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US4681630A
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Method of making copper colloid for activating insulating surfaces
Assignee: Shipley Co Inc
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Filing: 1986-04-25
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Granted: 1987-07-21
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Expires: 2006-04-25
Abstract
Abstract A copper colloid containing a minor amount of an ionizable palladium compound for use in activating non-conductive materials for subsequent electroplating.
Inventors
- 👤 William R. Brasch
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 18:08
CPC Classifications
C; C23; C23C; C23C18/00; C23C18/16; C23C18/18; C23C18/20; C23C18/28; C23C18/30; H; H05; H05K; H05K3/00; H05K3/10; H05K3/18; H05K3/181; H05K3/188
Claims Analysis
Total Claims: 21
Claim 1
Independent Claim
138 words
A method for preparing a colloidal copper solution for activating non-conductive substrates prior to electroless metal deposition thereon which comprises: dissolving in water a quantity of at least one copper compound to form a copper solution; preparing a gelatin solution by mixing gelatin with water; mixing the gelatin and copper solutions together; adjusting the pH of the mixed solutions with an acid to a range of less than about 4 but above about 1.5; preparing a solution of a reducing agent in a quantity in excess of that required to reduce the copper ions; and mixing the reducing agent solution with the previously mixed solutions to form a colloidal copper solution containing active colloidal copper in the form of copper metal, hydrous copper oxides, or mixtures thereof, wherein the colloidal copper solution remains stable at a neutral pH.
Claim 2
Independent Claim
138 words
A method for preparing a colloidal copper solution for activating non-conductive substrates prior to electroless metal deposition thereon which comprises: dissolving in water a quantity of at least one copper compound to form a copper solution; preparing a gelatin solution by mixing gelatin with water; mixing the gelatin and copper solutions together; adjusting the pH of the mixed solutions with an acid to a range of less than about 4 but above about 1.5; preparing a solution of a reducing agent in a quantity in excess of that required to reduce the copper ions; and mixing the reducing agent solution with the previously mixed solutions to form a colloidal copper solution containing active colloidal copper in the form of copper metal, hydrous copper oxides, or mixtures thereof, wherein the colloidal copper solution remains stable at a neutral pH.
Claim 3
Dependent Claim
13 words
The method of claim 1 in which the reducing agent is dimethylamine borane.
Claim 4
Dependent Claim
13 words
The method of claim 2 in which the copper salt is copper sulfate.
Claim 5
Dependent Claim
40 words
The method of claim 3 in which the gelatin is present in about 1-3 g/liter of colloidal solution, a copper compound is present such that the metal value thereof is between about 2.5 and 7.5 g/liter of the colloidal solution.
Claim 6
Dependent Claim
39 words
The method of claim 4 wherein the gelatin is present in about 2 gms/liter, the copper compound is present such that the metal value thereof is about 5 gms/liter and the reducing agent is present in about 5 gms/liter.
Claim 7
Dependent Claim
25 words
The method of claim 5 in which the ratio of reducing agent to the metal value of the copper compound is about 1/1 by weight.
Claim 8
Dependent Claim
15 words
The method of claim 6 in which the pH is between about 2 and 2.5.
Claim 9
Dependent Claim
18 words
The method of claim 7 wherein the active colloidal copper is stabilized by adding an additional reducing agent.
Claim 10
Dependent Claim
12 words
The method of claim 8 wherein the reducing agent is hydrazine hydrate.
Claim 11
Dependent Claim
22 words
The method of claim 1 which further comprises adding a small amount of ionic palladium to increase the activity of the catalyst.
Claim 12
Independent Claim
153 words
A method for preparing colloidal copper solution for activating non-conductive substrates prior to electroless metal deposition thereon which comprises: forming a copper sulfate solution by dissolving in water a quantity of a copper sulfate salt; preparing a gelatin solution by mixing gelatin with water; mixing the gelatin solution with the copper sulfate solution; adjusting the pH of the mixed solution with an acid to a range of less than about 4 but above about 1.5; preparing a solution of dimethyl amine borane in a quantity in excess of that required to reduce the copper ions; mixing the dimethyl amine borane solution with the previously mixed solutions to form a colloidal copper solution in the form of copper metal, hydrous copper oxides, or mixtures thereof, wherein the colloidal copper solution remains stable at a neutral pH; and adding a small amount of ionic palladium to the colloidal copper solution to provide increased activating properties.
Claim 13
Independent Claim
153 words
A method for preparing colloidal copper solution for activating non-conductive substrates prior to electroless metal deposition thereon which comprises: forming a copper sulfate solution by dissolving in water a quantity of a copper sulfate salt; preparing a gelatin solution by mixing gelatin with water; mixing the gelatin solution with the copper sulfate solution; adjusting the pH of the mixed solution with an acid to a range of less than about 4 but above about 1.5; preparing a solution of dimethyl amine borane in a quantity in excess of that required to reduce the copper ions; mixing the dimethyl amine borane solution with the previously mixed solutions to form a colloidal copper solution in the form of copper metal, hydrous copper oxides, or mixtures thereof, wherein the colloidal copper solution remains stable at a neutral pH; and adding a small amount of ionic palladium to the colloidal copper solution to provide increased activating properties.
Claim 14
Independent Claim
136 words
A method for preparing colloidal copper solution for activating non-conductive substrates prior to electroless metal deposition thereon which comprises: forming a copper sulfate solution by dissolving in water a quantity of a copper sulfate salt; preparing a gelatin solution by mixing gelatin with water; mixing the gelatin solution with the copper sulfate solution; adjusting the pH of the mixed solution with an acid to a range of less than about 4 but above about 1.5; preparing a solution of dimethyl amine borane in a quantity in excess of that required to reduce the copper ions; and mixing the dimethyl amine borane solution with the previously mixed solutions to form a colloidal copper solution in the form of copper metal, hydrous copper oxides, or mixtures thereof, wherein the colloidal copper solution remains stable at a neutral pH.
Claim 15
Independent Claim
136 words
A method for preparing colloidal copper solution for activating non-conductive substrates prior to electroless metal deposition thereon which comprises: forming a copper sulfate solution by dissolving in water a quantity of a copper sulfate salt; preparing a gelatin solution by mixing gelatin with water; mixing the gelatin solution with the copper sulfate solution; adjusting the pH of the mixed solution with an acid to a range of less than about 4 but above about 1.5; preparing a solution of dimethyl amine borane in a quantity in excess of that required to reduce the copper ions; and mixing the dimethyl amine borane solution with the previously mixed solutions to form a colloidal copper solution in the form of copper metal, hydrous copper oxides, or mixtures thereof, wherein the colloidal copper solution remains stable at a neutral pH.
Claim 16
Dependent Claim
25 words
The method of claim 12 which further comprises adding a small amount of ionic palladium to the colloidal copper solution to provide increased activating properties.
Claim 17
Independent Claim
102 words
A method for preparing a colloidal copper solution for activating non-conductive substrates prior to electroless metal deposition thereon which comprises: mixing a gelatin solution with a copper salt solution; adjusting the pH of the mixed solution with an acid to a range of between about 1.5 and about 4; and adding a solution of a reducing agent to the previously mixed solutions in a quantity in excess of that required to reduce the copper ions to copper metal to form a colloidal copper solution containing active colloidal copper comprising copper metal; wherein the colloidal copper solution remains stable at a neutral pH.
Claim 18
Independent Claim
102 words
A method for preparing a colloidal copper solution for activating non-conductive substrates prior to electroless metal deposition thereon which comprises: mixing a gelatin solution with a copper salt solution; adjusting the pH of the mixed solution with an acid to a range of between about 1.5 and about 4; and adding a solution of a reducing agent to the previously mixed solutions in a quantity in excess of that required to reduce the copper ions to copper metal to form a colloidal copper solution containing active colloidal copper comprising copper metal; wherein the colloidal copper solution remains stable at a neutral pH.
Claim 19
Dependent Claim
11 words
The colloidal copper solution produced by the method of claim 1.
Claim 20
Dependent Claim
11 words
The colloidal copper solution produced by the method of claim 12.
Claim 21
Dependent Claim
11 words
The colloidal copper solution produced by the method of claim 14.
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