficiency of circuit space usage with given board substrate dimensions thereby permitting additional circuit board patterns to be printed without increasing the substrate area by providing on the substrate surface a thin conductive circuit pattern, adhering to the substrate surface an insulation resist coating presenting a flush flat surface plateau with access channels downwardly extending thereinto exposing conductor pads in the conductive circuit pattern on the substrate surface, coating channel sidewalls with a thin conductive coating electrically contacting the exposed conductor pads, disposing on the surface of said insulation coating a layer of conductive material as indicia marking nomenclature in a pattern electronically coupled to the circuit board wiring pattern on the substrate surface, and photoprinting a layer of liquid photopolymer overlying the printed wiring on said board to produce a permanently adhered said resist coating.

Claim 35

The method of producing a printed wiring board assembly having an insulation resist coating such as a solder mask layer disposed to extend upwardly from a conductive circuit wiring pattern on the printed wiring board substrate surface leaving exposed conductor pads at predetermined circuit contact positions on the substrate surface, comprising the steps of: improving efficiency of circuit space usage with given board substrate dimensions thereby permiting additional circuit board patterns to be printed without increasing the substrate area by providing on the substrate surface a thin conductive circuit pattern, adhering to the substrate surface an insulation resist coating presenting a flush flat surface plateau with access channels downwardly extending thereinto exposing conductor pads in the conductive circuit pattern on the subtrate surface, coating channel sidewalls with a thin conductive coating electrically contacting the exposed conductor pads, disposing on the surface of said insulation coating a layer of conductive material as indicia marking nomenclature in a pattern electronically coupled to the circuit board wiring pattern on the substrate surface, and providing at least one temporary conductive path on said insulation surface plateau with electrical connection to the circuit wiring pattern, conducting electrical current through said temporary conductive path to said circuit wiring pattern in a manufacturing step, and removing the temporary conductive path from the plateau following completion of said manufacturing step.

Claim 36

The method of producing a printed wiring board assembly having an insulation resist coating such as a solder mask layer disposed to extend upwardly from a conductive circuit wiring pattern on the printed wiring board substrate surface leaving exposed conductor pads at predetermined circuit contact positions on the substrate surface, comprising the steps of: improving efficiency of circuit space usage with given board substrate dimensions thereby permiting additional circuit board patterns to be printed without increasing the substrate area by providing on the substrate surface a thin conductive circuit pattern, adhering to the substrate surface an insulation resist coating presenting a flush flat surface plateau with access channels downwardly extending thereinto exposing conductor pads in the conductive circuit pattern on the subtrate surface, coating channel sidewalls with a thin conductive coating electrically contacting the exposed conductor pads, disposing on the surface of said insulation coating a layer of conductive material as indicia marking nomenclature in a pattern electronically coupled to the circuit board wiring pattern on the substrate surface, and providing at least one temporary conductive path on said insulation surface plateau with electrical connection to the circuit wiring pattern, conducting electrical current through said temporary conductive path to said circuit wiring pattern in a manufacturing step, and removing the temporary conductive path from the plateau following completion of said manufacturing step.

Claim 40

The method of manufacturing printed wiring boards comprising the steps of: providing an insulation layer over a significant portion of a printed wiring pattern on a printed wiring board leaving exposed predetermined wiring positions and presenting an outer flush plateau surface to which a conductor material may be removably affixed, providing at least one temporary conductive path affixed on said surface electrically connecting the temporary conductive path with a predetermined conductive position on the printed wiring pattern, conducting electrical current through said temporary conductive path to said wiring pattern in a manufacturing step, and removing the temporary conductive path from said surface following completion of said manufacturing step.

Claim 41

The method of manufacturing printed wiring boards comprising the steps of: providing an insulation layer over a significant portion of a printed wiring pattern on a printed wiring board leaving exposed predetermined wiring positions and presenting an outer flush plateau surface to which a conductor material may be removably affixed, providing at least one temporary conductive path affixed on said surface electrically connecting the temporary conductive path with a predetermined conductive position on the printed wiring pattern, conducting electrical current through said temporary conductive path to said wiring pattern in a manufacturing step, and removing the temporary conductive path from said surface following completion of said manufacturing step.