Patent US4609586A successfully refreshed from Google Patents.
US4609586A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Thermally conductive printed wiring board laminate
Assignee: Boeing Co
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Filing: 1984-08-02
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Granted: 1986-09-02
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Expires: 2004-08-02
Abstract
Abstract A printed wiring board laminate is disclosed that is particularly suitable for use with leadless surface mounted devices such as ceramic chip carries. The laminate combines a low coefficient of thermal expansion in the X-Y direction with thermal conductivity. In one embodiment, the laminate comprises a support fabricated from graphite fiber reinforced metal adhesively secured to a printed wiring board fabricated from dielectric (e.g., glass) fiber reinforced resin. The support has an X-Y coefficient of thermal expansion less than about 4 ppm/°C., and the printed wiring board has a coefficient of thermal expansion greater than about 10 ppm/°C. In a second embodiment, the support comprises a core of graphite fiber reinforced metal or resin sandwiched between two metal sheets.
Inventors
- 👤 Warren M. Jensen
- 👤 William C. Wilkinson
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-30 11:29
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/46; H05K3/4611; H05K3/4641; H05K1/00; H05K1/02; H05K1/03; H05K1/05; H05K1/056; H05K2201/00; H05K2201/03; H05K2201/032; H05K2201/0323; H05K3/0058; H05K3/38; H05K3/386; H05K3/40; H05K3/42; H05K3/429; H05K3/44; H05K3/445; Y; Y10; Y10S; Y10S428/00; Y10S428/901; Y10T; Y10T428/00; Y10T428/12; Y10T428/12486; Y10T428/24; Y10T428/24802; Y10T428/24917; Y10T428/249921; Y10T428/249924; Y10T428/249927; Y10T428/30; Y10T428/31504; Y10T428/31511; Y10T428/31529
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
139 words
A printed wiring board laminate adapted for use with a ceramic chip carrier, the printed wiring board laminate comprising: an electrically conductive support comprising a metal matrix reinforced by graphite fiber, the support having a coefficient of thermal expansion parallel to the surface of the laminate of less than about 4 parts per million/°C.; and a printed wiring board comprising dielectric fiber reinforced resin, the printed wiring board being secured to the support by means of an adhesive and having a coefficient of thermal expansion greater than about 10 parts per million/°C.; whereby the apparent coefficient of thermal expansion of the laminate parallel to the surface of the laminate approximates the coefficient of thermal expansion of a ceramic chip carrier, and whereby heat generated by components mounted to the printed wiring board may be conducted away by the support.
Claim 2
Dependent Claim
139 words
A printed wiring board laminate adapted for use with a ceramic chip carrier, the printed wiring board laminate comprising: an electrically conductive support comprising a metal matrix reinforced by graphite fiber, the support having a coefficient of thermal expansion parallel to the surface of the laminate of less than about 4 parts per million/°C.; and a printed wiring board comprising dielectric fiber reinforced resin, the printed wiring board being secured to the support by means of an adhesive and having a coefficient of thermal expansion greater than about 10 parts per million/°C.; whereby the apparent coefficient of thermal expansion of the laminate parallel to the surface of the laminate approximates the coefficient of thermal expansion of a ceramic chip carrier, and whereby heat generated by components mounted to the printed wiring board may be conducted away by the support.
Claim 3
Dependent Claim
19 words
The laminate of claim 1, wherein the metal is selected from the group consisting of aluminum, magnesium and copper.
Claim 4
Dependent Claim
10 words
The laminate of claim 1, wherein the metal is aluminum.
Claim 5
Dependent Claim
15 words
The laminate of claim 1, wherein the support consists of 40%-60% by volume graphite fiber.
Claim 6
Dependent Claim
55 words
The laminate of claim 1, wherein the graphite fiber comprises a first set of graphite fibers extending in a first direction parallel to the surface of the laminate, and a second set of graphite fibers extending in a second direction parallel to the surface of the laminate and inclined with respect to the first direction.
Claim 7
Dependent Claim
148 words
A printed wiring board laminate adapted for use with a ceramic chip carrier, the printed wiring board laminate comprising: an electrically conductive support comprising a core positioned between two metal sheets, the core comprising a matrix reinforced by graphite fiber, the support having a coefficient of thermal expansion parallel to the surface of the laminate of less than about 4 parts per million/°C.; and a printed wiring board comprising dielectric fiber reinforced resin, the printed wiring board being secured to the support by means of an adhesive and having a coefficient of thermal expansion greater than about 10 parts per million/°C.; whereby the apparent coefficient of thermal expansion of the laminate parallel to the surface of the laminate approximates the coefficient of thermal expansion of a ceramic chip carrier, and whereby heat generated by components mounted to the printed wiring board may be conducted away by the support.
Claim 8
Dependent Claim
148 words
A printed wiring board laminate adapted for use with a ceramic chip carrier, the printed wiring board laminate comprising: an electrically conductive support comprising a core positioned between two metal sheets, the core comprising a matrix reinforced by graphite fiber, the support having a coefficient of thermal expansion parallel to the surface of the laminate of less than about 4 parts per million/°C.; and a printed wiring board comprising dielectric fiber reinforced resin, the printed wiring board being secured to the support by means of an adhesive and having a coefficient of thermal expansion greater than about 10 parts per million/°C.; whereby the apparent coefficient of thermal expansion of the laminate parallel to the surface of the laminate approximates the coefficient of thermal expansion of a ceramic chip carrier, and whereby heat generated by components mounted to the printed wiring board may be conducted away by the support.
Claim 9
Dependent Claim
11 words
The laminate of claim 6, wherein the matrix comprises a resin.
Claim 10
Dependent Claim
11 words
The laminate of claim 6, wherein the matrix comprises a metal.
Claim 11
Dependent Claim
12 words
The laminate of claim 6, wherein the metal sheets comprise copper sheets.
Claim 12
Dependent Claim
15 words
The laminate of claim 6, wherein the core consists of 40%-60% by volume graphite fiber.
Claim 13
Dependent Claim
55 words
The laminate of claim 6, wherein the graphite fiber comprises a first set of graphite fibers extending in a first direction parallel to the surface of the laminate, and a second set of graphite fibers extending in a second direction parallel to the surface of the laminate and inclined with respect to the first direction.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1989-09-01 | 1990-03-03 | 1990-09-02 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1993-09-01 | 1994-03-03 | 1994-09-02 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1997-09-01 | 1998-03-03 | 1998-09-02 | $7700.00 | Window Closed / Lapsed |