Semiconductor device for receiving light

Claim 2

A semiconductor device for receiving light, comprising: a first semiconductor layer having a first conductivity type and having a first forbidden bandwidth, electron-hole pairs being generated by said first semiconductor layer; a second semiconductor layer having the first conductivity type, formed on said first semiconductor layer, having a second forbidden bandwidth greater than said first forbidden bandwidth of said first semiconductor layer and distributed so that said second forbidden bandwidth has a maximum value at an intermediate position in the thickness direction of said second semiconductor layer; and a third semiconductor layer having a second conductivity type opposite the first conductivity type, formed on said second semiconductor layer, having a forbidden bandwidth smaller than that of the region between said third semiconductor layer and said second semiconductor layer and larger than that of said first semiconductor layer, said third semiconductor layer receiving the light incident thereon, holes being injected into the region between said second semiconductor layer, where said second forbidden bandwidth has a maximum value, and said third semiconductor layer so as to reduce multiplication noise.

Claim 3

A semiconductor device according to claim 1, wherein said first semiconductor layer comprises InGaAs and said second semiconductor layer comprises AlInAs such that the maximum value of said forbidden bandwidth is provided at the intermediate position of said second semiconductor layer.

Claim 4

A semiconductor device for receiving light, comprising: a first semiconductor layer of a first conductivity type and having a first forbidden bandwidth, electron-hole pairs being generated in said first semiconductor layer; a second semiconductor layer of the first conductivity type, formed on said first semiconductor layer, having a second forbidden bandwidth which is larger than that of said first forbidden bandwidth, a transition area being formed between said first and second semiconductor layers, said second forbidden bandwidth having a maximum value at an intermediate position in the thickness direction of said second semiconductor layer; and a third semiconductor layer of a second conductivity type opposite the first conductivity type, formed on said second semiconductor layer, forming a multiplication region between said second and third semiconductor layers, said third semiconductor layer receiving incident light, the forbidden bandwidth of the device gradually decreasing in a direction away from the maximum value of said forbidden bandwidth in said second semiconductor layer, the holes generated in said first semiconductor layer being injected into said multiplication region through the portion of said second semiconductor layer in which said second forbidden bandwidth has a maximum value so as to reduce multiplication noise.

Claim 5

A semiconductor device for receiving light, comprising: a first semiconductor layer of a first conductivity type and having a first forbidden bandwidth, electron-hole pairs being generated in said first semiconductor layer; a second semiconductor layer of the first conductivity type, formed on said first semiconductor layer, having a second forbidden bandwidth which is larger than that of said first forbidden bandwidth, a transition area being formed between said first and second semiconductor layers, said second forbidden bandwidth having a maximum value at an intermediate position in the thickness direction of said second semiconductor layer; and a third semiconductor layer of a second conductivity type opposite the first conductivity type, formed on said second semiconductor layer, forming a multiplication region between said second and third semiconductor layers, said third semiconductor layer receiving incident light, the forbidden bandwidth of the device gradually decreasing in a direction away from the maximum value of said forbidden bandwidth in said second semiconductor layer, the holes generated in said first semiconductor layer being injected into said multiplication region through the portion of said second semiconductor layer in which said second forbidden bandwidth has a maximum value so as to reduce multiplication noise.

Claim 6

A semiconductor device according to claim 3, wherein said first semiconductor layer comprises InGaAs and wherein said second semiconductor layer comprises AlInAs.

Claim 7

A semiconductor device according to claim 3, wherein said second semiconductor layer has a composition which varies such that said second forbidden bandwidth increases in the direction from the portion in which said second semiconductor layer contacts said first semiconductor layer toward the intermediate position in the thickness direction of said second semiconductor layer and decreases in the direction from the intermediate position of said second semiconductor layer to where said second semiconductor layer contacts said third semiconductor layer.

Claim 8

A semiconductor device according to claim 3, wherein said second semiconductor layer comprises a plurality of laminated layers in which the composition of said plurality of laminated layers varies in a stepwise fashion, such that said second forbidden bandwidth increases stepwise in a direction from said first semiconductor layer toward the intermediate position in the thickness direction of said second semiconductor device, where said second forbidden bandwidth is at a maximum, and decreases stepwise in a direction toward said third semiconductor substrate.