US4675273A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Resists formed by vapor deposition of anionically polymerizable monomer
Assignee: Henkel Loctite Ireland Ltd
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Filing: 1986-02-10
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Granted: 1987-06-23
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Expires: 2006-02-10
Abstract
Abstract A method for applying a polymeric resist coating of very high molecular weight to a suitable substrate without the necessity of elaborate purification steps and for ensuring adequate coverage of raised regions in three-dimensionally patterned substrates. The method comprises exposing the substrate to be coated to the vapor of an anionically polymerizable monomer of the formula: CHR=CXY where X and Y are strong electron withdrawing groups and R si H or, provided that X and Y are both -CN, C1-C4 alkyl for sufficient time to deposit a polymerizable coating thereon. Particularly preferred monomers are 2-cyanoacrylate esters. The monomer condenses and polymerizes on the surface of the substrate to give a highly uniform high molecular weight polymeric coating which is useful as a resist coating in lithographic processes employing plasma or acid etch techniques.
Inventors
- 👤 John G. Woods
- 👤 John M. Rooney
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-26 01:17
CPC Classifications
G; G03; G03F; G03F7/00; G03F7/16; G03F7/167; G03F7/004; G03F7/26; G03F7/40
Claims Analysis
Total Claims: 23
Claim 1
Independent Claim
71 words
A method of providing a resist coating on an acid or plasma etchable substrate comprising exposing the substrate to the vapor of an anionically polymerizable monomer of the formula CHR═CXY where X and Y are strong electron withdrawing groups and R is H or, provided X and Y are both cyano groups, C 1 -C 4 alkyl, for sufficient time to deposit a polymerized coating of the monomer on the substrate.
Claim 2
Independent Claim
71 words
A method of providing a resist coating on an acid or plasma etchable substrate comprising exposing the substrate to the vapor of an anionically polymerizable monomer of the formula CHR═CXY where X and Y are strong electron withdrawing groups and R is H or, provided X and Y are both cyano groups, C 1 -C 4 alkyl, for sufficient time to deposit a polymerized coating of the monomer on the substrate.
Claim 3
Dependent Claim
80 words
A method as in claim 1 where the monomer is selected from 2-cyanoacrylate esters, vinylidene cyanide and its C 1 -C 4 alkyl homologs, dialkyl methylene malonates, acylacrylonitriles, and vinyl sulfinates or sulfonates of the formula CH 2 ═CXY where X is --SO 2 R 2 or SO 3 R 2 and Y is selected from --CN, --COOR 2 , --COCH 3 , --SO 2 R 2 or --SO 3 R 2 , and R 2 is H or hydrocarbyl.
Claim 4
Dependent Claim
12 words
A method as in claim 2 where the monomer is cyanoacrylate ester.
Claim 5
Dependent Claim
14 words
A method as in claim 3 where the monomer is ethyl or isobutyl cyanoacrylate.
Claim 6
Dependent Claim
14 words
A method as in claim 1 wherein the substrate is SiO 2 coated silicon.
Claim 7
Dependent Claim
32 words
A method as in claim 1 wherein the substrate has a surface activated to induce polymerization of the monomer by treatment with an initiator of anionic or zwitterionic polymerization of alkyl cyanoacrylates.
Claim 8
Dependent Claim
15 words
A method as in claim 6 wherein the initiator is an organic amine or phosphine.
Claim 9
Independent Claim
106 words
A method of providing an imagewise etched surface on a substrate etchable by plasma or acid etching techniques comprising: coating the surface of the substrate with a polymeric resist coating by exposing the substrate to the vapor of an anionically polymerizable monomer of the formula CHR═CXY where X and Y are strong electron withdrawing groups and R is H or, provided that X and Y are both cyano, C 1 -C 4 alkyl; imagewise exposing the substrate to deep UV or ionizing radiation; developing the image; etching the substrate; and removing the resist coating by heating the coating to a temperature above the polymer depolymerization temperature.
Claim 10
Independent Claim
106 words
A method of providing an imagewise etched surface on a substrate etchable by plasma or acid etching techniques comprising: coating the surface of the substrate with a polymeric resist coating by exposing the substrate to the vapor of an anionically polymerizable monomer of the formula CHR═CXY where X and Y are strong electron withdrawing groups and R is H or, provided that X and Y are both cyano, C 1 -C 4 alkyl; imagewise exposing the substrate to deep UV or ionizing radiation; developing the image; etching the substrate; and removing the resist coating by heating the coating to a temperature above the polymer depolymerization temperature.
Claim 11
Dependent Claim
16 words
A method as in claim 8 wherein the substrate is silicon coated with SiO 2 .
Claim 12
Dependent Claim
13 words
A method as in claim 8 where the monomer is a cyanoacrylate ester.
Claim 13
Dependent Claim
21 words
A method as in claim 8 where the monomer is vinylidene cyanide or a C 1 -C 4 alkyl homolog thereof.
Claim 14
Dependent Claim
13 words
A method as in claim 8 where the monomer is a dialkyl methylenemalonate.
Claim 15
Dependent Claim
31 words
A method as in claim 8 wherein the substrate surface is treated with an initiator of anionic zwitterionic polymerization of alkyl cyanoacrylates prior to exposing the substrate to the monomer vapor.
Claim 16
Dependent Claim
16 words
A method as in claim 13 wherein the anionic initiator is an organic amine or phosphine.
Claim 17
Dependent Claim
23 words
A method as in claim 10 wherein the substrate surface is selected from acid etchable metals, SiO 2 , glass and metalic oxides.
Claim 18
Dependent Claim
24 words
A method as in claim 10 wherein the resist coating removal step comprises heating the coating to a temperature between 150° and 200° C.
Claim 19
Dependent Claim
63 words
An article having a surface etchable by acid or plasma etching techniques and a polymeric resist coating over said etchable surface, the resist coating comprising a polymer formed by vapor deposition onto the etchable substrate surface of an anionically polymerizable monomer of the formula CH.sub.2 ═CXY where X and Y are strong electron withdrawing groups, for sufficient time to form said polymeric coating.
Claim 20
Dependent Claim
63 words
An article having a surface etchable by acid or plasma etching techniques and a polymeric resist coating over said etchable surface, the resist coating comprising a polymer formed by vapor deposition onto the etchable substrate surface of an anionically polymerizable monomer of the formula CH.sub.2 ═CXY where X and Y are strong electron withdrawing groups, for sufficient time to form said polymeric coating.
Claim 21
Dependent Claim
13 words
An article as in claim 17 wherein the monomer is a cyanoacrylate monomer.
Claim 22
Dependent Claim
17 words
An article as in claim 18 wherein the polymeric coating thickness is less than 0.1 micron thick.
Claim 23
Dependent Claim
15 words
An article as in claim 18 wherein the etchable substrate surface is SiO 2 .
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1990-06-22 | 1990-12-22 | 1991-06-23 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1994-06-22 | 1994-12-22 | 1995-06-23 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1998-06-22 | 1998-12-22 | 1999-06-23 | $7700.00 | Window Closed / Lapsed |