Abstract A process for electroplating a conductive metal layer to the surface of a non-conductive material which comprises: (a) preparing a liquid dispersion of carbon black comprised of: (1) carbon black particles having an average particle diameter of less than about 3.0 microns in said dispersion; (2) an effective dispersing amount of a surfactant which is compatible with said carbon black; and (3) liquid dispersing medium, wherein the amount of carbon black is sufficient to coat substantially all of said non-conducting surfaces and is less than about 4% by weight of said liquid dispersion; (b) applying said liquid dispersion to the surface of the non-conducting material; (c) separating substantially all of said liquid dispersing medium from said carbon black particles, whereby said particles are deposited on said non-conductive surface in a substantially continuous layer; and (d) electroplating a substantially continuous conductive metal layer over the deposited carbon black layer and said non-conductive surface.
A printed wiring board having at least one through hole, the walls of said through hole having a substantially continuous layer of carbon black having an average particle size of less than about 3.0 microns and a surfactant deposited on the non-conductive portions of said through hole.
Claim 2
Dependent Claim
47 words
A printed wiring board having at least one through hole, the walls of said through hole having a substantially continuous layer of carbon black having an average particle size of less than about 3.0 microns and a surfactant deposited on the non-conductive portions of said through hole.
Claim 3
Dependent Claim
16 words
The printed wiring board of claim 1 wherein said surfactant is a phosphate ester anionic surfactant.
Claim 4
Dependent Claim
35 words
The printed wiring board of claim 1 wherein said continous layer of carbon black and surfactant additionally contains an alkaline silicate, which is formed by the reaction of fumed silica particles and an alkaline hydroxide.
Claim 5
Dependent Claim
55 words
A printed wiring board having at least one metal-plated through hole, the walls of said metal-plated through hole having a substantially continuous layer of carbon black having an average particle size of less than about 3.0 microns and a surfactant deposited on the non-conductive portions of said through hole and underlying the plated on metal.
Claim 6
Dependent Claim
55 words
A printed wiring board having at least one metal-plated through hole, the walls of said metal-plated through hole having a substantially continuous layer of carbon black having an average particle size of less than about 3.0 microns and a surfactant deposited on the non-conductive portions of said through hole and underlying the plated on metal.
Claim 7
Dependent Claim
16 words
The printed wiring board of claim 4 wherein said surfactant is a phosphate ester anionic surfactant.
Claim 8
Dependent Claim
36 words
The printed wiring board of claim 4 wherein said continuous layer of carbon black and surfactant additionally contains an alkaline silicate mixed therein, which is formed by the reaction of fumed silica and an alkaline hydroxide.
Claim 9
Dependent Claim
12 words
The printed wiring board of claim 4, wherein said metal is copper.