Patent US4657797A successfully refreshed from Google Patents.
US4657797A
Expired / Lapsed
US
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Substrate for a semiconductor chip package and a method of fabricating the same
Assignee: General Electric Co
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Filing: 1985-09-30
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Granted: 1987-04-14
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Expires: 2005-09-30
Abstract
Abstract A substrate for a semiconductor chip package comprises a metal layer characterized by a high coefficient of thermal conductivity and girded by a restraining wrapper characterized by both a low coefficient of thermal expansion and a high ultimate tensile strength.
Inventors
- 👤 Herman F. Nied
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 20:56
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W70/67; H10W70/68; H10W70/6875; Y; Y10; Y10S; Y10S428/00; Y10S428/901; Y10S428/902; Y10T; Y10T428/00; Y10T428/21; Y10T428/24; Y10T428/24777
Claims Analysis
Total Claims: 14
Claim 1
Independent Claim
71 words
A substrate for a semiconductor chip package comprising: a metal layer having a high coefficient of thermal conductivity and including a substantially flat surface for bonding to a semiconductor chip; a restraining wrapper girding the peripheral edge of said metal layer and comprising a material having both a low coefficient of thermal expansion and a high ultimate tensile strength; and said restraining wrapper comprising carbon fiber-epoxy composite or boron fiber-epoxy composite.
Claim 2
Dependent Claim
71 words
A substrate for a semiconductor chip package comprising: a metal layer having a high coefficient of thermal conductivity and including a substantially flat surface for bonding to a semiconductor chip; a restraining wrapper girding the peripheral edge of said metal layer and comprising a material having both a low coefficient of thermal expansion and a high ultimate tensile strength; and said restraining wrapper comprising carbon fiber-epoxy composite or boron fiber-epoxy composite.
Claim 3
Dependent Claim
18 words
The substrate of claim 1 wherein: said metal layer is generally circular; and said restraining wrapper is annular.
Claim 4
Dependent Claim
15 words
The substrate of claim 1 wherein said metal layer comprises copper (Cu) or silver (Ag).
Claim 5
Dependent Claim
29 words
The substrate of claim 1 wherein: said metal layer comprises copper (Cu) or silver (Ag); and said restraining wrapper comprises a carbon fiber-epoxy composite or a boron fiber-epoxy composite.
Claim 6
Dependent Claim
75 words
A semiconductor chip package comprising: a metal layer having a high coefficient of thermal conductivity and including a substantially flat surface; a restraining wrapper girding the peripheral edge of said metal layer and comprising a material having both a low coefficient of thermal expansion and a high ultimate tensile strength; a layer of solder on said flat metal layer surface; and a semiconductor chip bonded to said flat metal layer surface by said solder layer.
Claim 7
Dependent Claim
75 words
A semiconductor chip package comprising: a metal layer having a high coefficient of thermal conductivity and including a substantially flat surface; a restraining wrapper girding the peripheral edge of said metal layer and comprising a material having both a low coefficient of thermal expansion and a high ultimate tensile strength; a layer of solder on said flat metal layer surface; and a semiconductor chip bonded to said flat metal layer surface by said solder layer.
Claim 8
Dependent Claim
41 words
The semiconductor chip package of claim 5 wherein: said metal layer comprises copper (Cu) or silver (Ag); said restraining wrapper comrpises a carbon fiber-epoxy composite or a boron fiber-epoxy composite; and said semiconductor chip comprises silicon (Si) or gallium arsenide (GaAs).
Claim 9
Dependent Claim
20 words
The semiconductor chip package of claim 5 wherein: said metal layer is generally circular; and said restraining wrapper is annular.
Claim 10
Dependent Claim
25 words
The semiconductor chip package of claim 5 wherein said restraining wrapper includes holes extending there through for securing said semiconductor package to an external mount.
Claim 11
Dependent Claim
17 words
The semiconductor chip package of claim 5 wherein said metal layer comprises copper (Cu) or silver (Ag).
Claim 12
Dependent Claim
19 words
The semiconductor chip package of claim 5 wherein said restraining wrapper comprises carbon fiber-epoxy composite or boron fiber-epoxy composite.
Claim 13
Dependent Claim
18 words
The semiconductor chip package of claim 5 wherein said semiconductor chip comprises silicon (Si) or gallium arsenide (GaAs).
Claim 14
Dependent Claim
16 words
The semiconductor chip package of claim 5 wherein said layer of solder comprises a soft solder.
References Cited (Backward Citations)
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1990-04-13 | 1990-10-13 | 1991-04-14 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1994-04-13 | 1994-10-13 | 1995-04-14 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1998-04-13 | 1998-10-13 | 1999-04-14 | $7700.00 | Window Closed / Lapsed |