Metal-clad dielectric sheeting

Claim 2

Metal-clad dielectric sheeting useful in the manufacture of printed circuitry comprising a nonwoven web and an electrically conductive metallic layer adhered to at least one side of the web; said web comprising at least 10 pounds per ream of a fiber blend that comprises high-tensile-strength and heat-resistant discontinuous fibers compacted and held together with a matrix of film-forming polymeric binder material that accounts for 5 to 75 weight-percent of the web; substantially all of said fibers having a softening point above 450° F.; at least 5 weight-percent of the fibers resisting distortion when exposed for 10 seconds to a molten solder bath heated to 500° F., at least 30 weight-percent of the fibers exhibiting a tensile elongation of at least 20 percent and a tenacity of at least 3.5 grams/denier, and at least 40 weight-percent of the fibers exhibiting a moisture regain of less than about 3 weight-percent; and the polymeric binder material being solid and nontacky at room temperature, at least initially softening and flowing slightly under the heat and pressure of the compacting operation, and in film form being foldable upon itself without cracking and resisting distortion when heated for 10 seconds on a molten solder bath heated to 500° F.; and the metal-clad dielectric sheeting exhibiting no more than a 2 mil/inch change in dimensions upon etch-removal of part or all of the electrically conductive layer, and exhibiting no more than a 10 mil/inch change in dimensions and substantially no blistering when exposed for 10 seconds to a molten solder bath heated to 450° F.

Claim 3

Sheeting of claim 1 in which between 30 and 95 weight-percent of the fiber blend is drawn polyester fibers, between 5 and 60 weight-percent of the fiber blend is aromatic polyamide fibers that resist distortion when exposed for 10 seconds to a molten solder bath heated to 500° F., and up to 70 weight-percent of the fiber blend is acrylic fibers that resist distortion when exposed for 10 seconds to a molten solder bath heated to 500° F.

Claim 4

Sheeting of claim 2 in which said aromatic polyamide fibers comprise poly(p-phenylene terephthalamide) fibers.

Claim 5

Sheeting of claim 2 in which about 80 weight-percent of the fiber blend is said drawn polyester fibers and about 20 weight-percent of the fiber blend is said aromatic polyamide staple fibers.

Claim 6

Sheeting of claim 1 in which said polymeric binder material comprises an acrylic-based binder material.

Claim 7

Sheeting of claim 1 in which said polymeric binder material is crosslinked.

Claim 8

Sheeting of claim 1 in which the conductive layer comprises copper.

Claim 9

Sheeting of claim 1 in which the electrically conductive layer is smaller in area than the nonwoven web.

Claim 10

Sheeting of claim 8 in combination with electrical components that are electrically connected to the electrically conductive layer.

Claim 11

Metal-clad dielectric sheeting useful in the manufacture of printed circuitry comprising a nonwoven web that is less than about 20 mils in thickness and is at least as flexible as a 10-mil-thick biaxially oriented polyethylene terephthalate film and an electrically conductive metallic layer adhered to at least one side of the web; said web comprising at least 10 pounds per ream of a fiber blend that comprises high-tensile-strength and heat-resistant discontinuous fibers compacted and held together with a matrix of film-forming crosslinked polymeric binder material that accounts for 5 to 75 weight-percent of the web; substantially all of said fibers having a softening point above 450° F.; between 30 and 95 weight-percent of the fibers being drawn polyester fibers, between 5 and 60 weight-percent of the fibers being aromatic polyamide staple fibers, and up to 70 weight-percent of the fiber blend being acrylic fibers; both the aromatic and acrylic fibers resisting distortion when exposed for 10 seconds to a molten solder bath heated to 500° F., and the polymeric binder material being solid and nontacky at room temperature, at least initially softening and flowing slightly under the heat and pressure of the compacting operation, and in film form being foldable upon itself without cracking and resisting distortion when heated for 10 seconds on a molten solder bath heated to 500° F.; and the metal-clad dielectric sheeting exhibiting no more than a 2 mil/inch change in dimensions upon etch-removal of part or all of the electrically conductive layer, and exhibiting no more than a 10 mil/inch change in dimensions and substantially no blistering when exposed for 10 seconds to a molten solder bath heated to 450° F.

Claim 12

Metal-clad dielectric sheeting useful in the manufacture of printed circuitry comprising a nonwoven web that is less than about 20 mils in thickness and is at least as flexible as a 10-mil-thick biaxially oriented polyethylene terephthalate film and an electrically conductive metallic layer adhered to at least one side of the web; said web comprising at least 10 pounds per ream of a fiber blend that comprises high-tensile-strength and heat-resistant discontinuous fibers compacted and held together with a matrix of film-forming crosslinked polymeric binder material that accounts for 5 to 75 weight-percent of the web; substantially all of said fibers having a softening point above 450° F.; between 30 and 95 weight-percent of the fibers being drawn polyester fibers, between 5 and 60 weight-percent of the fibers being aromatic polyamide staple fibers, and up to 70 weight-percent of the fiber blend being acrylic fibers; both the aromatic and acrylic fibers resisting distortion when exposed for 10 seconds to a molten solder bath heated to 500° F., and the polymeric binder material being solid and nontacky at room temperature, at least initially softening and flowing slightly under the heat and pressure of the compacting operation, and in film form being foldable upon itself without cracking and resisting distortion when heated for 10 seconds on a molten solder bath heated to 500° F.; and the metal-clad dielectric sheeting exhibiting no more than a 2 mil/inch change in dimensions upon etch-removal of part or all of the electrically conductive layer, and exhibiting no more than a 10 mil/inch change in dimensions and substantially no blistering when exposed for 10 seconds to a molten solder bath heated to 450° F.

Claim 13

Sheeting of claim 10 in which said aromatic polyamide fibers comprise poly (p-phenylene terephthalamide) fibers.

Claim 14

Sheeting of claim 10 in which said polymeric binder material comprises an acrylic-based binder material.

Claim 15

Sheeting of claim 11 in which the binder material is an acrylic-based material.

Claim 16

Sheeting of claim 10 in which about 80 weight-percent of the fiber blend is drawn polyester fibers and about 20 weight-percent of the fiber blend is aromatic polyamide fibers.

Claim 17

Sheeting of claim 10 in combination with electrical components that are electrically connected to the electrically conductive layer.

Claim 18

A nonwoven web useful as a dielectric backing for flexible printed circuitry comprising a fiber blend that comprises high-tensile-strength and heat-resistant discontinuous staple fibers that substantially all have a softening point above 450° F. compacted and held together with a crosslinked film-forming polymeric binder material; the fibers being present in an amount of at least 10 pounds per ream and the binder material being present in an amount of 5 to 75 weight-percent of the web; between 30 and 95 weight-percent of the fiber blend being drawn polyester fibers, between 5 and 60 weight-percent of the fiber blend being aromatic polyamide staple fibers, and up to 70 weight-percent of the fiber blend being acrylic fibers; both the aromatic polyamide and acrylic fibers resisting distortion when exposed for 10 seconds to a molten solder bath heated to 500° F.; the polymeric binder material being solid and nontacky at room temperature, at least initially softening and flowing slightly under the heat and pressure of the compacting operation, and in film form being foldable upon itself without cracking and resisting distortion when heated for 10 seconds in a molten solder bath heated to 500° F.; and the web upon lamination to an electrically conductive metallic layer forming a metal-clad dielectric sheeting that exhibits less than a 2 mil/inch change in dimensions upon etch-removal of part or all of the electrically conductive layer, and less than a 10 mil/inch change in dimensions and substantially no blistering when exposed for 10 seconds to a molten solder bath heated to 450° F.

Claim 19

A nonwoven web useful as a dielectric backing for flexible printed circuitry comprising a fiber blend that comprises high-tensile-strength and heat-resistant discontinuous staple fibers that substantially all have a softening point above 450° F. compacted and held together with a crosslinked film-forming polymeric binder material; the fibers being present in an amount of at least 10 pounds per ream and the binder material being present in an amount of 5 to 75 weight-percent of the web; between 30 and 95 weight-percent of the fiber blend being drawn polyester fibers, between 5 and 60 weight-percent of the fiber blend being aromatic polyamide staple fibers, and up to 70 weight-percent of the fiber blend being acrylic fibers; both the aromatic polyamide and acrylic fibers resisting distortion when exposed for 10 seconds to a molten solder bath heated to 500° F.; the polymeric binder material being solid and nontacky at room temperature, at least initially softening and flowing slightly under the heat and pressure of the compacting operation, and in film form being foldable upon itself without cracking and resisting distortion when heated for 10 seconds in a molten solder bath heated to 500° F.; and the web upon lamination to an electrically conductive metallic layer forming a metal-clad dielectric sheeting that exhibits less than a 2 mil/inch change in dimensions upon etch-removal of part or all of the electrically conductive layer, and less than a 10 mil/inch change in dimensions and substantially no blistering when exposed for 10 seconds to a molten solder bath heated to 450° F.